CN100466235C - 包括两个设置在公用夹具中的半导体管芯的半导体封装 - Google Patents
包括两个设置在公用夹具中的半导体管芯的半导体封装 Download PDFInfo
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- CN100466235C CN100466235C CNB028269438A CN02826943A CN100466235C CN 100466235 C CN100466235 C CN 100466235C CN B028269438 A CNB028269438 A CN B028269438A CN 02826943 A CN02826943 A CN 02826943A CN 100466235 C CN100466235 C CN 100466235C
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Abstract
一种包含金属容器形式的外夹持装置(12)的共封装半导体管芯(10)还包括两个半导体管芯(30),其中至少一个半导体管芯将所述外夹持装置作为电连接器使用。内夹持装置(28)用来将管芯之一安放在外夹持装置之内。内夹持装置可通过绝缘层与外夹持装置绝缘。
Description
发明背景
本发明涉及半导体器件,特别涉及一种包含至少两个共封装(co-packaged)半导体管芯(die)的半导体器件。
一般称为copak的共封装器件是公知的。通常,这类器件包含封装在一公用外壳内的两个或更多个相同或不同的半导体器件。这种结构所实现的好处在于其具有更加紧凑的电子封装,这种紧凑的电子封装在电路板上占用的空间比在电路内实现相同功能的单独封装的半导体管芯所占用的空间小。空间的节省自然地使得建构更紧凑的和/或在相同空间中包含更多电子部件的更加复杂仪器成为可能。
许多共封装器件包含模制的外壳(housing)和引线框(lead frame)。外壳为半导体管芯提供了对诸如湿气等环境因素的保护,而引线框则被用来连接半导体管芯与电路内的外部元件。因此,由于这种结构需要多个部件,所以它不仅增加了copak的成本而且其制造也变得复杂。所以,需要有这样一种copak器件,其含有两个或更多的器件,同时减少了其组装所需的部件的数目。
发明内容
根据本发明的半导体器件包含至少两个相同或不同的半导体管芯(die)。这两个半导体管芯被共同封装在公用的外金属夹具(clip)中,所述金属夹具可作为至少一个所述半导体管芯的外连接器使用。
根据本发明的第一个方面所述,两个相同或不同的半导体管芯被包容在一个外夹具中,所述外夹具既用作所述管芯的外壳,又用作电连接器以连接所述管芯之一与电子电路中的外部元件。
明确地讲,根据本发明所述的共封装半导体器件包括金属容器(metalcan),其具有基本平直的连接板(web)部分以及多个壁,所述壁限定出一个空间。可以是金属氧化物半导体场效应晶体管(MOSFET)的第一半导体管芯的漏极通过导电层与所述连接板部分电连接,所述导电层可以是焊料层或导电环氧树脂层。从所述外夹具的两个相对壁的边缘伸展的两个凸起部分与诸如电路板的衬底上的相应电焊盘(pad)连接,从而将MOSFET的漏极连接至其在电子电路中的合适位置。
第二半导体管芯被设置于一内夹具中,该内夹具通过绝缘层与所述外夹具的连接板部分连接,但是与其绝缘。第二半导体管芯可以是和第一半导体管芯相同的MOSFET,或者可以是在半导体芯片上形成的用于控制第一半导体管芯操作的集成电路。
根据本发明的第一个方面所述,第一半导体管芯的厚度与内夹具和第二半导体管芯的总高度相同,从而他们各自的上表面相互共面,并且优选地与凸起部分的接触面互相共面。为了实现这一结果,可对第二半导体管芯进行打磨以减小其厚度。
根据本发明的内夹具包括底板和多个从所述底板的边缘充分垂直伸展的壁。所述内夹具的至少一个壁包括一个伸展部分,该伸展部分被弯曲以限定出一个接触面,所述接触面优选地与所述外夹具的凸起部分共面。所述内夹具的所述接触面和衬底上的合适的焊盘(pad)接触,以将所述第二半导体管芯连接至其在电子电路内的相应位置。优选地,所述内夹具的外表面经过化学处理以形成绝缘表面,或通过电绝缘聚合物(如聚酰亚胺)层被隔离。所述内夹具的内表面上优选地涂有诸如银的良导电金属。通过使铜箔的边缘凸起以形成至少部分容纳了所述第二半导体管芯的基本垂直的壁,就可形成所述内夹具。
根据本发明第二个实施方案所述的共封装半导体器件包含一个外夹具,该外夹具可以是与第一实施方案中所使用的金属容器基本类似的金属容器。根据第二实施方案所述的半导体器件包括至少两个相同或不同的半导体管芯,每一个管芯至少有一个主要电极通过焊料或导电环氧树脂形成的导电层与外夹具的连接板部分电导通。在这个实施方案中,外夹具既用作半导体管芯的外壳,又用作电连接器以连接器件与电子电路中的外部元件。
通过以下结合附图对本发明的描述,本发明的其它特征和优点将变得更加清楚。
附图的简要说明
图1是根据本发明第一实施方案所述的半导体器件的俯视平面图。
图2是从图1中的线1-1的方向看去所得到的本发明第一实施方案的剖视图。
图3是根据本发明一个方面所述的内夹具的侧视平面图。
图4是图3中所示内夹具的俯视平面图。
图5是根据本发明第二实施方案所述的半导体器件的俯视平面图。
图6是从图5中的线2-2的方向看去所得到的本发明第二实施方案的剖视图。
图7示出了与衬底连接的根据本发明第一实施方案所述的半导体器件。
图8示出了与衬底连接的根据本发明第二实施方案所述的半导体器件。
附图的详细说明
图1示出了根据本发明第一实施方案所述的半导体器件10。该半导体器件10包括外导电夹具12。外导电夹具12为金属容器(metal can),其包含连接板部分(web portion)14和多个壁16,壁16从连接板部分14的边缘伸展以限定出一个空间。外夹具12可以是铜制的,优选地涂有银。第一半导体管芯18被放置在由外导电夹具12的壁16所限定出的空间之内。第一半导体管芯18可以是垂直导电的金属氧化物半导体场效应晶体管(MOSFET),功率二极管(power diode),绝缘栅双极型晶体管(IGBT)或类似器件。在本发明的第一实施方案中,第一半导体器件18是垂直导电的MOSFET,其具有源极20、栅极22以及漏极24(图2)。
参照图2,第一半导体管芯18的漏极24通过导电材料层26与外导电夹具12的连接板部分14电连接。导电材料可以是焊料或导电环氧树脂。根据第一实施方案所述的半导体器件10还包括放置在由外夹具12的壁16所限定出的空间之内的内夹具28。
参照图3和4,内夹具28优选地由导电金属薄片(如薄铜片)制成,并且优选地包括垂直伸展的壁30,壁30围绕其底板部分32限定出了一个空间。内夹具28还包括伸展部分34,它从夹具28的壁30之一的边缘伸展,并且被弯曲从而提供一个接触面33。内夹具28的内表面可以涂上良导电材料(如银),并且其外表面可以经过化学处理以具有绝缘性或者被覆盖以绝缘胶膜(如聚酰亚胺)。内夹具28优选地是通过使薄铜箔的外边缘凸起以形成壁30而做成的。如此形成的壁中的一个应该具有伸展部分34,该伸展部分34随后被向外弯曲以暴露出伸展部分34的内表面,该内表面就作为接触面33。用于形成内夹具28的铜箔,其厚度应该薄于外夹具12的深度。例如,在一个优选实施方案中,所使用的铜箔的厚度约为0.100mm,而外夹具12的深度则约为0.396mm。
现在参照图1和2,第二半导体管芯36位于内夹具28的壁30之内的空间中。在第一实施方案中,第二半导体管芯可以是MOSFET,其漏极(未示出)通过导电层38与内夹具28电连接,导电层38可以由焊料或导电环氧树脂(如含银环氧树脂)形成。内夹具28的壁30起到阻碍物(dam)的作用,用以防止焊料或导电环氧树脂溅到外夹具12的连接板部分14上并与其接触。第二半导体管芯36通过设置在内夹具28的底部和外夹具12的连接板部分14之间的绝缘层40而与外夹具12绝缘。在一个优选实施方案中,第一半导体管芯18的厚度约为0.350,该厚度通过导电材料26被升高到外夹具12的深度的顶部。在内夹具28的内部,第二半导体管芯36也被升高,从而使其上表面与第一半导体管芯18的上表面共面。为了获得这一结果,有可能需要使用比第一半导体管芯18薄的管芯。在一个优选实施方案中,第二半导体管芯36的厚度为0.200mm。为了获得这一厚度,在将管芯放入内夹具28之前,可将管芯的背面打磨至所需的厚度。
参照图7,根据本发明的一个方面所述,外夹具12包括至少两个凸起部分42,其从外夹具12的两个相对的壁的边缘处升起。每个凸起部分42都具有平的接触面,用以与衬底45(如电路板或绝缘金属衬底)上的相应电焊盘(pad)43进行电接触。第一半导体管芯18的漏极24通过凸起部分42与其在电路中的合适的位置电连接。所以,外夹具12同时起到了第一半导体管芯12的外壳和电连接器的作用。
在根据第一实施方案所述的半导体器件10中,伸展部分34的接触面33、第一半导体管芯18的源极20以及第二半导体管芯36的源极35与外夹具12的凸起部分42的接触面相共面。接触面33将第二半导体管芯36的漏极连接至衬底45上的合适的导电焊盘(pad)47,从而使第二半导体管芯36的漏极与其在电路中的合适位置连接。
图5和6示出了根据本发明第二实施方案所述的半导体器件44,在图中相同的标号代表了相同的零件(feature)。根据第二实施方案所述的半导体器件44包括第一和第二半导体器件18,18’,它们可以都是MOSFET。但是功率二极管、IGBTS等也可以用来代替MOSFET。第一和第二半导体18和18’的漏极24和24’通过导电层27,27’与外夹具12的连接板部分14电连接。也可以利用公共的导电层来代替单独的导电层27,27’。导电层27和27’可以是由焊料或导电环氧树脂(如含银导电环氧树脂)形成的层。第一和第二半导体器件18,18’的源极20和20’相互共面,并且优选地与外夹具12的凸起部分42共面。在第二实施方案中,外夹具12既用作半导体管芯的漏极24和24’的外壳,也用作它们的公共连接器。如图8所示,凸起部分42与衬底45上的焊盘(pad)43产生电接触,从而使管芯的漏极24,24’与它们在电路中的适当位置相连接。管芯的源极20和20’也和衬底45上的焊盘49电接触,从而使源极20和20’与它们在电路中的适当位置相连接,如图和图8所示。
本领域的普通技术人员应该预计到,通过采用在本文中描述并且以实施方案为例进行说明的创造性概念,就可以利用各种半导体管芯的组合来实现本发明。例如,在第一实施方案中,第二半导体36可以用肖特基(Schottky)二极管或控制集成电路(IC)取代以用于控制第一半导体管芯18。
尽管对本发明的描述是结合其特定实施方案来进行的,但是对于本领域的普通技术人员来说,许多其他的变化、修改和应用是显而易见的。因此,本发明优选地并不受限于本文的具体说明,而只受限于所附的权利要求。
Claims (33)
1.一种共封装半导体器件,包括:
外导电夹持装置,其具有连接板部分和多个壁,所述壁从所述连接板部分的边缘伸展以限定出一个空间;
第一半导体管芯,其含有两个主要电极,所述各主要电极被安放于所述第一半导体管芯的各主要表面上;
导电层,其位于所述主要电极之一与至所述连接板部分之间,以使二者电连接;
内夹持装置,其具有多个壁,并且被安放于所述空间之内和所述连接板部分上;
第二半导体管芯,其被安放在所述内夹持装置之内。
2.根据权利要求1所述的共封装半导体器件,其特征在于,所述外导电夹持装置包含从其两个相对的壁的边缘伸展的两个凸起部分,每个所述凸起部分都包含一个接触面,用以与衬底上的相应电接触焊盘电连接。
3.根据权利要求2所述的共封装半导体器件,其特征在于,所述内夹持装置包括从其多个壁中的一个伸展的部分,所述部分与所述外导电夹持装置的所述两个凸起部分的所述接触面相共面。
4.根据权利要求1所述的共封装半导体器件,其特征在于,所述内夹持装置与所述连接板部分连接但与其绝缘。
5.根据权利要求1所述的共封装半导体器件,其特征在于,所述第一和第二半导体管芯是金属氧化物半导体场效应晶体管。
6.根据权利要求1所述的共封装半导体器件,其特征在于,所述第一半导体芯管芯是金属氧化物半导体场效应晶体管,其漏极和所述连接板部分相连,所述第二半导体管芯是用于控制所述金属氧化物半导体场效应晶体管的集成电路。
7.根据权利要求1所述的共封装半导体器件,其特征在于,所述内夹持装置由铜制成。
8.根据权利要求1所述的共封装半导体器件,其特征在于,所述内夹持装置的外表面是绝缘的。
9.根据权利要求1所述的共封装半导体器件,其特征在于,所述内夹持装置的内表面涂有银。
10.根据权利要求1所述的共封装半导体器件,进一步包括连接所述内夹持装置和所述连接板部分的绝缘层。
11.根据权利要求1所述的共封装半导体器件,其特征在于,所述第二半导体管芯比所述第一半导体管芯薄。
12.根据权利要求1所述的共封装半导体器件,其特征在于,所述第二半导体管芯通过导电环氧树脂与所述内夹持装置电连接。
13.根据权利要求1至12所述的共封装半导体器件,其特征在于,所述外导电夹持装置为金属容器。
14.一种共封装半导体器件,包括:
公用的导电夹持装置,所述公用的导电夹持装置包括连接板部分;
第一半导体管芯,其包括电连接至所述连接板部分的一侧的第一电极,以及与所述第一电极相对的、用于外部连接至导电盘的自由电极;以及
第二半导体管芯,其连接至所述连接板部分的所述一侧;
其中,所述公用的导电夹持装置包括自由表面,所述自由表面至少用作所述第一半导体管芯的所述第一电极的外部导体。
15.根据权利要求14所述的共封装半导体器件,其特征在于,所述第一半导体器件和所述第二半导体器件是相同的。
16.根据权利要求14所述的共封装半导体器件,其特征在于,所述第一半导体器件和所述第二半导体器件是不同的。
17.根据权利要求14所述的共封装半导体器件,其特征在于,所述第二半导体器件包括一电极,所述电极与所述第二半导体器件的自由电极相对并与所述连接板部分的所述一侧电耦合。
18.根据权利要求14所述的共封装半导体器件,其特征在于,所述第二半导体器件为集成电路。
19.根据权利要求14所述的共封装半导体器件,其特征在于,所述第二半导体器件是肖特基二极管。
20.根据权利要求14所述的共封装半导体器件,其特征在于,所述公用的导电夹持装置的所述自由表面与所述第一半导体器件的所述自由电极是共面的。
21.根据权利要求14所述的共封装半导体器件,其特征在于,所述公用的导电夹持装置的所述自由表面、所述第一半导体器件的所述自由电极、以及所述第二半导体器件的所述自由电极是共面的。
22.根据权利要求14所述的共封装半导体器件,其特征在于,所述公用的导电夹持装置包括一个壁和从所述壁的边缘升起的凸起部分,所述凸起部分包括所述夹持装置的所述自由表面。
23.根据权利要求14所述的共封装半导体器件,其特征在于,所述公用的导电夹持装置为金属容器。
24.根据权利要求23所述的共封装半导体器件,其特征在于,所述金属容器包括从所述连接板部分的边缘延伸的多个壁,并且两个凸起部分分别从各个壁升起,其中所述各个壁彼此相对。
25.一种共封装半导体器件,包括:
金属容器,其具有基本平坦的连接板部分和环绕所述连接板部分的多个壁;
第一半导体管芯,其具有两个主电极,各所述主电极被设置于所述第一半导体管芯的各主表面上;
第二半导体管芯,其具有两个主电极,各所述主电极被设置于所述第二半导体管芯的各主表面上;以及
各个导电层,其设置在所述连接板部分与所述第一和第二半导体管芯的所述第一主电极之间,并且将所述连接板部分电连接至所述第一和第二半导体管芯的所述第一主电极;
其中,所述第一和第二半导体管芯的所述第二主电极基本上是共面的。
26.根据权利要求25所述的半导体器件,其特征在于,所述第一和第二半导体管芯为金属氧化物半导体场效应晶体管。
27.根据权利要求25所述的半导体器件,其特征在于,所述金属容器进一步包括至少两个从所述容器的各个相对的壁延伸的凸起部分,所述凸起部分具有与所述第一和第二半导体管芯的所述第二主电极共面的接触表面。
28.一种共封装半导体器件,包括:
外夹持装置,其具有连接板部分和多个壁,所述壁从所述连接板部分的边缘延伸以限定出一个空间,至少一个所述壁具有能够与衬底上的电焊盘电接触的表面;
两个半导体管芯,其位于所述空间内,每个半导体管芯具有两个相对的主电极;
其中,一个所述半导体管芯具有一个电连接至所述连接板部分的电极,并且其相对的电极自由地与衬底上的相应的电焊盘电连接并且与其它半导体管芯的电极共面,所述其它半导体管芯的电极也自由地与衬底上的相应的电焊盘电连接。
29.根据权利要求28所述的共封装半导体器件,其特征在于,所有的所述半导体管芯都具有电连接至所述连接板部分的电极。
30.根据权利要求28所述的共封装半导体器件,其特征在于,所述外夹持装置包括从其相对的壁中的两个壁的边缘延伸的凸起部分。
31.根据权利要求28所述的共封装半导体器件,进一步包括置于所述空间内的内夹持装置,其中一个所述半导体管芯设置在所述内夹持装置内。
32.根据权利要求31所述的共封装半导体器件,其特征在于,所述内夹持装置被设置在所述连接板部分上但与所述连接板部分绝缘。
33.根据权利要求31所述的共封装半导体器件,其特征在于,所述内夹持装置包括多个壁、以及从一个所述壁延伸的延伸部分,所述壁作为阻碍物用以保持设置在所述内夹持装置内的导电材料,所述延伸部分具有用于与衬底上的电焊盘相接触的电接触表面。
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US10/053,123 | 2002-01-18 | ||
US10/053,123 US6677669B2 (en) | 2002-01-18 | 2002-01-18 | Semiconductor package including two semiconductor die disposed within a common clip |
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CN1613148A CN1613148A (zh) | 2005-05-04 |
CN100466235C true CN100466235C (zh) | 2009-03-04 |
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CNB028269438A Expired - Fee Related CN100466235C (zh) | 2002-01-18 | 2002-10-09 | 包括两个设置在公用夹具中的半导体管芯的半导体封装 |
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US (1) | US6677669B2 (zh) |
EP (1) | EP1466363A4 (zh) |
JP (2) | JP4712303B2 (zh) |
CN (1) | CN100466235C (zh) |
TW (1) | TW565921B (zh) |
WO (1) | WO2003063236A1 (zh) |
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JP2005516398A (ja) | 2005-06-02 |
WO2003063236A1 (en) | 2003-07-31 |
JP4712303B2 (ja) | 2011-06-29 |
US20030137040A1 (en) | 2003-07-24 |
EP1466363A1 (en) | 2004-10-13 |
US6677669B2 (en) | 2004-01-13 |
TW565921B (en) | 2003-12-11 |
JP2011049575A (ja) | 2011-03-10 |
CN1613148A (zh) | 2005-05-04 |
EP1466363A4 (en) | 2007-08-15 |
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