CN100424531C - Method for producing polymer light waveguide andits special direct-writing device - Google Patents
Method for producing polymer light waveguide andits special direct-writing device Download PDFInfo
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- CN100424531C CN100424531C CNB2006100199237A CN200610019923A CN100424531C CN 100424531 C CN100424531 C CN 100424531C CN B2006100199237 A CNB2006100199237 A CN B2006100199237A CN 200610019923 A CN200610019923 A CN 200610019923A CN 100424531 C CN100424531 C CN 100424531C
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Abstract
The invention discloses an optical waveguide method of the direct-writing polymer and the special direct-writing device. It covers the polymer material with the refractive index 1.4-1.6 to the Si underlay or the 5-8 mum SiO2 as the lower envelope firstly; then to write the polymer material with the bigger refractive index than the lower envelope into the lower envelope by the special direct-writing device, next to heat to form the core layer by the cross linking reaction; last to use the air as the upper envelope or cover the material with the lower refractive index than core layer as the upper envelope. The special direct-writing device is: the air source is connected with the pressure control device by the air pipe which is connected with the micro-thin pen by the pressing air pipe to control the air flow in the pressing air pipe and adjust the air pressure, also it can provides the command pressure for the slurry of the storing hollow in the micro-thin pen. The invention has the simple process and low cost.
Description
Technical field
The invention belongs to the manufacturing field of optoelectronic device, be specifically related to a kind of special direct-writing device that is used to prepare polymer optical wave guide.
Background technology
Dull and stereotyped and strip optical waveguide is the product under optical system miniaturization, the integrated demand.Annual all have the new results research of a large amount of relevant aspects such as waveguide material, device principle and structural design, process and measuring technology and system applies to report, seeks low-loss and be used for single chip integrated waveguide material and manufacturing process accordingly-directly be concerned about by people.
Traditional SiO
2The slab guide technology of preparing has that loss is low, the advantage of good stability, always as one of main flow material of preparation optical waveguide.But, because the material birefringence that causes of high-temperature technology in the preparation process, make SiO
2Base device has big polarization dependence usually.Simultaneously, SiO
2Thermo-optical coeffecient less, can't make the digital thermal photoswitch, more can not make electro-optical modulation device etc.Novel polymer material is a direction of present slab guide technical research and development.With SiO
2Compare, polymeric material has bigger thermo-optical coeffecient and electrooptical coefficient usually, can make low crosstalk, low polarization dependence, digital optical switch that bandwidth is big etc.
Compare with traditional inorganic optical waveguide material, the organic polymer optical waveguide material has higher electric light coupling coefficient, lower specific inductive capacity, the response time of lacking and less characteristics such as thermal losses.And, make optical waveguide with polymeric material, processing technology is simple, need not high-temperature heating treatment, as long as can make the integrated optoelectronic device of labyrinth by technologies such as even glue, photoetching, and prepared device is light and handy, good mechanical property, is applicable to and makes large-scale optical device and flexible devices.Polyimide (PI) is that one of high-molecular organic material the most rising in the present electronic material (is seen " research of fluorinated polyimide macromolecular optical waveguide technology ", Liang Dongbo, old armful of snow, Yuan one journal Vol25 No3 of side Shanghai University of Science and Technology 2003), its excellent comprehensive performance can satisfy the harsh requirement of microelectronics industry to material, therefore is subjected to the extensive attention of industry member and scientific and technological circle.
Aspect the manufacture craft of polymer optical wave guide, traditional polymer optical wave guide preparation technology is elder generation's spin coating one layer of polymeric film on clean silicon chip, pyroprocessing makes film hardening, adopts magnetron sputtering technique to deposit layer of metal film then on the thin polymer film for preparing.Required micrographics is transferred on the metal film by traditional photoetching technique, and concrete photoetching process comprises numerous steps such as pre-treatment, even glue, preceding baking, aligning, exposure, development, post bake, burn into remove photoresist.After finishing, photoetching just carries out ICP (inductively coupled plasma) etching.The metal micrographics film that stayed by photoresist protection is used as mask layer, protects polymeric layer under it to avoid the bombardment of plasma.Not protected polymkeric substance removes under the bombardment of plasma; form needed polymer micro-structural layer and (note control ICP etching time simultaneously; in order to avoid plasma bombardment destroys under-clad layer); adopt mordant that metal micrographics erosion is fallen again, the remaining polymeric layer with micrographics structure promptly becomes the sandwich layer of waveguide material.Last on the waveguide core layer of making the spin on polymers top covering, heat treated is solidified top covering, has just formed light waveguide-layer.
Above-mentioned traditional optical waveguide preparing technique process is stable, and prepared light waveguide-layer quality height has bigger advantage in large-scale production.Weak point is: needed equipment is expensive, manufacturing process is many, the precious materials waste is many, environmental pollution big, the flexibility degree is low, fabrication cycle is long and cost is high.Particularly for small serial production, said process obviously causes the rising significantly of manufacturing cost.
In order to remedy the deficiency of existing traditional optical waveguide manufacturing technology, since nineteen ninety, people have developed various direct writing technologies (Direct Writing), as finely straightly write, diamond cutter is directly write, laser direct-writing, laser fine fusion covering are directly write etc.Because direct writing technology generally has the CAD/CAM function, need not mask and just can realize the flexibility manufacturing, and the machining precision height, speed is fast, and is pollution-free, and cost is low.And, direct writing technology can make the designer stay indoors just can be processed into the software design figure product of reality in a few hours, satisfy the electronic product of short run, many kinds and make requirement, therefore the field such as synthesize and realized industrial applications gradually in manufacturing, the material original position of micromechanics, micro element and biochip.
In above-mentioned direct writing technology, representative technology is the fine straight electronic devices and components technology of writing.It mainly is the micro-pen that adopts particular design, utilizes the CAD/CAM function of worktable, directly electric slurry is placed in the assigned address of substrate surface, forms the process of wiring board or function components and parts.The specific design method of directly writing wiring about Micropen sees United States Patent (USP) for details: " Carl E, Drumheller.Inking System for Producing Circuit Patterns.US Patent4485387,1984. "
Summary of the invention
The purpose of this invention is to provide a kind of special direct-writing device that is used to prepare polymer optical wave guide, this device can be simplified technology, shortens fabrication cycle, reduces manufacturing cost.
The special direct-writing device that is used to prepare polymer optical wave guide provided by the invention, it is characterized in that: source of the gas links to each other with pressure control device by tracheae, pressure control device links to each other with micro-pen by the tracheae of exerting pressure, pressure control device be used for controlling exert pressure the tracheae air-flow break-make and regulate the air pressure size, and the slurry in the storage cavity of micro-pen provides required pressure.
The structure of above-mentioned micro-pen is: reliever is positioned at the cap for brush, and links to each other with the tracheae of exerting pressure that is positioned at cap for brush top, and the lower end of the cap for brush is threaded with the upper end of pen container and realizes sealing constituting storage cavity, and storage cavity is used to store feed liquid, and the lower end of pen container is a nib.Pressure control device is made of pressure regulator valve, tensimeter and solenoid valve series connection.
The present invention adopts custom-designed direct-writing device directly to write sandwich layer on existing whole under-clad layer.Characteristics such as it has technology simple (not needing to make complicated technologies such as mask-photoetching), and equipment manufacturing cost is low, efficient is high, and fabrication cycle is short.Apparatus of the present invention adopt custom-designed micro-pen device directly to write waveguide core layer, substitute the photoetching process in the traditional handicraft, to reach the purpose of simplifying technology, shortening fabrication cycle, reducing manufacturing cost.
Description of drawings
Fig. 1 is the process chart of the inventive method;
Fig. 2 is the structural representation of the micro-pen that apparatus of the present invention adopted;
Fig. 3 is the principle schematic of apparatus of the present invention;
Fig. 4 is the structural representation of a kind of embodiment of apparatus of the present invention.
Embodiment
The present invention is further described below in conjunction with drawings and Examples.
Shown in Fig. 1 (a)～(d), the step of the inventive method is:
(1) on Si substrate 1 spin coating thickness be the polymeric material of 5～8 μ m as under-clad layer 2, perhaps adopting chemical vapor deposition growth one layer thickness on Si substrate 1 is the SiO of 5～8 μ m
2As under-clad layer 2.The refractive index of polymeric material is between 1.4～1.6, as fluorinated polyimide.
(2) adopt special direct-writing device according to track polymeric material directly to be write on the under-clad layer 2 according to designed sandwich layer pattern;
(3) under vacuum condition, make it that cross-linking reaction take place the polymeric material heating, solidify to form sandwich layer 3.
The range of viscosities of the polymeric material of preparation sandwich layer 3 is 2Pas～200Pas, and its refraction is greater than the refractive index of under-clad layer material, the fluorinated polyimide material high as refractive index.
(4) the present invention can adopt air as top covering, or is lower than material spin coating formation top covering 4 on sandwich layer 3 of sandwich layer with refractive index, as the low fluorinated polyimide of refractive index, polymethylmethacrylate (PMMA) etc.
The composition that the present invention prepares sandwich layer and the employed polymeric material of top covering does not have special requirement, can adopt the employed various materials of preparation optical waveguide in the prior art.
The structural representation of the employed special direct-writing device of above-mentioned steps (2) as shown in Figure 2, source of the gas 5 links to each other with pressure control device 7 by tracheae 6.Pressure control device 7 links to each other with micro-pen 9 by the tracheae 8 of exerting pressure, be used for controlling exert pressure tracheae 8 air-flows break-make and regulate the air pressure size, and the slurry in the storage cavity of micro-pen 9 provides required pressure.Under normal conditions, the pressure by air pressure scope of exerting pressure in the pen container is 0.001MPa-0.50MPa.The structure of micro-pen 9 as shown in Figure 3, reliever 12 is positioned at the cap for brush 13, and link to each other with the tracheae 8 of exerting pressure that is positioned at the cap for brush 13 tops, the lower end of the cap for brush 13 is threaded with the upper end of pen container 16 and realizes sealing, constitute storage cavity 14, storage cavity 14 is used to store polymeric material to be deposited 15, and the lower end of pen container 16 is a nib 17.The effect of reliever 12 is to make air pressure more gently to be added in the storage cavity 14, and the size of exerting pressure is a factor that influences live width.The size of nib 17 internal diameters also is one of principal element that influences live width in addition, generally, the internal diameter of nib 17 is 20 μ m～200 μ m, and external diameter is 120 μ m～260 μ m, is specifically selected according to required line thickness of writing and the size that applies air pressure.
When pressure control device 7 is connected, in the pen container of micro-pen, exert pressure, slurry is flowed out from nib 17; Release the pressure in the micro-pen pen container during disconnection, because the capillary action of nib makes slurry in time stop outflow.When micro-pen was mobile on substrate, nib 17 just can be write the optical waveguide of required pattern and live width on substrate.
Example 1
As shown in Figure 4, second pressure regulator valve 23, the 3rd tensimeter 24 and solenoid valve 25 series connection constitute pressure control device 7.Compressed nitrogen source of the gas 18 links to each other with second pressure regulator valve 23 with second tensimeter 22 through gas source switch 19, first tensimeter 20, first pressure regulator valve 21 successively.When solenoid valve 25 is opened, air-flow successively by each parts after the tracheae 8 of exerting pressure enters micro-pen 9.Micro-pen 9 is contained on the worktable 26, and substrate 10 is fixed on the worktable 26, and controller 27 is by the motion of Electric Machine Control micro-pen 9.The internal diameter of nib 17 is 60 μ m in the micro-pen 9, and external diameter is 120 μ m.
At first open gas source switch 19 during use, compressed nitrogen source of the gas 18 is just supplied with the gas of certain pressure, and its pressure is measured by first tensimeter 20, and first pressure regulator valve 21 is regulated output pressure, and output pressure is measured by second tensimeter 22 of monitoring output pressure.Monitoring second tensimeter 24 monitoring, second pressure regulator valve 23 of the air pressure pressure after regulating of exerting pressure, to guarantee to supply with by solenoid valve 25 air-flow of constant pressures, this air communication is crossed the tracheae 8 of exerting pressure and is entered in the micro-pen 9.First solenoid valve 25 is controlled its break-make by controller 27 by control chip.
Adopt this device to make optical waveguide according to following processing step:
(1) cleans the Si substrate, on clean Si sheet, adopt chemical vapour deposition technique (CVD) deposition SiO
2, thickness is 7 μ m.
(2) directly write sandwich layer.According to the waveguiding structure requirement, the refractive index of core material is core material greater than covering so adopt the higher fluorinated polyimide of fluorinated volume, and its refractive index is 1.565.With fluorinated polyimide material tetrahydrofuran and N, the mixed solvent of 2: 1 by volume proportionings of dinethylformamide is made into the solution that concentration is 1.0g/ml, this solution is packed in the micro-pen, open source of the gas, the adjustment gaseous tension is 0.006～0.010Mpa, adjusts the height of fine nib to substrate (substrate of existing under-clad layer), start microcomputer and set the waveguide figure, start numerically-controlled machine, straight writing rate is set at 2mm/s, so just can directly write out waveguide core layer fast on substrate.Gained sandwich layer width is 110 μ m.Finish writing the after-baking sandwich layer, in vacuum drying oven, heated up 50 ℃, be raised to 350 ℃ of constant temperature and got final product in 24 hours every 4 hours.
Make top covering with air in the present embodiment, just without the spin coating top covering.With the prepared optical waveguide of this process, its loss can be lower than 0.5dB/cm.
Example 2
(1) on clean Si sheet, adopts chemical vapour deposition technique (CVD) deposition SiO
2, thickness is 7 μ m.
(2) directly write sandwich layer.According to the waveguiding structure requirement, the refractive index of core material is core material greater than covering so adopt the higher fluorinated polyimide of fluorinated volume, and its refractive index is 1.565.With fluorinated polyimide material tetrahydrofuran and N, the mixed solvent of 2: 1 by volume proportionings of dinethylformamide is made into the solution that concentration is 1.0g/ml, this solution is packed in the micro-pen, open source of the gas, the adjustment gaseous tension is 0.001Mpa, adjusts the height of fine nib to substrate (substrate of existing under-clad layer), start microcomputer and set the waveguide figure, start numerically-controlled machine, straight writing rate is set at 3mm/s, so just can directly write out waveguide core layer fast on substrate.Gained sandwich layer width is 80 μ m.Finish writing the after-baking sandwich layer, in vacuum drying oven, heated up 50 ℃, be raised to 350 ℃ of constant temperature and got final product in 24 hours every 4 hours.
(3) spin coating top covering, (PMMA) makes the top covering material with polymethylmethacrylate, and desire is changeed 600r/min during spin coating, and the time is 6s; High speed rotating 800r/min, the time is 20s, obtains the top covering film, thickness is 8 μ m.Do thermal treatment after coating, dried 20 minutes, and made the solvent evaporates in the top covering complete for 30 ℃.With the prepared optical waveguide of this process, its loss can be lower than 0.5dB/cm.
Example 3
(1) cleaning the clean higher fluorinated polyimide film of Si substrate spin coating fluorinated volume, its refractive index: 1.565, thickness is 5～8 μ m.
(2) directly write sandwich layer.According to the waveguiding structure requirement, the refractive index of core material is greater than covering, and adopting the lower fluorinated polyimide of fluorinated volume is core material, its refractive index 1.578.With this material tetrahydrofuran and N, the mixed solvent of 2: 1 by volume proportionings of dinethylformamide is made into the solution that concentration is 1.0g/ml.This solution is packed in the micro-pen, open source of the gas, the adjustment gaseous tension is 0.001Mpa, adjust the height of fine nib to substrate (substrate of existing under-clad layer), start microcomputer and set the waveguide figure, start numerically-controlled machine, straight writing rate is set at 3mm/s, so just can directly write out waveguide core layer fast on substrate.Gained sandwich layer width is 80 μ m.Finish writing the after-baking sandwich layer, in vacuum drying oven, heated up 50 ℃, be raised to 350 ℃ of constant temperature and got final product in 24 hours every 4 hours.
Make top covering with air in the present embodiment, just without the spin coating top covering.With the prepared optical waveguide of this process, its loss can be lower than 0.5dB/cm.
Claims (3)
1. special direct-writing device that is used to prepare polymer optical wave guide, it is characterized in that: source of the gas (5) links to each other with pressure control device (7) by tracheae (6), pressure control device (7) links to each other with micro-pen (9) by the tracheae of exerting pressure (8), pressure control device (7) is used for controlling the break-make of tracheae (8) air-flow of exerting pressure and regulating the air pressure size, and the slurry in the storage cavity of micro-pen (9) provides required pressure.
2. special direct-writing device according to claim 1, it is characterized in that: the structure of micro-pen (9) is: reliever (12) is positioned at the cap for brush (13), and link to each other with the tracheae of exerting pressure (8) that is positioned at the cap for brush (13) top, the lower end of the cap for brush (13) is threaded with the upper end of pen container (16) and realizes sealing, constitute storage cavity (14), storage cavity (14) is used to store polymeric material to be deposited, and the lower end of pen container (16) is nib (17).
3. special direct-writing device according to claim 1 and 2 is characterized in that: pressure control device (7) is made of pressure regulator valve, tensimeter and solenoid valve series connection.
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| CNB2006100199237A CN100424531C (en) | 2006-08-07 | 2006-08-07 | Method for producing polymer light waveguide andits special direct-writing device |
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| CNB2006100199237A CN100424531C (en) | 2006-08-07 | 2006-08-07 | Method for producing polymer light waveguide andits special direct-writing device |
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| CN2008100929008A Division CN101609180B (en) | 2006-08-07 | 2006-08-07 | Method for preparing polymer optical waveguide |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2009036924A (en) * | 2007-07-31 | 2009-02-19 | Nitto Denko Corp | Optical waveguide film, optical substrate and methods for manufacturing the same |
| CN110412686A (en) * | 2019-08-07 | 2019-11-05 | 深圳鑫振华光电科技有限公司 | The preparation method of optical waveguide |
| CN110716261B (en) * | 2019-09-18 | 2022-03-18 | 东南大学 | Multilayer flexible waveguide writing device and preparation method of multi-cladding polymer waveguide |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4485387A (en) * | 1982-10-26 | 1984-11-27 | Microscience Systems Corp. | Inking system for producing circuit patterns |
| US5317657A (en) * | 1992-07-30 | 1994-05-31 | International Business Machines Corporation | Extrusion of polymer waveguides onto surfaces |
| CN1365500A (en) * | 1999-07-29 | 2002-08-21 | 康宁股份有限公司 | Direct writing of optical device in silica-based glass using femtosecond pulse lasers |
| US20040120676A1 (en) * | 2002-12-23 | 2004-06-24 | Lee Woo Jin | Method for manufacturing optical waveguide using laser writing method and optical waveguide manufactured by using the same |
| CN1508896A (en) * | 2002-07-24 | 2004-06-30 | 通用汽车公司 | Method for forming catalytic dressing on substrate |
| US20050235869A1 (en) * | 2002-08-26 | 2005-10-27 | Sylvain Cruchon-Dupeyrat | Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair |
-
2006
- 2006-08-07 CN CNB2006100199237A patent/CN100424531C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4485387A (en) * | 1982-10-26 | 1984-11-27 | Microscience Systems Corp. | Inking system for producing circuit patterns |
| US5317657A (en) * | 1992-07-30 | 1994-05-31 | International Business Machines Corporation | Extrusion of polymer waveguides onto surfaces |
| CN1365500A (en) * | 1999-07-29 | 2002-08-21 | 康宁股份有限公司 | Direct writing of optical device in silica-based glass using femtosecond pulse lasers |
| CN1508896A (en) * | 2002-07-24 | 2004-06-30 | 通用汽车公司 | Method for forming catalytic dressing on substrate |
| US20050235869A1 (en) * | 2002-08-26 | 2005-10-27 | Sylvain Cruchon-Dupeyrat | Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair |
| US20040120676A1 (en) * | 2002-12-23 | 2004-06-24 | Lee Woo Jin | Method for manufacturing optical waveguide using laser writing method and optical waveguide manufactured by using the same |
Non-Patent Citations (6)
| Title |
|---|
| Direct-Write Fabrication of Integrated,Multilayer Passive Components. D. Dimos, B.H.King, P. Yang.International Symposium on Advanced Packaging Materials. 1999 |
| Direct-Write Fabrication of Integrated,Multilayer Passive Components. D. Dimos, B.H.King, P. Yang.International Symposium on Advanced Packaging Materials. 1999 * |
| Micro-Jet Printing of Polymers for Electronics Manufacturing. Donald J.Hayes, W. Royall Cox.Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. 1998 |
| Micro-Jet Printing of Polymers for Electronics Manufacturing. Donald J.Hayes, W. Royall Cox.Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. 1998 * |
| TM-Pass Electro-Optic APC-CPW Polymeric Modulators with Poling-Induced Waveguides and Self-Aligned Electrodes. S. Kim, K. Geary, D. Chang, et al.OFC,Vol.1 No.WD2. 2003 |
| TM-Pass Electro-Optic APC-CPW Polymeric Modulators with Poling-Induced Waveguides and Self-Aligned Electrodes. S. Kim, K. Geary, D. Chang, et al.OFC,Vol.1 No.WD2. 2003 * |
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