CN100414727C - Method for controlling thickness of coating fluorescent dye for white light LED - Google Patents
Method for controlling thickness of coating fluorescent dye for white light LED Download PDFInfo
- Publication number
- CN100414727C CN100414727C CNB2005100952852A CN200510095285A CN100414727C CN 100414727 C CN100414727 C CN 100414727C CN B2005100952852 A CNB2005100952852 A CN B2005100952852A CN 200510095285 A CN200510095285 A CN 200510095285A CN 100414727 C CN100414727 C CN 100414727C
- Authority
- CN
- China
- Prior art keywords
- coating
- white light
- light led
- fluorescent dye
- phosphor powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Abstract
Issue of uneven thickness of coated LED phosphor powder used by people currently is main reason to cause difference of angle color temperature of white light LED. The invention realizes even thickness for coating LED phosphor powder through following technical handlings: controlling granularities of phosphor powder at 3-8 micros; controlling specific gravity and viscosity of admixture of gelatin powder at 1.25-1.60g/cm3, and 20-60S; carrying out preheating by hot air under 30-90 deg.C before coating chip; drying through a certain time under 30-90 deg.C after coating. The invention possesses features of high yield, and even powder layer.
Description
Affiliated technical field
The present invention relates to a kind of method for controlling thickness of coating fluorescent dye for white light LED, belong to photoelectron luminescence technology field.
Background technology
LED (light-emitting diode, Light-Emitting Diode) is the luminescent device that a class can directly be converted into electric energy visible light and radiant energy, and it is low to have operating voltage, power consumption is little, and luminous efficiency height, emission response time are extremely short, photochromic pure, sound construction, shock resistance, vibration resistance, stable and reliable for performance, in light weight, volume is little, series of characteristics such as cost is low, development is advanced by leaps and bounds.Wherein, and even be the research and development focus of compound semiconductor overall optical electronics and semiconductor product industry based on the white light LEDs of gallium nitride GaN blue chip.White light LEDs is all solid state lighting source of a kind of novel semi-conductor.Compare with the traditional lighting technology, leading superiority such as that this new type light source has is energy-efficient, long-life, small size, easy care, environmental protection, safe in utilization, good weatherability is acknowledged as first choice of the following lighting source.The uneven thickness that traditional fluorescent material wall is coated with is the main cause that causes white light LEDs angle colour temperature difference.Therefore, people wish to have a kind of method of new control thickness of coating fluorescent dye to come out, and it can overcome above-mentioned shortcoming.
Summary of the invention
The object of the present invention is to provide a kind of control method of thickness of coating fluorescent dye, it can solve the problem that causes angle colour temperature difference because of the fluorescent material uneven thickness.
The present invention is achieved by the following technical solutions, and it is to contain YAG fluorescent material and colloid through specific ball milling, filtration, adjusting proportion, viscosity, coating, drying technology processing procedure, and concrete steps are as follows,
1, the granularity of YAG fluorescent material reaches 3-8um by ball milling,
2, with 200 orders and 500 purpose nets thin or thick partially partially fluorescent powder grain is removed,
3, epoxide-resin glue and fluorescent material being mixed into proportion is 1.25-1.60g/cm
3, viscosity is the colloid of 20-60S,
4, before the coating chip is carried out hot-air pre-heating, reaches 30-90 ℃,
5, will apply chip behind the colloid under 30-90 ℃ environment, dry for 45 seconds.
The present invention has advantages such as yield height, bisque be even.
Specific embodiment
The method of thickness of coating fluorescent dye for white light LED of the present invention,
1, gets YAG fluorescent material and carry out ball milling, make its granularity at 3-8um.
2, will remove through fluorescent powder grain thin or thick partially partially in the YAG fluorescent material of ball milling with 250 orders and 300 purpose nylon wires.
3, epoxy resin glue is mixed with fluorescent material, mixed colloid proportion is 1.50-1.55g/cm
3, viscosity is 43S.
4, coating is preceding with chip hot-air pre-heating under 40-45 ℃ condition.
5, the chip behind the coating colloid was dried 5 seconds under 40-45 ℃ environment.
The large scale LED chromaticity coordinates of making of method of the present invention is (0.3192,0.3361), and very near ideal white light point (0.33,0.33), color rendering index is about 80, and colour temperature is in the 5000-10000K scope.
Claims (1)
1. the coating thickness control method of a white light LED fluorescent powder is characterized in that,
(1) granularity of YAG fluorescent material reaches 3-8um by ball milling,
(2) with 200 orders and 500 purpose nets thin or thick partially partially fluorescent powder grain is removed,
(3) epoxide-resin glue and fluorescent material being mixed into proportion is 1.25-1.60g/cm
3, viscosity is the colloid of 20-60S,
(4) before the coating chip is carried out hot-air pre-heating, reaches 30-90 ℃,
(5) will apply chip behind the colloid under 30-90 ℃ environment, dry for 45 seconds.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100952852A CN100414727C (en) | 2005-11-04 | 2005-11-04 | Method for controlling thickness of coating fluorescent dye for white light LED |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100952852A CN100414727C (en) | 2005-11-04 | 2005-11-04 | Method for controlling thickness of coating fluorescent dye for white light LED |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1960008A CN1960008A (en) | 2007-05-09 |
CN100414727C true CN100414727C (en) | 2008-08-27 |
Family
ID=38071575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100952852A Expired - Fee Related CN100414727C (en) | 2005-11-04 | 2005-11-04 | Method for controlling thickness of coating fluorescent dye for white light LED |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100414727C (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1146015A (en) * | 1997-07-28 | 1999-02-16 | Nichia Chem Ind Ltd | Light-emitting diode and its manufacture |
US6501100B1 (en) * | 2000-05-15 | 2002-12-31 | General Electric Company | White light emitting phosphor blend for LED devices |
WO2004021461A2 (en) * | 2002-08-30 | 2004-03-11 | Gelcore Llc | Phosphor-coated led with improved efficiency |
WO2004074400A1 (en) * | 2003-02-20 | 2004-09-02 | Patent-Treuhand-Gesell Schaft Für Elektrische Glü Hlampen Mbh | Coated fluorescent substance, light emitting device comprising said substance and a method for producing said substance |
-
2005
- 2005-11-04 CN CNB2005100952852A patent/CN100414727C/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1146015A (en) * | 1997-07-28 | 1999-02-16 | Nichia Chem Ind Ltd | Light-emitting diode and its manufacture |
US6501100B1 (en) * | 2000-05-15 | 2002-12-31 | General Electric Company | White light emitting phosphor blend for LED devices |
WO2004021461A2 (en) * | 2002-08-30 | 2004-03-11 | Gelcore Llc | Phosphor-coated led with improved efficiency |
WO2004074400A1 (en) * | 2003-02-20 | 2004-09-02 | Patent-Treuhand-Gesell Schaft Für Elektrische Glü Hlampen Mbh | Coated fluorescent substance, light emitting device comprising said substance and a method for producing said substance |
Also Published As
Publication number | Publication date |
---|---|
CN1960008A (en) | 2007-05-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102034917A (en) | Optical-semiconductor encapsulating material | |
CN102034919A (en) | High-brightness high-power light-emitting diode (LED) and manufacturing method thereof | |
CN102800794A (en) | Optical wavelength conversion device and application thereof in white light emitting device | |
CN102721007A (en) | Remote phosphor structure applicable to LED lighting and production method thereof | |
CN109004071A (en) | A kind of encapsulating structure of quantum dot LED light emitting device | |
CN101887941A (en) | Preparation method of LED phosphor layer | |
CN109873070A (en) | A kind of luminescent ceramic and its preparation method and application for LED illumination | |
CN102034918A (en) | Kit for optical semiconductor encapsulation | |
CN103094461B (en) | Optical wavelength transition components, its preparation method and white light emitting device | |
CN100414727C (en) | Method for controlling thickness of coating fluorescent dye for white light LED | |
CN101572287B (en) | Method for actively packaging blue light LED chip based white light LED | |
CN207021262U (en) | A kind of three-primary color LED device of integration packaging | |
CN201221690Y (en) | LED plane illuminating device | |
CN203686842U (en) | Energy-saving street lamp | |
CN103489857B (en) | A kind of White LED light-emitting device | |
CN205488124U (en) | A COB light source for fish gathering | |
CN108191213A (en) | A kind of preparation method of composite fluorescence cloche | |
CN204189795U (en) | Arc MCOB LED encapsulation structure | |
CN203787466U (en) | LED (light emitting diode) packaging structure | |
CN207938643U (en) | A kind of emitting semiconductor structure that can send out a variety of coloured light | |
CN206040693U (en) | Blue light emitting diode wafer white light packaging hardware | |
CN205542868U (en) | Single -phase white light LED device | |
CN201448655U (en) | Light-emitting diode structure | |
CN201167098Y (en) | Low light-decline small power white light LED | |
CN204927325U (en) | Light -emitting diode packaging structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080827 Termination date: 20141104 |
|
EXPY | Termination of patent right or utility model |