CN100388446C - 用于芯片基板封装的具粘着定位技术的***及方法 - Google Patents
用于芯片基板封装的具粘着定位技术的***及方法 Download PDFInfo
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- CN100388446C CN100388446C CNB2004100461409A CN200410046140A CN100388446C CN 100388446 C CN100388446 C CN 100388446C CN B2004100461409 A CNB2004100461409 A CN B2004100461409A CN 200410046140 A CN200410046140 A CN 200410046140A CN 100388446 C CN100388446 C CN 100388446C
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100461409A CN100388446C (zh) | 2004-06-02 | 2004-06-02 | 用于芯片基板封装的具粘着定位技术的***及方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2004100461409A CN100388446C (zh) | 2004-06-02 | 2004-06-02 | 用于芯片基板封装的具粘着定位技术的***及方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1705090A CN1705090A (zh) | 2005-12-07 |
CN100388446C true CN100388446C (zh) | 2008-05-14 |
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CNB2004100461409A Expired - Fee Related CN100388446C (zh) | 2004-06-02 | 2004-06-02 | 用于芯片基板封装的具粘着定位技术的***及方法 |
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CN (1) | CN100388446C (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101494174B (zh) * | 2008-01-25 | 2010-07-21 | 华晶科技股份有限公司 | 影像撷取模组及其形成方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1165401A (zh) * | 1996-05-10 | 1997-11-19 | 三星电子株式会社 | 未封装半导体芯片的测试装置 |
JPH10303225A (ja) * | 1997-04-23 | 1998-11-13 | Toshiba Corp | 電子部品のマウント装置とその方法および実装装置 |
CN1330400A (zh) * | 2000-07-03 | 2002-01-09 | Esec贸易公司 | 把半导体芯片安装到柔性基片上的方法和装置 |
US20030190795A1 (en) * | 2002-04-08 | 2003-10-09 | Hitachi, Ltd. | Method of manufacturing a semiconductor device |
-
2004
- 2004-06-02 CN CNB2004100461409A patent/CN100388446C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1165401A (zh) * | 1996-05-10 | 1997-11-19 | 三星电子株式会社 | 未封装半导体芯片的测试装置 |
JPH10303225A (ja) * | 1997-04-23 | 1998-11-13 | Toshiba Corp | 電子部品のマウント装置とその方法および実装装置 |
CN1330400A (zh) * | 2000-07-03 | 2002-01-09 | Esec贸易公司 | 把半导体芯片安装到柔性基片上的方法和装置 |
US20030190795A1 (en) * | 2002-04-08 | 2003-10-09 | Hitachi, Ltd. | Method of manufacturing a semiconductor device |
Non-Patent Citations (2)
Title |
---|
SMT生产线设备简介. 顾霭云.世界产品与技术,第5期. 2001 |
SMT生产线设备简介. 顾霭云.世界产品与技术,第5期. 2001 * |
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CN1705090A (zh) | 2005-12-07 |
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