CN200950436Y - Super-thin pencil for writing directly electronic/photoelectronic component - Google Patents
Super-thin pencil for writing directly electronic/photoelectronic component Download PDFInfo
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- CN200950436Y CN200950436Y CN 200620098191 CN200620098191U CN200950436Y CN 200950436 Y CN200950436 Y CN 200950436Y CN 200620098191 CN200620098191 CN 200620098191 CN 200620098191 U CN200620098191 U CN 200620098191U CN 200950436 Y CN200950436 Y CN 200950436Y
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Abstract
The utility model discloses a micro-pen for directly writing electronic devices/optoelectronic devices. A decompression device is arranged in the pen cap, and connects with the pressure tube in the top end of the pen cap. The low end of the pen cap and the top of the pen tube are sealed and can move relative to each other thus forming a material storage cavity for storing the materiel needs to be precipitated. The penpoint is arranged at the low end of the pen tube. The micro-pen connects with the air source through two parallelly connected pressure control devices; the controller controls the on-off of the two gas paths and the relative motion of the micro-pen to the baseplate, thus forming a direct writing device. The micro-pen can be used for manufacturing the electronic devices, and optoelectronic devices such as polymer waveguide. Considering the structure of the micro-pen and the character of the polymer material, the polymer material can be arranged in the micro-pen, and then optical waveguide can be directly written on the baseboard. The utility model is characterized in that the wiring efficiency is high, the line width rang is large, and the manufacturing and operation cost are low. The wiring speed is between 2mm/s and 15mm/s, the line width is between 0.06 mm and 2mm.
Description
Technical field
The invention belongs to electronics/photoelectron element and make the field, be specifically related to a kind of micro-pen of directly writing electronics/photoelectron element.The present invention is particularly useful for making fast lead, resistance, electric capacity, inductance and fiber waveguide etc.
Background technology
The generation of large scale integrated circuit and development increase substantially current densities, and constantly develop to high accuracy, high density, fine rule, aperture, high reliability, low cost and automatic continuous production direction.Particularly in recent years, along with electronic product constantly to integrated, miniaturization, effect, small lot, many kinds direction develop in short-term, the factor that restriction electronic product quality further improves changes chip chamber interconnection line spacing, the i.e. size of substrate and wiring density into by original chip size size.Traditional printed circuit board process for making (as silk screen process, photochemistry etching etc.) more and more can not satisfy these requirements, and main cause is: manufacturing process is many, and minimum feature and distance between centers of tracks are very limited; Because the electric conducting material of erosion removal is many, the waste that causes is big; Environmental pollution is serious etc.In addition, the cycle of making wiring board of conventional fabrication processes is longer, can't effectively shorten the new product research and development cycle; Circuit board is in case the making completion can't be carried out necessary modification to designed conducting wire; For single-piece or small lot batch manufacture circuit board, manufacturing cost is higher.These deficiencies have restricted the application of this technology in some frontiers.
In recent years, direct writing technology has become one of the focus of attention of engineers and technicians in the electronic manufacturing field.So-called direct writing technology, in electronic manufacturing field, be meant and adopt special machining tool, can be according to computer program preset shape and dimensional requirement, remove or deposit specified various materials at specified substrate surface, form the technology and the technology of required functional structure.Compare with traditional substrate fabrication techniques, therefore advantages such as direct writing technology has does not need mask, accuracy of manufacture height, be easy to revise, the lead time is short, the material range of choice is wide, stock utilization is high, required cost is low, environmental pollution is little have broad application prospects in electronic manufacturing field.The process that can be used for directly writing is a lot, mainly is divided into two kinds of subtractive process and addition processes.Subtractive process refers to adopt particular tool to carry out removal processes such as etching or engraving at substrate surface, simple and reliable process, employed instrument can be focused ion beam, laser beam, diamond cutter etc., but the micro-structural function of manufacturing mainly is confined to the substrate associated materials.Addition process refers to adopt special instrument to add the process that new material forms micro-structural at substrate surface.Be that with the difference of subtractive process maximum the material that addition process is added is not subjected to the restriction of baseplate material, therefore the micro-structural kind that can prepare is more, and function is also more extensive.In numerous addition process direct writing technologies, comparative maturity and application mainly contain Micropen direct writing technology and M3D technology more widely.
The Micropen direct writing technology adopts electric slurry as adding material, control the output variable size of slurry by custom-designed micro-pen system---a kind of leading screw and nut mechanism is realized the plunger reciprocating motion---, slurry flows out by nozzle and appropriately contacts the formation rete with substrate surface, directly writes out designed pattern under the control of digital control system.This technology is introduced to the market by OhmCraft company by Sandia National Lab and University of New Mexico's cooperative research and development.When Micropen directly writes, rheological behavior such as viscosity, the surface tension etc. of material must be taken all factors into consideration, and the surface roughness of attention and substrate, straight writing rate and the isoparametric coupling of live width, the function element or the structure of better quality could be obtained.Micropen technology is the earliest direct writing technology to be introduced one of several technologies that electronic devices and components make fast, has initiative meaning aspect a lot, as directly writing out 13 layers electronic component and integrated RC filter etc.Be characterized in that micro-pen mechanism is suitable for the very slurry of wide range of viscosities.But its major defect is the equipment more complicated, and is prone to the step-out phenomenon when commutation, causes prepared component quality stability to reduce.The specific design method of directly writing wiring about Micropen sees United States Patent (USP) for details: " Carl E; Drumheller.Inking System for Producing Circuit Patterns.UnitedStates; United States Patent, 4485387,1984. "
M3D (Maskless Mesoscale Material Deposition) technology does not promptly have mask mesoscale material deposition technique, is one of very fast direct writing technology of development in recent years, by U.S. SandiaNational Lab research, Optomec Inc. exploitation.This technology atomization system atomized slurry, and in conjunction with the jet deposition system, with the slurry after the atomizing with the certain speed jet deposition to substrate, form desired electronics pattern.The characteristics of M3D are spacings of nozzle and substrate when changing within several millimeters, still can obtain uniform fine rule; Prepared characteristic line breadth is less, and it is more even to connect up, and can be used for the little manufacturing on the curved substrate and the three-dimensional manufacturing of other shape.But, the disadvantage of this technology be the slurry viscosity scope that can atomize too small, only in 0.7-1000 * 10
-3Between the PaS, the type of stock that therefore can be suitable for is less, the electronic devices and components kind that can prepare limited.
Summary of the invention
The object of the present invention is to provide a kind of micro-pen for preparing electronics/photoelectron element, this micro-pen is simple in structure, and cost is lower, and applicable slurry viscosity scope is wide.
A kind of micro-pen of directly writing electronics/photoelectron element provided by the invention, it is characterized in that: decompressor is positioned at the cap for brush, and link to each other with the tracheae of exerting pressure that is positioned at cap for brush top, the upper end activity of the lower end of the cap for brush and pen container, the formation that is tightly connected storage cavity, storage cavity is used to store the material of needs deposition, and the lower end of pen container is a nib.
As the improvement project of above-mentioned micro-pen, the outer cover of above-mentioned pen container and nib is connected to a shell, forms the air-flow lead-in cavity between a shell and pen container and the nib, and a shell is provided with the atomizing tracheae, and the lower end of air-flow lead-in cavity is the valve coaxial with nib; The internal diameter of above-mentioned nib is 20 μ m--200 μ m, and external diameter is 120 μ m--260 μ m; Gap between nib and valve is 5 μ m--20 μ m.
Micro-pen of the present invention can constitute injection or direct-writing device, is fit to some manufacturings than the large tracts of land components and parts.The present invention has overcome existing both at home and abroad direct-writing device complex structure, cost height, shortcoming such as applicability is not strong.Compared with prior art, the present invention has following characteristics:
(1) micro-pen of the present invention is simple in structure, and processing and manufacturing is easy, and processing cost is low, and dismounting and cleaning are convenient during use.When directly writing, the preparation time is short, and is easy and simple to handle.
(2) this micro-pen can utilize gas pressure accurately control write out what of slurry, and then decision line thickness or thicknesses of layers, utilize the motion of the break-make of gas and lathe simultaneously and stop accurately to control the fine straight start-stop of writing, that can satisfy various complex micro structures directly writes technological requirement.
(3) this micro-pen has and uses with a kind of basic structure, realizes the ability of difference in functionality.Just when only adopting the basic structure of micro-pen, can carry out squash type and directly write, that satisfies narrow linewidth, heavy viscous material directly writes requirement.After adding a shell on the basic structure at micro-pen, then also can carry out injecting type and directly write, utilize the slurry divergence characterization of atomization process, realize the large tracts of land film forming fast, equably, to satisfy the needs that electronic devices and components are made in the electronics industry.
(4) this micro-pen not only is used to make electronic devices and components, but also can be used for making photoelectron element, as polymer optical wave guide.In conjunction with the design feature of this micro-pen and the characteristic of polymeric material, polymeric material can be placed in the micro-pen, on substrate, directly write out fiber waveguide.
(5) above-mentioned micro-pen and corresponding lathe and control device combination are formed the micro-pen direct-writing device, satisfy the quick manufacturing of multiple electronic devices and components and opto-electronic device.Apparatus of the present invention cloth linear velocity is fast, and the live width scope is big, and manufacturing and operating cost are low, and the wiring velocity interval is 2mm/s～15mm/s, and the live width scope is 0.06mm～2mm.
Description of drawings
Fig. 1 is the structural representation of micro-pen of the present invention;
Fig. 2 is the structural representation of another execution mode of micro-pen of the present invention;
Fig. 3 is the structural representation of the device of application micro-pen of the present invention;
Fig. 4 is the structural representation of a kind of application example of micro-pen of the present invention.
Embodiment
The present invention is further described below in conjunction with drawings and Examples.
As shown in Figure 1, the structure of micro-pen of the present invention is: decompressor 2 is positioned at the cap for brush 3, and link to each other with the tracheae 1 of exerting pressure that is positioned at the cap for brush 3 tops, the lower end of the cap for brush 3 seals by being threaded and guaranteeing with the upper end of pen container 6, constitute storage cavity 4, storage cavity 4 is used to store the material 5 of needs deposition, and the lower end of pen container 6 is the slurry outlet of micro-pen, and promptly nib 7.The effect of decompressor 2 is to make air pressure more gently to be added on the pen container 6, is unlikely to because the inside and outside excessive pressure differential of storage cavity makes slurry spray at a high speed.When reality was directly write, the size of the external pressure that applies was one of principal element that influences live width.The size of nib 7 bores is another factors that influence live width.Generally, the internal diameter of nib 7 is 20 μ m--200 μ m, and external diameter is 120 μ m--260 μ m, and its concrete numerical value is selected according to required line thickness of writing and the size that applies air pressure.When micro-pen moves, start corresponding baroswitch on substrate.Slurry in the storage cavity or other functional material just flow out by nib 7, write the lead of required form and live width or fiber waveguide figure etc. on substrate.
Another execution mode of micro-pen of the present invention as shown in Figure 2, pen container 6 is connected to a shell 10 with the outer cover of nib 7, form air-flow lead-in cavity 9 between shell 10 and pen container 6 and the nib 7, shell 10 is provided with atomizing tracheae 8, the lower end of air-flow lead-in cavity 9 is the valve 11 coaxial with nib, and the gap that nib 7 and valve are 11 is about 5 μ m--20 μ m.Atomization air flow is after tracheae 7 enters air-flow lead-in cavity 9 by atomizing, and the electric slurry in air-flow and the pen container or other functional material are respectively from valve 11 and nib 7 coaxial ejections, and air-flow is at the lower end of nib 7 formation negative pressuren zone.Because negative pressure and add air pressure by 2 pairs of slurry institutes of tracheae 1 and decompressor applied pressure of exerting pressure makes the slurries in the pen container 6 evenly flow out continuously from nib 7.The slurry that flows out is atomized aerodynamic atomization and becomes droplet, descending with air-flow, when droplet at a high speed runs into substrate, just under deposition on the substrate, when nib 7 is mobile on substrate, when perhaps substrate moves with respect to nib 7,, just can on substrate, prepare needed electronic devices and components according to the route that graphic file is set.
By direct-writing device that above-mentioned micro-pen constituted as shown in Figure 3, source of the gas 12 links to each other with second pressure control device 18 with first pressure control device 14 respectively by tracheae 13, air pressure and throughput can be controlled and regulate to first pressure control device 14 and 18 parallel connections of second pressure control device independently.First pressure control device 14 links to each other with micro-pen 15 by the tracheae 1 of exerting pressure, and be used for controlling the exert pressure break-make of tracheae 1 air-flow and the size of regulating air pressure, and the slurry in the storage cavity of micro-pen 15 provides required pressure.When first pressure control device 14 is connected, in the pen container of micro-pen, exert pressure, slurry flowed out from nib.; Release the pressure in the pen container of micro-pen during disconnection, because the capillarity of nib makes slurry in time stop outflow.Second pressure control device 18 links to each other with the air-flow lead-in cavity 9 of micro-pen 15 by the tracheae 8 that atomizes, and is used to control the break-make of atomization air flow and the size of regulating atomization air pressures in the air-flow lead-in cavity 9, makes the slurry that nib flows out be atomized aerodynamic atomization formation droplet.The break-make of the break-make of atomization air flow and the air-flow of exerting pressure is synchronous generally speaking.Under normal conditions, the pressure by air pressure scope of exerting pressure in the pen container is 0.001Mpa-0.50Mpa, and the pressure limit of the atomization air pressure that air-flow lead-in cavity 9 is applied is 0.10Mpa-1.0Mpa.
Embodiment 1:
The formation of whole micro-pen direct-writing device as shown in Figure 4.First pressure control device 14 is identical with second pressure control device, 18 structures, and the former is in series by pressure regulating valve 25, Pressure gauge 26 and electromagnetically operated valve 27, and the latter is in series by pressure regulating valve 31, Pressure gauge 30 and electromagnetically operated valve 29.Compressed nitrogen source of the gas 19 links to each other with three-way pipe 24 with Pressure gauge 23 through gas source switch 20, Pressure gauge 21, pressure regulating valve 22 successively, and one of three-way pipe 24 brings out mouth and links to each other with pressure regulating valve 25 by tracheae, and other end outlet links to each other with pressure regulating valve 31 by tracheae.Substrate 16 is positioned on the workbench 28, and controller 17 is by the motion of Electric Machine Control workbench 28.Micro-pen 15 adopts structure shown in Figure 1, and wherein the internal diameter of nib 7 is 120 μ m.At first open gas source switch 20 during use, compressed nitrogen source of the gas 19 is just supplied with the gas of certain pressure, and its pressure is measured by Pressure gauge 21, and output pressure is regulated output pressure by pressure regulating valve 22, and output pressure is measured by Pressure gauge 23.The input air-flow is divided into two-way by three-way pipe 24.One the tunnel is the air-flow of exerting pressure, and it is the pressure after regulating by pressure regulating valve 25 by Pressure gauge 26 monitorings, and to guarantee to supply with by electromagnetically operated valve 27 air-flow of constant pressure, this air communication is crossed the tracheae 1 of exerting pressure and linked to each other with the pressure reducer 3 of micro-pen 15; Another road is an atomization air flow, and it is the pressure after regulating by pressure regulating valve 31 by Pressure gauge 30 monitorings, and to guarantee to supply with by electromagnetically operated valve 29 air-flow of constant pressure, this air communication is crossed atomizing tracheae 8 and linked to each other with the air-flow lead-in cavity 9 of micro-pen 15.
Carry out squash type when directly writing when direct-writing device adopts micro-pen structure shown in Figure 1,, therefore should close pressure regulating valve 31 because do not need atomization process.Controller 17 is controlled the break-make of electromagnetically operated valve 27 on the one hand, to guarantee micro-pen 15 operate as normal, also passes through the motion of Electric Machine Control workbench 28 on the other hand.Substrate 16 is fixed on the workbench, can do relative motion with micro-pen, and substrate 16 is to the adjustable height of micro-pen 15, and this highly directly has influence on the size of live width.
After above-mentioned work is ready, just can the start-up control device, pre-designed line pattern is directly write in beginning on substrate.As the air pressure P that exerts pressure that is adjusted to pen container
1=0.05MPa, cloth linear velocity V=10mm/s, slurry adopts the high temperature silver conductive paste, and the lead live width that obtains is 0.25mm.After measured, the conductivity of prepared lead is good, and its resistivity is 2.4 * 10
-6Ω cm meets the requirement of electronics industry standard fully.
When carrying out spray regime according to micro-pen shown in Figure 2 when directly writing, need to open second pressure control device 18 shown in Figure 4, gas circuit promptly atomizes.Spray when directly writing, the internal diameter of nib 7 is 120 μ m, and external diameter is 180 μ m, and the gap that nib 7 and valve are 11 is 10 μ m.
Adopt such apparatus structure can realize directly writing based on ejector principle.When directly writing, slurry will be atomized earlier, is deposited on then on the substrate, by the motion of Control work platform, obtains different shapes.When atomizing was directly write, nib is contact substrate not, therefore can make electronic devices and components on curved surface; Simultaneously, in when atomizing slurry is had disperse function, the resolution of live width will reduce when directly writing, and still carry out the large-area advantage that has when directly writing at needs.
Spray when directly writing, directly write equally with the squash type among the embodiment 1, need regulate the output pressure of source of the gas earlier, comprise the pressure of the pressure of the gas circuit of exerting pressure and the gas circuit that atomizes.In the gas circuit of exerting pressure, by the pressure of Pressure gauge 26 monitoring pressure regulating valves 25, to guarantee to supply with by electromagnetically operated valve 27 air-flow of constant pressure, this air communication is crossed the tracheae 1 of exerting pressure and is linked to each other with the pressure reducer 3 of micro-pen 15.In the atomizing gas circuit, atomization air flow enters atomization air flow lead-in cavity 9 by atomization air pressure pressure regulating valve 31 and electromagnetically operated valve 29 and atomizing tracheae 8.Electromagnetically operated valve 27,29 is controlled its break-make by controller 17 by control chip.Its break-make order is set according to application need by control device.The size of air pressure and atomization air pressure of exerting pressure is the principal element that influences thicknesses of layers and width, its size should according to the thicknesses of layers and the width that require directly to write set.
After regulating parameter such as air pressure, the designed graphic file of input in control device is regulated the height of nib and substrate, and the start-up control device just can directly be write desired figure on substrate.As the air pressure P that exerts pressure that is adjusted to pen container
1=0.07MPa, the atomization air pressure P of air-flow lead-in cavity
2=0.22MPa, cloth linear velocity V=10mm/s, substrate 16 are to the height H=0.4mm of micro-pen 15, and slurry adopts the high temperature silver conductive paste, and the lead live width that obtains like this is 0.37mm, and after measured, the conductivity of prepared lead is good, and its resistivity is 2.33 * 10
-6Ω cm meets the requirement of electronics industry standard fully.
The device that is adopted is identical with embodiment 1, and mode of operation is identical with embodiment 1 with step.But adopt the polymer of function admirable to replace electric slurry, at this moment this device can be used to directly writing light guide.
Regulate parameters such as air pressure, set control program, with device debugging good after, the fluorinated polyimide (PI) of in micro-pen, packing into, starting drive just can write out fiber waveguide on silicon substrate, about 100 microns of duct widths, thickness are about 5 microns.Prepared fiber waveguide is led to the light experiment, the loss of test light waveguide, minimal losses can reach 0.5dB/cm, can satisfy the manufacturing requirement of opto-electronic device.
Claims (4)
1, a kind of micro-pen of directly writing electronics/photoelectron element, it is characterized in that: decompressor (2) is positioned at the cap for brush (3), and link to each other with the tracheae of exerting pressure (1) that is positioned at the cap for brush (3) top, the upper end activity of the lower end of the cap for brush (3) and pen container (6), the formation that is tightly connected storage cavity (4), storage cavity (4) is used to store the material of needs deposition, and the lower end of pen container (6) is nib (7).
2, micro-pen according to claim 1, it is characterized in that: pen container (6) is connected to a shell (10) with the outer cover of nib (7), form air-flow lead-in cavity (9) between shell (10) and pen container (6) and the nib (7), shell (10) is provided with atomizing tracheae (8), and the lower end of air-flow lead-in cavity (9) is the valve (11) coaxial with nib.
3, micro-pen according to claim 1 and 2 is characterized in that: the internal diameter of described nib (7) is 20 μ m--200 μ m, and external diameter is 120 μ m--260 μ m.
4, micro-pen according to claim 2 is characterized in that: the gap between nib (7) and valve (11) is 5 μ m--20 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620098191 CN200950436Y (en) | 2006-07-31 | 2006-07-31 | Super-thin pencil for writing directly electronic/photoelectronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620098191 CN200950436Y (en) | 2006-07-31 | 2006-07-31 | Super-thin pencil for writing directly electronic/photoelectronic component |
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| Publication Number | Publication Date |
|---|---|
| CN200950436Y true CN200950436Y (en) | 2007-09-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620098191 Expired - Fee Related CN200950436Y (en) | 2006-07-31 | 2006-07-31 | Super-thin pencil for writing directly electronic/photoelectronic component |
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| CN (1) | CN200950436Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102107559A (en) * | 2009-12-25 | 2011-06-29 | 山东华菱电子有限公司 | Method for manufacturing thermosensitive printing head |
-
2006
- 2006-07-31 CN CN 200620098191 patent/CN200950436Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102107559A (en) * | 2009-12-25 | 2011-06-29 | 山东华菱电子有限公司 | Method for manufacturing thermosensitive printing head |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070919 Termination date: 20130731 |