CH669477A5 - - Google Patents
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- Publication number
- CH669477A5 CH669477A5 CH4004/85A CH400485A CH669477A5 CH 669477 A5 CH669477 A5 CH 669477A5 CH 4004/85 A CH4004/85 A CH 4004/85A CH 400485 A CH400485 A CH 400485A CH 669477 A5 CH669477 A5 CH 669477A5
- Authority
- CH
- Switzerland
- Prior art keywords
- layer
- housing
- component
- polymer
- protective layer
- Prior art date
Links
- 229920000642 polymer Polymers 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 20
- 239000010410 layer Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 description 12
- 230000001681 protective effect Effects 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000004049 embossing Methods 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 239000002184 metal Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N Nitrogen dioxide Chemical class O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01024—Chromium [Cr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01052—Tellurium [Te]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI843631A FI76220C (fi) | 1984-09-17 | 1984-09-17 | Foerfarande foer inkapsling av pao ett baerarband anordnade halvledarkomponenter. |
Publications (1)
Publication Number | Publication Date |
---|---|
CH669477A5 true CH669477A5 (es) | 1989-03-15 |
Family
ID=8519611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH4004/85A CH669477A5 (es) | 1984-09-17 | 1985-09-16 |
Country Status (8)
Country | Link |
---|---|
BE (1) | BE903242A (es) |
CA (1) | CA1232372A (es) |
CH (1) | CH669477A5 (es) |
DE (1) | DE3533159A1 (es) |
FI (1) | FI76220C (es) |
FR (1) | FR2570544B1 (es) |
GB (1) | GB2164794B (es) |
SE (1) | SE8504295L (es) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3338597A1 (de) * | 1983-10-24 | 1985-05-02 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
GB2202372B (en) * | 1984-07-05 | 1991-02-13 | Nat Semiconductor Corp | Pre-testable semiconductor die package and fabrication method |
FR2598258B1 (fr) * | 1986-04-30 | 1988-10-07 | Aix Les Bains Composants | Procede d'encapsulation de circuits integres. |
DE3623419A1 (de) * | 1986-07-11 | 1988-01-21 | Junghans Uhren Gmbh | Verfahren zum bestuecken eines leiterbahnen-netzwerkes fuer den schaltungstraeger eines elektromechanischen uhrwerks und teilbestuecktes leiterbahnen-netzwerk eines uhrwerks-schaltungstraegers |
JPH02155256A (ja) * | 1988-12-08 | 1990-06-14 | Mitsubishi Electric Corp | 半導体装置 |
JP2751450B2 (ja) * | 1989-08-28 | 1998-05-18 | セイコーエプソン株式会社 | テープキャリアの実装構造及びその実装方法 |
US5156983A (en) * | 1989-10-26 | 1992-10-20 | Digtial Equipment Corporation | Method of manufacturing tape automated bonding semiconductor package |
IT1243817B (it) * | 1990-10-09 | 1994-06-28 | Sgs Thomson Microelectronics | Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato |
KR930010072B1 (ko) * | 1990-10-13 | 1993-10-14 | 금성일렉트론 주식회사 | Ccd패키지 및 그 제조방법 |
JP2531382B2 (ja) * | 1994-05-26 | 1996-09-04 | 日本電気株式会社 | ボ―ルグリッドアレイ半導体装置およびその製造方法 |
AT402617B (de) * | 1995-07-11 | 1997-07-25 | Datacon Schweitzer & Zeindl Gm | Anlage zum automatisierten, hermetischen anlage zum automatisierten, hermetischen verschliessen von gehäusen verschliessen von gehäusen |
DE19650318C2 (de) * | 1996-09-23 | 1999-05-06 | Tech Gmbh Antriebstechnik Und | Gehäuse aus Metallblech für eine Schaltung der Leistungselektronik |
DE10117797C2 (de) * | 2001-04-10 | 2003-04-17 | Bosch Gmbh Robert | Montagevorrichtung und Verfahren zum Aufbau eines elektronischen Bauteils |
US6692610B2 (en) * | 2001-07-26 | 2004-02-17 | Osram Opto Semiconductors Gmbh | Oled packaging |
DE10151657C1 (de) * | 2001-08-02 | 2003-02-06 | Fraunhofer Ges Forschung | Verfahren zur Montage eines Chips auf einem Substrat |
TW582078B (en) * | 2002-11-29 | 2004-04-01 | Chipmos Technologies Bermuda | Packaging process for improving effective die-bonding area |
FR2919756B1 (fr) * | 2007-07-31 | 2009-11-20 | Tacchini Ets | Procede de protection d'un composant electronique. |
DE102013016697B4 (de) | 2013-08-19 | 2023-12-21 | Oechsler Aktiengesellschaft | Oberflächenmontiertes Bauelement und Verwendung davon |
CN113602557B (zh) * | 2021-08-04 | 2022-09-09 | 深圳市辉悦科技有限公司 | 具有定位二次修正功能的芯片编带机 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3979659A (en) * | 1975-01-30 | 1976-09-07 | Texas Instruments Incorporated | Automotive alternator rectifier bridges |
US4300153A (en) * | 1977-09-22 | 1981-11-10 | Sharp Kabushiki Kaisha | Flat shaped semiconductor encapsulation |
US4330790A (en) * | 1980-03-24 | 1982-05-18 | National Semiconductor Corporation | Tape operated semiconductor device packaging |
FR2520541A1 (fr) * | 1982-01-22 | 1983-07-29 | Flonic Sa | Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede |
FI72409C (fi) * | 1984-03-09 | 1987-05-11 | Lohja Ab Oy | Foerfarande foer inkapsling av pao en baerremsa anordnade halvledarkomponenter. |
-
1984
- 1984-09-17 FI FI843631A patent/FI76220C/fi not_active IP Right Cessation
-
1985
- 1985-09-06 GB GB08522166A patent/GB2164794B/en not_active Expired
- 1985-09-16 CH CH4004/85A patent/CH669477A5/de not_active IP Right Cessation
- 1985-09-16 FR FR858513669A patent/FR2570544B1/fr not_active Expired - Fee Related
- 1985-09-16 BE BE0/215586A patent/BE903242A/fr not_active IP Right Cessation
- 1985-09-16 SE SE8504295A patent/SE8504295L/xx not_active Application Discontinuation
- 1985-09-17 DE DE19853533159 patent/DE3533159A1/de not_active Withdrawn
- 1985-09-17 CA CA000490925A patent/CA1232372A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FI76220C (fi) | 1988-09-09 |
GB8522166D0 (en) | 1985-10-09 |
DE3533159A1 (de) | 1986-03-27 |
GB2164794A (en) | 1986-03-26 |
SE8504295L (sv) | 1986-03-18 |
GB2164794B (en) | 1988-03-23 |
SE8504295D0 (sv) | 1985-09-16 |
BE903242A (fr) | 1986-01-16 |
FI76220B (fi) | 1988-05-31 |
FR2570544B1 (fr) | 1990-01-05 |
FI843631A0 (fi) | 1984-09-17 |
CA1232372A (en) | 1988-02-02 |
FI843631L (fi) | 1986-03-18 |
FR2570544A1 (fr) | 1986-03-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |