Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
  • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
  • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
  • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
  • H01L27/118—Masterslice integrated circuits
  • H01L27/11801—Masterslice integrated circuits using bipolar technology
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
  • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

• Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Semiconductor Integrated Circuits (AREA)
• Design And Manufacture Of Integrated Circuits (AREA)
• Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=23920133

Family Applications (1)

Country Status (8)

Cited By (1)

Families Citing this family (16)

Family Cites Families (9)

• 1975
  • 1975-04-22 CA CA225,413A patent/CA1024661A/en not_active Expired
  • 1975-05-13 IT IT2325375A patent/IT1038108B/it active
  • 1975-05-21 FR FR7516533A patent/FR2276693A1/fr active Granted
  • 1975-05-21 GB GB2187575A patent/GB1513893A/en not_active Expired
  • 1975-05-26 DE DE19752523221 patent/DE2523221A1/de active Granted
  • 1975-06-04 JP JP6665775A patent/JPS5125085A/ja active Granted
  • 1975-06-16 CH CH775675A patent/CH583970A5/xx not_active IP Right Cessation
  • 1975-06-18 ES ES438666A patent/ES438666A1/es not_active Expired
• 1983
  • 1983-10-20 JP JP19540983A patent/JPS5989435A/ja active Pending

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