CN100459173C - 受光组件 - Google Patents
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Abstract
本发明提供一种红外线受光组件(M),其包括:光电二极管(1);IC芯片(2);密封光电二极管(1)和IC芯片(2),并且具有透光性和电绝缘性的密封树脂(4);在该密封树脂(4)的与光电二极管(1)相对的面上形成的透镜部(43);和以使该透镜部(43)露出的方式覆盖密封树脂(4),并且具有遮光性和导电性,与地面连接的覆盖部(5),覆盖部(5)由导电性树脂构成,并且具有包围透镜部(43)周边的直立壁(51)。
Description
技术领域
本发明涉及用于接收从例如红外线发射器发射的红外线的用途的红外线受光组件等受光组件。
背景技术
图8为表示以往的红外线受光组件的一个例子(例如,参照专利文献1)的整体立体图。图示的红外线受光组件9安装在电气产品和其它设备中,接收从遥控用的红外线发射器(图示省略)发射的红外线。红外线受光组件9具有形成有透镜部90a的密封树脂90。光电二极管和IC芯片(图示均省略)被密封在该密封树脂90内。从红外线发射器(图示省略)发射的红外线由透镜部90a会聚后,被上述光电二极管接收。
专利文献1:特开平7-273356号公报
在密封树脂90的外部形成有由金属箔构成的导电层91。与上述光电二极管和IC芯片电气连接的多根端子92a~92c突出到密封树脂90的外部。导电层91与接地用端子92a连接。由此,导电层91发挥电磁屏蔽功能,抑制IC芯片因受到来自外部的电磁噪声的影响而误动作。
在透镜部90a的表面上,导电层91的一部分形成为网眼状。由此,透镜部90a的表面利用导电层91形成为网眼状的网眼状部91a,不完全遮蔽从红外线发射器发射的红外线,而能够抑制外部的电磁噪声透过透镜部90a行进到红外线受光组件9内。
但是,在上述红外线受光组件9中,由于透镜部90a的一部分被导电层91的网眼状部91a覆盖,所以,从红外线发射器发射的红外线被该网眼状部91a遮蔽,通过透镜部90a到达光电二极管的红外线量变少。因此,以往的红外线受光组件9,红外线的受光灵敏度差。
此外,在以往的结构中,若不在透镜部90a上形成网眼状部91a,则可消除红外线的受光灵敏度的降低,但会产生透镜部90a的屏蔽效果降低的问题。
发明内容
本发明在上述情况的基础上做出,其课题是提供一种能够避免电磁屏蔽性能恶化的不利情况、同时能够使受光灵敏度良好的受光组件。
本发明提供的受光组件包括:受光元件;IC芯片;密封受光元件和IC芯片,并且具有透光性和电绝缘性的密封部件;在该密封部件的与上述受光元件相对的面上形成的透镜部;和以使该透镜部露出的方式覆盖上述密封部件,并且具有遮光性和导电性,与地面连接的覆盖部,其特征在于:上述覆盖部由导电性部件构成,并且具有包围上述透镜部周边的直立壁。
根据这种结构,上述覆盖部的直立壁将大多从透镜部的周边区域向透镜部行进的电磁噪声遮蔽。因此,与现有技术不同,不需要在透镜部的一部分上形成电磁屏蔽用的网眼状的膜,来作为防止IC芯片因电磁噪声而误动作的装置。在上述结构中,透镜部的表面整体或大致整体广阔地开放,能够增加通过透镜部到达受光元件的光的量。由于这样,本发明能够提高受光灵敏度,而不使电磁屏蔽性能恶化。
另外,由于上述覆盖部由导电性树脂制成,所以,与一般的树脂成型品同样,能够利用模具简单地成型上述覆盖部。若与现有技术的使用金属箱的结构比较,则上述覆盖部的成型容易,能够降低制造成本。特别地,根据本发明,对于金属箔难以形成的直立壁,也能够简单地形成。
优选:上述透镜部为凸透镜,上述直立壁在上述透镜部的厚度方向上形成为上述透镜部以上的高度。
根据这种结构,可以更可靠地利用上述直立壁遮断从上述透镜部的周边部分向上述透镜部行进的电磁噪声,从而进一步提高电磁屏蔽性能,所以优选。
优选:上述直立壁具有能够反射光的内周面,并且该内周面以越向底部上述直立壁的内径越小的方式倾斜。
根据这种结构,利用直立壁的内周面,将期望的光以使其入射到透镜部上的方式会聚,能够增加入射到透镜部上的光的量。因此,能够进一步提高受光灵敏度。
另外,优选上述密封部件和导电性部件由树脂构成。根据这种结构,可以容易地制造密封部件和导电性部件。
附图说明
图1为表示应用本发明的红外线受光组件的实施例的立体图。
图2为沿着图1的II-II线的纵截面图。
图3为沿着图1的I-I线的横截面图。
图4为用于说明图1所示的受光组件的制造工序的主要部分截面图。
图5为表示覆盖部的直立壁的变形例的主要部分截面图。
图6为表示覆盖部的直立壁的另一个变形例的主要部分截面图。
图7为表示应用本发明的红外线受光组件的另一个实施例的横截面图。
图8为表示以往的红外线受光组件的一个例子的整体立体图。
具体实施方式
以下,参照附图,具体地说明本发明的实施例。
图1~图3表示应用本发明的红外线受光组件的一个实施例。本实施例的红外线受光组件M安装在电视机、录相机、音频设备、空调装置等电气产品中,用于接收从遥控用的红外线发射器发射的红外线。如图1和图2清楚地所示,该红外线受光组件M包括:作为受光元件的光电二极管、IC芯片2、第一~第三引线3a~3c、密封树脂4和覆盖部5。
光电二极管1接收从红外线发射器(图示省略)发出的红外线时,产生与其相应的光电动势,使电流流动。IC芯片2将在光电二极管1中流动的电流变换为输出信号并输出至外部的规定的控制装置,包括电流/电压变换电路、放大电路、限制电路、检波电路(图示均省略)等。
第一~第三引线3a~3c用于支承光电二极管1和IC芯片2以及将它们电气连接,由铜或镍等金属制成。这些第一~第三引线3a~3c各自都分为由密封树脂4覆盖的内部和从密封树脂4的基端面40突出到外部的外部。第一~第三引线3a~3c的外部成为接地用端子30a、电源电压用端子30b和输出端子30c。
如图3所示,第一引线3a的内部由与接地用端子30a连接设置的连设部31和与该连设部31连接并具有用于搭载光电二极管1和IC芯片2的平面的搭载部32构成。在连设部31的延长线上,IC芯片2和光电二极管1按该顺序搭载在搭载部32上。
光电二极管1的负极侧端子通过电线W1与搭载部32(相当于接地电极)连接,正极侧端子通过电线W2与IC芯片2连接。IC芯片2的接地端子通过电线W3与搭载部32连接,其它两个端子分别通过电线W4、W5与第二引线3b和第三引线3c的内部连接。
密封树脂4用于密封光电二极管1和IC芯片2,例如由含有用于遮蔽可见光的颜料的环氧树脂制成。密封树脂4对可见光具有遮光性,另一方面对红外线具有透光性。该密封树脂4被形成为大致长方体形状,在该密封树脂4的上表面中的与光电二极管1相对的部分,形成有大致半球面状的作为凸透镜的透镜部43。该透镜部43将从外部行进的红外线会聚在光电二极管1上,起高效率地接收光的作用。
覆盖部5例如由在环氧树脂中混入碳或其它导电性填料的导电性树脂制成。另外,该覆盖部5分别对可见光和红外线有遮光性。该覆盖部5被形成为覆盖密封树脂4的表面中除去基端面40和透镜部43的部分。在基端面40上的一部分上形成有与接地端子30a接触并导通的连接部50,由此,覆盖部5被接地。
覆盖部5具有包围透镜部43周边的大致圆筒状的直立壁51。该直立壁51的高度H1与透镜部43的高度H2相同,或比它高。从适当地发挥电磁屏蔽功能、同时实现整体的薄型化的观点来看,优选使高度H1、H2为相同高度。
直立壁51的内周面51a倾斜,使得越向直立壁51的底部,其内径越小。该倾斜也可以是取代直线的倾斜的向下方向弯曲的曲线的倾斜。内周面51a为红外线的反射率高的面。这可以通过使形成覆盖部5的导电性树脂成为白色或接近白色的白色系而容易地实现。此外,也可以做成在内周面51a上叠层形成红外线反射层的结构,取代这种结构。
在内周面51a的最下部和透镜部43的外周边部之间设有间隙S。该间隙S不是必需的,但由于该间隙S的存在,可容易地制造如后所述用于成型覆盖部5的模具。
在上述结构的红外线受光组件M的制造工序中,密封树脂4和覆盖部5均通过使用模具的树脂成型来形成。
更具体地说,如图4所示,在制造出密封树脂4已成型、并且覆盖部5未成型的中间品M’后,将该中间品M’***由模具7的上模具70a和下模具70b形成的空腔(cavity)71内。然后,通过向该空腔71内供给熔融的导电性树脂,形成覆盖部5。在上模具70a中形成有:用于形成直立壁51的凹部72、和将该凹部72和中间品M’的透镜部43之间隔开的突起部73。
如参照图2说明的那样,采用在直立壁51的最下部和透镜部43的外周边部之间设置有间隙S的结构,使突起部73的前端部的厚度t与间隙S为相同宽度,增大该突起部73的壁厚,由此可以适当地确保该突起部73的强度。另外,在树脂成型覆盖部5时,通过使该突起部73的前端部相对于密封树脂4的上表面面接触,提高这些接触部分的密封性,即防止供给到空腔71内的导电性树脂泄漏至透镜部43侧,从而可靠地防止该导电性树脂附着在透镜部43上。
在该红外线受光组件M中,覆盖部5发挥电磁屏蔽功能,直立壁51也发挥同样的功能。因此,从透镜部43的周边部分(正面以外的部分)向透镜部43行进的电磁噪声被直立壁51遮蔽,可抑制电磁噪声从透镜部43行进到密封树脂4内。由于直立壁51比透镜部43的高度高、并包围透镜部43的整个周围,因此上述的电磁屏蔽功能更优异。因此,可防止由电磁噪声引起的误动作。
另外,由于覆盖部5具有对可见光和红外线的遮光性,因此可防止干扰光从透镜部43以外的地方行进到密封树脂4内。因此,也可适当地防止由干扰光引起的IC芯片2的误动作。
另一方面,透镜部43的表面未被覆盖部5覆盖,与图8所示的以往的红外线受光组件9相比,透镜部43的红外线入射面积大。因此,不会像以往的红外线受光组件9那样到达光电二极管1的红外线的量因导电层91的网眼状部91a而下降。
另外,从透镜部43的正面行进的红外线中,到达直立壁51的内周面51a的红外线被该内周面51a反射,可以期待被导入透镜部43的效果。即:由于内周面51a从直立壁51的基端侧向前端侧呈前部宽的形状倾斜,该直立壁51的前端部分的内径比透镜部43直径大,因此入射到透镜部43上的红外线的量为直接入射的红外线和通过上述那样的反射作用入射的红外线的合计量。通过这样,光电二极管1能接收的红外线的量比以往的红外线受光组件9多,红外线的受光灵敏度良好。
由于覆盖部5用导电性树脂制成,因此,能够如上述那样利用模具简单地成型,也能够适当地进行直立壁51的成型。因此,能够将红外线受光组件M整体的制造成本控制为廉价。
图5为表示红外线受光组件的另一个实施例的图。更具体地说,为表示覆盖部的直立壁的变形例的主要部分截面图。
在图2所示的覆盖部5的直立壁51的结构中,在直立壁51的内周面51a的最下部和透镜部43的外周边部之间设有间隙S,使得将透镜部43的球面部分整体露出,但是,由于从直立壁51的内周面51a反射后从透镜部43的基部(球面的下部)入射的红外线的量不多,所以即使去掉间隙S、利用覆盖部5覆盖透镜部43的基部周面,对红外线接收量的影响也小。
图5所示的覆盖部5的直立壁51的结构,基于上述的考虑,使覆盖部5的一部分以适当的宽度s1与透镜部43的基部周面接触,由覆盖部5覆盖透镜部43的基部。这种结构与以往的红外线受光组件9相比,能够使透镜部43的表面以大的面积比率露出,从而能够提高受光灵敏度。
图6为表示覆盖部的直立部的另一个变形例的图。图2和图5所示的覆盖部的结构为与在密封树脂4的上表面上突出设置的透镜部43对应、使直立壁51突出的结构,而图6所示的例子,使密封树脂4的上表面的覆盖部5的厚度t1与透镜部43的高度相同或稍高一点,在与透镜部43对应的部分,设置使该透镜部43露出的凹部59,使该凹部59作为直立壁51a发挥作用。
在凹部59的内周面中形成有倾斜面,与图2和图5所示的例子同样,红外线被该倾斜面反射、并入射到透镜部43上。此外,在图6所示的例子中,也可以在透镜部43的基部和覆盖部5之间设置间隙。
在图6所示的例子中,红外线受光组件整体的形状为棱柱状,具有直立壁51难以损伤的效果。但是,从减少覆盖部5整体的体积、实现整体的小型化等的观点考虑,优选如图2和图5所示那样将直立壁形成为筒状的突起状。
图7为表示红外线受光组件的又一个实施例的图。更具体地说,为表示与第一引线3a的内部连接设置的搭载部32的接地结构的变形例的主要部分截面图。
该图所示的红外线受光组件M为如下结构:在图3中,分别在第一引线3a的内部的搭载部32的左右端面上,突出设置延伸至覆盖部5的第一连接部32a和第二连接部32a,并且在搭载部32前端侧的端面上突出设置延伸至覆盖部5的第三连接部32c。第一连接部32a~第三连接部32c的前端分别与覆盖部5连接,由此,搭载部32的前端侧和左右端面也被接地。
根据该结构,不仅接地端子30a与覆盖部5的连接部50接触并导通,而且第一~第三连接部32a~32c与覆盖部接触并导通,所以能够使在光电二极管1和IC芯片2的电路中产生的噪声尽可能以最短距离流向地面,从而能够更进一步提高屏蔽性。此外,在图7所示的红外线受光组件中,第一~第三连接部32a~32c的前端露出到外部,但不限于此,也可以第一~第三连接部32a~32c的前端与覆盖部5的内周面接触并导通。
本发明不限定于上述的实施例,本发明的受光组件的各部分的具体结构在各方面设计变更是自由的。例如,直立壁51可以不是大致圆筒状的突起状,也可以形成为与其不同的筒状(例如角筒状)的突起状。
也可以将光电二极管1和IC芯片2集中,做成一体化的单片结构。另外,作为受光元件,不限于光电二极管,也可以使用光电晶体管。
本发明也可以应用于感知红外线以外的波长范围的光的受光组件。另外,本发明中所说的受光组件是指至少具有受光功能的组件,也包含除了受光功能以外还附加例如发光功能的组件。因此,本发明的技术对象中也包含具有发出红外线或其它波长范围的光的功能的受光·发光组件或光通信组件。
Claims (3)
1.一种受光组件,包括:受光元件;IC芯片;密封受光元件和IC芯片,并且具有透光性和电绝缘性的密封部件;在该密封部件的与所述受光元件相对的面上形成的透镜部;和以使该透镜部露出的方式覆盖所述密封部件,并且具有遮光性和导电性,与地面连接的覆盖部,其特征在于:
所述覆盖部由导电性树脂构成,并且具有包围所述透镜部周边的圆筒状直立壁。
2.如权利要求1所述的受光组件,其特征在于:
所述透镜部为凸透镜,
所述直立壁在所述透镜部的厚度方向上形成为所述透镜部以上的高度。
3.如权利要求2所述的受光组件,其特征在于:
所述直立壁具有能够反射光的内周面,并且该内周面以越向底部所述直立壁的内径越小的方式倾斜。
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US8148735B2 (en) * | 2005-03-07 | 2012-04-03 | Rohm Co., Ltd. | Optical communication module |
FR2898218B1 (fr) * | 2006-03-02 | 2009-12-11 | Higher Way Electronic Co Ltd | Structure de boitier pour une puce solaire |
KR100810327B1 (ko) * | 2006-09-05 | 2008-03-04 | 삼성전자주식회사 | 광 모듈 및 그를 이용한 광 통신 시스템 |
US8031164B2 (en) | 2007-01-05 | 2011-10-04 | Apple Inc. | Backlight and ambient light sensor system |
US8698727B2 (en) | 2007-01-05 | 2014-04-15 | Apple Inc. | Backlight and ambient light sensor system |
US8693877B2 (en) * | 2007-03-09 | 2014-04-08 | Apple Inc. | Integrated infrared receiver and emitter for multiple functionalities |
TWI414983B (zh) * | 2009-10-02 | 2013-11-11 | Inventec Appliances Corp | 可攜式裝置及其操作方法 |
FR2997556A1 (fr) * | 2012-10-29 | 2014-05-02 | Waitrony Optoelectronics Ltd | Appareil formant led a entree et sortie |
JP6479536B2 (ja) | 2015-03-31 | 2019-03-06 | パナソニック デバイスSunx株式会社 | 光電センサ |
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JP6616369B2 (ja) * | 2017-09-20 | 2019-12-04 | 京セラ株式会社 | 受発光素子モジュール |
US11710708B2 (en) * | 2021-08-19 | 2023-07-25 | Raytheon Company | On-chip EMF isolation of an integrated circuit coupled with photoconductive semiconductor switch under an on-chip faraday cage |
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