CN100455362C - 用于制造有机el显示装置的涂敷装置和基板处理*** - Google Patents

用于制造有机el显示装置的涂敷装置和基板处理*** Download PDF

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Publication number
CN100455362C
CN100455362C CNB2005101294874A CN200510129487A CN100455362C CN 100455362 C CN100455362 C CN 100455362C CN B2005101294874 A CNB2005101294874 A CN B2005101294874A CN 200510129487 A CN200510129487 A CN 200510129487A CN 100455362 C CN100455362 C CN 100455362C
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CN
China
Prior art keywords
mentioned
objective table
substrate
plate
heating arrangements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005101294874A
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English (en)
Chinese (zh)
Other versions
CN1785533A (zh
Inventor
川越理史
增市干雄
高村幸宏
吉田顺一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Skilling Group
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
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Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Publication of CN1785533A publication Critical patent/CN1785533A/zh
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Publication of CN100455362C publication Critical patent/CN100455362C/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coating Apparatus (AREA)
CNB2005101294874A 2004-12-10 2005-12-09 用于制造有机el显示装置的涂敷装置和基板处理*** Expired - Fee Related CN100455362C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004358452 2004-12-10
JP2004358452A JP4636495B2 (ja) 2004-12-10 2004-12-10 有機ｅｌ表示装置を製造するための塗布装置

Publications (2)

Publication Number Publication Date
CN1785533A CN1785533A (zh) 2006-06-14
CN100455362C true CN100455362C (zh) 2009-01-28

Family

ID=36666649

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005101294874A Expired - Fee Related CN100455362C (zh) 2004-12-10 2005-12-09 用于制造有机el显示装置的涂敷装置和基板处理***

Country Status (4)

Country Link
JP (1) JP4636495B2 (ja)
KR (1) KR100787674B1 (ja)
CN (1) CN100455362C (ja)
TW (1) TWI294253B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009119395A (ja) * 2007-11-16 2009-06-04 Dainippon Screen Mfg Co Ltd 塗布システムおよび塗布方法
KR101182226B1 (ko) 2009-10-28 2012-09-12 삼성디스플레이 주식회사 도포 장치, 이의 도포 방법 및 이를 이용한 유기막 형성 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5619613A (en) * 1994-02-21 1997-04-08 Otaki; Chizuko Heating chamber with insulative shield panel and electric heating panels mounted on guard frames
JPH11281985A (ja) * 1998-03-27 1999-10-15 Asahi Glass Co Ltd スペーサ吐出方法及び液晶表示素子
CN1235260A (zh) * 1998-02-27 1999-11-17 三洋电机株式会社 加热烹调装置
CN1453075A (zh) * 2002-04-26 2003-11-05 精工爱普生株式会社 膜体形成装置、镜片的制造方法、彩色滤光片的制造方法以及有机el装置的制造方法
JP2004111073A (ja) * 2002-09-13 2004-04-08 Dainippon Screen Mfg Co Ltd 薄膜形成装置
CN1496764A (zh) * 2002-09-30 2004-05-19 ������������ʽ���� 液晶显示装置的制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3812144B2 (ja) * 1998-05-26 2006-08-23 セイコーエプソン株式会社 発光ディスプレイの製造方法
JP2001297876A (ja) * 2000-04-12 2001-10-26 Tokki Corp 有機ｅｌ表示素子の製造方法および製造装置
JP4285264B2 (ja) * 2000-11-28 2009-06-24 セイコーエプソン株式会社 有機エレクトロルミネッセンス装置の製造方法
US6736484B2 (en) * 2001-12-14 2004-05-18 Seiko Epson Corporation Liquid drop discharge method and discharge device; electro optical device, method of manufacture thereof, and device for manufacture thereof; color filter method of manufacture thereof, and device for manufacturing thereof; and device incorporating backing, method of manufacturing thereof, and device for manufacture thereof
JP4239560B2 (ja) * 2002-08-02 2009-03-18 セイコーエプソン株式会社 組成物とこれを用いた有機導電性膜の製造方法
JP4440523B2 (ja) * 2002-09-19 2010-03-24 大日本印刷株式会社 インクジェット法による有機ｅｌ表示装置及びカラーフィルターの製造方法、製造装置
JP2004192842A (ja) * 2002-12-09 2004-07-08 Sony Corp 表示装置
JP4391094B2 (ja) * 2003-01-24 2009-12-24 大日本印刷株式会社 有機ｅｌ層形成方法
US20060180806A1 (en) * 2003-01-24 2006-08-17 Takashi Arakane Organic electroluminescence device
JP4311050B2 (ja) * 2003-03-18 2009-08-12 セイコーエプソン株式会社 機能液滴吐出ヘッドの駆動制御方法および機能液滴吐出装置
JP3988676B2 (ja) * 2003-05-01 2007-10-10 セイコーエプソン株式会社 塗布装置、薄膜の形成方法、薄膜形成装置及び半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5619613A (en) * 1994-02-21 1997-04-08 Otaki; Chizuko Heating chamber with insulative shield panel and electric heating panels mounted on guard frames
CN1235260A (zh) * 1998-02-27 1999-11-17 三洋电机株式会社 加热烹调装置
JPH11281985A (ja) * 1998-03-27 1999-10-15 Asahi Glass Co Ltd スペーサ吐出方法及び液晶表示素子
CN1453075A (zh) * 2002-04-26 2003-11-05 精工爱普生株式会社 膜体形成装置、镜片的制造方法、彩色滤光片的制造方法以及有机el装置的制造方法
JP2004111073A (ja) * 2002-09-13 2004-04-08 Dainippon Screen Mfg Co Ltd 薄膜形成装置
CN1496764A (zh) * 2002-09-30 2004-05-19 ������������ʽ���� 液晶显示装置的制造方法

Also Published As

Publication number Publication date
CN1785533A (zh) 2006-06-14
TW200625999A (en) 2006-07-16
KR20060065490A (ko) 2006-06-14
TWI294253B (en) 2008-03-01
KR100787674B1 (ko) 2007-12-21
JP4636495B2 (ja) 2011-02-23
JP2006164905A (ja) 2006-06-22

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C56 Change in the name or address of the patentee

Owner name: SCREEN GROUP CO., LTD.

Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD.

Owner name: DAINIPPON SCREEN MFG. CO., LTD.

Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: Kyoto Japan

Patentee after: Skilling Group

Address before: Kyoto Japan

Patentee before: DAINIPPON SCREEN MFG Co.,Ltd.

Address after: Kyoto Japan

Patentee after: DAINIPPON SCREEN MFG Co.,Ltd.

Address before: Kyoto Japan

Patentee before: Dainippon Screen Mfg. Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090128

Termination date: 20151209

EXPY Termination of patent right or utility model