CN100474335C - 射频识别标签 - Google Patents
射频识别标签 Download PDFInfo
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- CN100474335C CN100474335C CNB2005101076831A CN200510107683A CN100474335C CN 100474335 C CN100474335 C CN 100474335C CN B2005101076831 A CNB2005101076831 A CN B2005101076831A CN 200510107683 A CN200510107683 A CN 200510107683A CN 100474335 C CN100474335 C CN 100474335C
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- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
- G06K19/07381—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering
- G06K19/0739—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering the incapacitated circuit being part of an antenna
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- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
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- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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Abstract
本发明涉及一种射频识别(RFID)标签,该RFID标签具有检测剥落的功能同时能保持良好的天线特性。第一导电图形包括从电路芯片延伸的两个延伸部分和校正图形,该延伸部分的每一端连接至电路芯片,该校正图形用于校正天线特性,并绕过电路芯片而与这两个延伸部分连接,以及剥落检测图形形成在这两个延伸部分和校正图形所包围的区域内。
Description
技术领域
本发明涉及一种RFID(射频识别)标签,其以非接触方式与外部装置交换信息。注意,在本申请的技术领域的技术人员中,本说明书中使用的“RFID标签”被认为是RFID标签的内部元件(嵌入物),因此其也可称为“RFID标签的嵌入物”。或者这种“RFID标签”可以称为“射频IC标签”。另外,这种“RFID标签”也包括非接触型IC卡。
背景技术
近年来,已提出各种以非接触方式通过射频与外部装置交换信息的RFID标签,其中以读/写机为代表。作为这样一种RFID标签,建议提出具有这样一种结构的RFID标签,其中射频波通信天线图形和IC芯片安装在由塑料或纸制成的基片上,并且这种类型的RFID标签设计为按这样一种方式使用,即RFID标签粘贴到一个物品上,从而有关该物品的信息与外部装置交换,由此得以识别出该物品。
图1为示出RFID标签的实例的平面图。该图示出去掉封皮薄片等之后的状态。
在此RFID标签10中,天线图形12形成在基片11上,并且IC芯片13置于该天线图形12上。该天线图形12是作为偶极天线工作的导电图形,该偶极天线由从IC芯片13侧向延伸的两个单极图形121、122构成,单极图形121、122的IC芯片13侧的各端电连接至IC芯片13。此外,该天线图形12设有校正图形123,用于天线特性的校正,校正图形123绕过IC芯片13而与天线图形12的两个延伸部分(该两个延伸部分对应于图1所示的结构中的两个单极图形121、122)连接,延伸部分的一端连接至IC芯片13。利用天线图形12作为天线来与外部装置进行射频通信的电路内内置IC芯片13中。
图2示出IC芯片13与天线图形12之间的连接结构。
通过凸块14将IC芯片13与天线图形12以倒装芯片的方式连接,并且凸块14的周围由黏合剂15固定。
这里,当将IC芯片13与天线图形12以倒装芯片的方式连接时,在图2所示的区域D中天线图形12的各端与IC芯片13互相垂直重叠,这会在这些部分中产生寄生电容C。如果不采取措施,这种寄生电容C会对天线特性(射频通信特性)产生不利影响。图1中所示的校正图形123是作为消除这种寄生电容C的影响的电感L使用。
RFID标签10具有图1、图2所示的结构,并且天线图形12与IC芯片13还用封皮薄片覆盖。
在这种RFID标签使用方式中,有可能发生篡改,即,贴在一个物品上的RFID标签被剥掉而重新贴到另一个物品上,导致外部装置错误地识别该物品,使得价格昂贵的物品被作为便宜的物品购买走,所以需要一种能够避免这种篡改的技术。
鉴于这种状态,提出一种破坏被剥掉的RFID标签的天线图形的技术,以便使其不能进行通信(例如,参见美国未审公开专利No.2003/0756708,美国专利No.6421013,国际专利申请的国家公开No.2003-524811)。
图3为具有已经参照图1、图2解释过的基本结构以及增加的检测剥落功能的RFID标签的一个示例的平面图。在图3中也去掉了诸如封皮薄片之类的封皮。
在图3中所示的RFID标签10中,如同图1中的情况,由单极图形121、122构成的天线图形12作为偶极天线形成在基片11上,并且IC芯片13以倒装芯片的方式连接到这两个单极图形121、122上。此外,此天线图形12设有校正图形123,该校正图形123绕过IC芯片13而与单极图形121、122连接。
到此为止的说明均与对图1中所示的RFID标签的说明相似,但是在图3所示的RFID标签10的情况下,在基片11上另外形成围绕天线图形12的回路剥落检测图形16。以类似于天线图形12与IC芯片13之间的连接结构(参见图2)的结构,剥落检测图形16的回路两端也连接至IC芯片13,从而此IC芯片13不仅具有利用天线图形12与外部装置进行射频通信的功能,而且具有检测剥落检测图形16是否被破坏的功能。这里,剥落检测图形16由导电的、相对易碎的和易破坏的材料例如银膏等制成。剥落检测图形16设有在回路的几个位置处的剥落检测点161。
在图3中所示的RFID标签10的情况下,除了天线图形12与IC芯片13以外,剥落检测图形16也被封皮薄片覆盖。剥落检测图形16的剥落检测点161牢固地粘贴到封皮薄片上,同时剥落检测图形16的剥落检测点161以外的部分与基片11的粘贴比与封皮薄片的粘贴更加牢固。因此,当试图剥掉封皮薄片时,该封皮薄片在只有剥落检测图形16的剥落检测点161保持粘贴到其上的状态下被剥掉,这样,剥落检测图形16受到破坏,从而IC芯片13检测到剥落检测图形16受到破坏的情况。这就防止了对RFID标签10的篡改。
然而,在图3中所示的RFID标签10的情况下,剥落检测图形16围绕天线图形12,且此剥落检测图形16也由导体制成,这就会对天线图形12的天线特性产生不利的影响,与不存在剥落检测图形16的情况(参见图1)相比大大地衰减了从天线图形12发射出的射频电波,导致射频电波的范围(可以进行射频通信的距离)大大减小。
发明内容
鉴于上述背景提出本发明,即提供一种在保持良好的天线特性的同时可以检测剥落情况的RFID标签。
根据本发明的RFID标签设有:
基片;
第一导电图形,设置在该基片上作为通信天线使用;第二导电图形,设置在该基片上用于检测剥落,当从该基片剥掉该第二导电图形时,该第二导电图形被损坏;
电路芯片,电连接至第一导电图形和第二导电图形,其利用第一导电图形作为天线进行射频通信,并检测第二导电图形是否被破坏;
封皮,覆盖第一导电图形、第二导电图形和电路芯片,其以可拆下的方式粘贴到基片上,并且在第二导电图形的全部或部分保持粘贴在其上的状态下被从基片上剥掉,
其中,第一导电图形包括从电路芯片延伸的两个延伸部分和用于校正天线特性的校正图形,该延伸部分的每一端连接到电路芯片,该校正图形绕过电路芯片而与这两个延伸部分连接,以及
第二导电图形形成在由两个延伸部分和校正图形所包围的区域内。
由于用于检测剥落的第二导电图形形成在由两个延伸部分和校正图形所包围的区域内,本发明的RFID标签基本上不会对天线特性产生影响,能够保持良好的天线特性以及能检测剥落情况。
这里,本发明的RFID标签的校正图形是电感,该电感可以消除在电路芯片与连接至电路芯片的第一导电图形的各端之间产生的寄生电容C。
此外,本发明的RFID标签的第一导电图形可以包括回路天线的图形,该回路天线的图形两端连接至电路芯片,或者该第一导电图形可以包括由两个单极图形构成的偶极天线的图形,每个单极图形的一端连接到电路芯片。
此外,本发明的RFID标签的第二导电图形优选为回路图形,该回路图形的两端连接到电路芯片,并在第二导电图形的回路上的几个位置处具有剥落检测点,在将封皮从基片上剥落时,所述剥落检测点保持粘贴在封皮薄片上时与其一起剥落。
以这种方式,在多个位置处设置剥落检测点提高了剥落检测的可靠性。
本发明使得将要安装的RFID标签具有剥落检测功能,同时又能保持良好的天线特性。
附图说明
图1为RFID标签的一个示例的平面图;
图2示出IC芯片与天线图形之间的连接结构;
图3为具有已经参照图1、图2解释过的基本结构以及增加了检测剥落功能的RFID标签的一个示例的平面图;
图4为作为本发明一个实施例的RFID标签的平面图;
图5为该实施例的RFID标签的剥落检测图形的局部放大图;
图6为该实施例的RFID标签的剥落检测图形的局部放大图;
图7为该实施例的RFID标签的剥落检测图形的局部放大图;
图8为根据本发明第二实施例的RFID标签的平面图;
图9为图8的环R所包围的部分的放大图。
具体实施方式
本发明的实施例将说明如下。
图4为作为本发明一个实施例的RFID标签的平面图。在图4中,也去掉了诸如封皮薄片之类的封皮。
图4中所示的RFID标签10包括:作为由单极图形121、122构成的偶极天线的天线图形12,,其形成在基片11上;IC芯片13通过倒装芯片连接在这两个单极图形121、122的各端部(参见图2)。此外,该天线图形12包括校正图形123,其绕过IC芯片13而与单极图形121、122连接。
该校正图形123作为消除参照图2说明的寄生电容C的电感L使用。
此外,图4中所示的RFID标签10包括回路剥落检测图形16,其位于基片11上由两个单极图形121、122和校正图形123包围的区域内,且由相对易碎的导电材料的例如银膏制成。
此剥落检测图形16回路的两端也以倒装芯片的方式连接到IC芯片13,上述连接结构与图2的天线图形12与IC芯片13的连接结构相同,并且此IC芯片13不仅具有利用天线图形12与外部装置进行射频通信的功能,而且具有检测剥落检测图形16是否被损坏的功能。此剥落检测图形16在回路的多个位置处具有剥落检测点161。
在图4中所示的RFID标签10的情况下,天线图形12、IC芯片13以及剥落检测图形16均被封皮薄片覆盖。剥落检测图形16的剥落检测点161牢固地粘贴到封皮薄片上,而剥落检测图形16的剥落检测点161以外的部分与基片11的粘贴比与封皮薄片的粘贴更牢固。因此,当试图剥掉封皮薄片时,该封皮薄片仅在剥落检测图形16的剥落检测点161保持粘贴到封皮薄片上的状态下被剥落,这样,剥落检测图形16受到破坏,并且IC芯片13检测到剥落检测图形16受到破坏的情况,从而这就防止了对RFID标签10的篡改。
图4中所示的剥落检测图形16形成在由两个单极图形121、122构成的导电图形和校正图形123包围的区域内,因此,对天线特性例如利用天线图形12进行射频通信的范围几乎没有影响,并且不需要为剥落检测图形16增加天线的外侧尺寸。
图5至图7根据此实施例的RFID标签的剥落检测图形的一些部分的放大图。这里,图5示出刚刚制造好的状态,图6示出标签被贴到物体上的状态,图7示出标签被从物体上剥落的状态。
图5中所示的RFID标签10是已参照图4说明过的RFID标签10,其通过倒装芯片的方式由基片11、形成在基片11上的天线图形12、剥落检测图形16(未在图5至图7中示出)、以及与天线图形12和剥落检测图形16相连接的IC芯片13构成。在图5至图7中,省略了对剥落检测图形16与IC芯片13之间的连接结构的说明。
基片11通过黏合剂31粘贴到底座20上,基片11、天线图形12、剥落检测图形16(未示出)以及IC芯片13由不透明墨水制成的覆盖层32覆盖,再由封皮薄片17覆盖。封皮薄片17和覆盖层32的结构类似于所谓的防伪标签的结构。覆盖层32构造为在封皮薄片17被剥落时很容易分成多个剥落部分32a,这些剥落部分32a保持粘贴在封皮薄片17上与封皮薄片17一起被剥落,而与封皮薄片17分离的多个保留部分32b则保持粘贴在基片11或粘贴对象40(参见图6)侧。
此外,具有很强黏着力的黏合剂33也埋置在覆盖层32的对应于剥落检测图形16的剥落检测点161的部分,从而剥落检测图形16的剥落检测点161通过此黏合剂33牢固地粘贴到封皮薄片17上。
这里,图5中所示的底座20是一种对基片11的背面上的黏合剂31和覆盖层32的具有较低黏合性从而易于与之分离的材料,并且在RFID投入实际使用时,该RFID标签10从底座20上剥落,如图6所示通过粘贴到如纸板或塑料的粘贴对象40上实际使用。
一旦如图6所示粘贴到粘贴目标40上,在基片11的背面上的黏合剂31和覆盖层32的以镶嵌形状排列的保留部分32b具有对粘贴目标40的预定的黏合力,在RFID标签10粘贴到粘贴对象40上后,如果将RFID标签10从粘贴对象40上剥落,如图7所示,覆盖层32的剥落部分32a和保留部分32b被一个比将基片11贴到粘贴对象40上的黏合剂31的力弱的力分开。此时,剥落检测图形16的剥落检测点161被强黏合剂31牢固地粘贴封皮薄片17上,因此剥落检测点161在保持粘贴到封皮薄片17上的状态下被从剥落检测图形16上剥落,这就破坏了剥落检测图形16并使剥落检测图形16不能导电,从而IC芯片13检测到剥落检测图形16不能导电的事实,并执行事先已编入的防止非法剥落的处理。
此外,由于覆盖层32被剥成补丁图案,一眼就可从外观上确认被剥落。
图8为根据本发明第二实施例的RFID标签的平面图。所示出的RFID标签也去掉了诸如封皮薄片之类的封皮。
图8中所示的RFID标签10的天线图形12,是形成在基片11上的回路天线的导电图形,其两端以倒装芯片的方式连接至IC芯片13(参见图2)。此外,形成回路天线的天线图形12包括:从IC芯片13延伸的两个延伸部分12a、12b,其每一端连接到IC芯片13;以及绕过IC芯片13而与这两个延伸部分12a、12b连接的校正图形123。在图8中所示的实施例的情况下,校正图形123包括双图形,即图形123a和图形123b。这是因为在IC芯片13与天线图形12的各端之间的寄生电容C(已参照图2说明过)随所制造的许多RFID标签的各种误差因素而波动,对于每个RFID标签图形去掉123a或图形123b,以此方式,可以根据RFID标签的寄生电容C来调节校正图形123电感L。
此外,由银膏等制成的回路剥落检测图形16形成在基片11上由天线图形12的两个延伸部分12a、12b和校正图形123包围的区域内。IC芯片13中包含有利用回路天线的天线图形12进行射频通信的电路,并根据导电状态和非导电状态(剥落检测)检测剥落检测图形16的变化。
图9为图8的环R所包围的部分的放大图。
连接至IC芯片13的天线图形12的各端的宽度形成得很小。这是为了尽可能地减少在这部分中产生的寄生电容C。
此外,剥落检测图形16具有在回路的多个位置处的剥落检测点161。这些剥落检测点161牢固地粘贴到封皮薄片上(未示出),如已参照图5至图7说明的那样,当剥落封皮薄片时,这些剥落检测点161保持粘贴在封皮薄片上一起被剥落,这就破坏了剥落检测图形16并使剥落检测图形16不能导电,从而IC芯片13检测到剥落。
由于剥落检测图形16是在天线图形12的两个延伸部分12a、12b和校正图形123包围的区域内形成,可在不使天线图形12的天线特性恶化的情况下,能可靠检测剥落。
如上所述,无论天线图形的形状如何,本发明都是可适用的。
Claims (5)
1.一种RFID标签,包括:
基片;
第一导电图形,其设置在该基片上,作为通信天线使用;
第二导电图形,其设置在该基片上用于检测剥落,当从该基片剥落该第二导电图形时,该第二导电图形被损坏;
电路芯片,其电连接至第一导电图形和第二导电图形,该芯片利用第一导电图形作为天线进行射频通信,并检测第二导电图形的破坏;
封皮,其覆盖第一导电图形、第二导电图形和电路芯片;该封皮以可拆卸的方式粘贴到基片上,并且该封皮在第二导电图形的全部或部分保持粘贴在该封皮上的状态下被从基片上剥落;
其中,第一导电图形包括从电路芯片延伸的两个延伸部分和用于校正天线特性的校正图形,该延伸部分的每一端连接至电路芯片,该校正图形绕过电路芯片而与这两个延伸部分连接,以及
第二导电图形形成在由两个延伸部分和校正图形所包围的区域内。
2.如权利要求1所述的RFID标签,其中,第一导电图形包括回路天线的图形,该回路天线的两端连接到电路芯片。
3.如权利要求1所述的RFID标签,其中,第一导电图形包括偶极天线的图形,该偶极天线由两个单极图形构成,单极图形的每一端部连接至电路芯片。
4.如权利要求1所述的RFID标签,其中,校正图形是电感,其用于消除在电路芯片与连接至电路芯片的第一导电图形各端之间产生的寄生电容。
5.如权利要求1所述的RFID标签,其中,第二导电图形是回路图形,该回路图形的两端连接至电路芯片,并在第二导电图形的回路上的多个位置上设有多个剥落检测点,当封皮被从基片剥落时,所述剥落检测点在保持粘贴到封皮上时被剥落。
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-
2005
- 2005-04-05 JP JP2005108675A patent/JP4750450B2/ja not_active Expired - Fee Related
- 2005-09-07 EP EP05255481A patent/EP1710734A3/en not_active Withdrawn
- 2005-09-09 TW TW094131119A patent/TWI301947B/zh not_active IP Right Cessation
- 2005-09-22 US US11/232,035 patent/US7277017B2/en not_active Expired - Fee Related
- 2005-09-29 CN CNB2005101076831A patent/CN100474335C/zh not_active Expired - Fee Related
- 2005-09-30 KR KR1020050092537A patent/KR100686573B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200636594A (en) | 2006-10-16 |
EP1710734A3 (en) | 2011-06-29 |
KR100686573B1 (ko) | 2007-02-26 |
CN1848143A (zh) | 2006-10-18 |
JP4750450B2 (ja) | 2011-08-17 |
JP2006285911A (ja) | 2006-10-19 |
EP1710734A2 (en) | 2006-10-11 |
KR20060106597A (ko) | 2006-10-12 |
TWI301947B (en) | 2008-10-11 |
US20060220871A1 (en) | 2006-10-05 |
US7277017B2 (en) | 2007-10-02 |
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