CH541871A - Dispositif pour la fixation sans soudure d'un circuit intégré sur une plaquette à circuit imprimé - Google Patents

Dispositif pour la fixation sans soudure d'un circuit intégré sur une plaquette à circuit imprimé

Info

Publication number
CH541871A
CH541871A CH1110271A CH1110271A CH541871A CH 541871 A CH541871 A CH 541871A CH 1110271 A CH1110271 A CH 1110271A CH 1110271 A CH1110271 A CH 1110271A CH 541871 A CH541871 A CH 541871A
Authority
CH
Switzerland
Prior art keywords
solder
circuit board
integrated circuit
printed circuit
free fixing
Prior art date
Application number
CH1110271A
Other languages
English (en)
Original Assignee
Burndy Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burndy Corp filed Critical Burndy Corp
Publication of CH541871A publication Critical patent/CH541871A/fr

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/1023Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CH1110271A 1970-07-27 1971-07-27 Dispositif pour la fixation sans soudure d'un circuit intégré sur une plaquette à circuit imprimé CH541871A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5852270A 1970-07-27 1970-07-27

Publications (1)

Publication Number Publication Date
CH541871A true CH541871A (fr) 1973-09-15

Family

ID=22017336

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1110271A CH541871A (fr) 1970-07-27 1971-07-27 Dispositif pour la fixation sans soudure d'un circuit intégré sur une plaquette à circuit imprimé

Country Status (11)

Country Link
US (1) US3663920A (fr)
JP (1) JPS5436452B1 (fr)
BE (1) BE770483A (fr)
CA (1) CA963584A (fr)
CH (1) CH541871A (fr)
DE (1) DE2136467A1 (fr)
ES (1) ES393650A1 (fr)
FR (1) FR2103336A5 (fr)
GB (1) GB1350131A (fr)
NL (1) NL172203C (fr)
SE (1) SE379917B (fr)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3874768A (en) * 1974-03-11 1975-04-01 John M Cutchaw Integrated circuit connector
FR2305095A1 (fr) * 1975-03-20 1976-10-15 Bonhomme F R Perfectionnements aux dispositifs de connexion pour cartes a circuits imprimes
US3954175A (en) * 1975-07-17 1976-05-04 The Singer Company Adjustable integrated circuit carrier
GB2047475B (en) * 1979-03-31 1983-05-25 Ferranti Ltd Assembly comprising a releasably clamped module and electrical connector
US4220383A (en) * 1979-04-06 1980-09-02 Amp Incorporated Surface to surface connector
US4449770A (en) * 1981-05-22 1984-05-22 Amp Incorporated Socketless separable connector
US4511201A (en) * 1982-11-05 1985-04-16 At&T Bell Laboratories Module mounting assembly
WO1984001859A1 (fr) * 1982-11-05 1984-05-10 Western Electric Co Assemblage de montage de module
US4583806A (en) * 1985-01-11 1986-04-22 Bourns, Inc. Low insertion-force socket for IC device
CH661831A5 (fr) * 1985-02-01 1987-08-14 Cfg Sa Socle pour composant electronique.
JPH0218545Y2 (fr) * 1985-10-02 1990-05-23
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US4760917A (en) * 1986-11-24 1988-08-02 Westinghouse Electric Corp. Integrated circuit carrier
GB2201049A (en) * 1987-01-29 1988-08-17 Brian Anthony Marshall Electrical connector
JP2784570B2 (ja) * 1987-06-09 1998-08-06 日本テキサス・インスツルメンツ 株式会社 ソケツト
SE501896C2 (sv) * 1993-10-12 1995-06-12 Ellemtel Utvecklings Ab Elektriskt anslutningsarrangemang
US6246247B1 (en) 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6624648B2 (en) 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US6483328B1 (en) * 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US6641408B1 (en) 2000-10-18 2003-11-04 Storage Technology Corporation Compliant contacts for conductive devices
US6699395B1 (en) 2000-10-18 2004-03-02 Storage Technology Corporation Method of forming alignment features for conductive devices
US6508674B1 (en) 2000-10-18 2003-01-21 Storage Technology Corporation Multi-layer conductive device interconnection
US6431876B1 (en) 2000-10-18 2002-08-13 Storage Technology Corporation Conductive trace interconnection
DE102005049235B4 (de) * 2004-10-20 2009-07-09 Panasonic Corp., Kadoma Schalter und Verfahren zum Herstellen desselben
US9040857B2 (en) * 2010-09-17 2015-05-26 Lg Chem, Ltd. Terminal contacting part included in a jig for charging and discharging a secondary battery and the jig including the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011379A (en) * 1957-02-05 1961-12-05 Baldwin Piano Co Electronic musical instrument with photoelectric switching
US3380016A (en) * 1965-05-03 1968-04-23 Burroughs Corp Electronic circuit package storage,forming and handling apparatus
US3377514A (en) * 1965-10-22 1968-04-09 Elco Corp Microelectronic circuit carrier
US3475657A (en) * 1967-01-03 1969-10-28 Litton Systems Inc Mounting of electronic components on baseboard or panel
US3447122A (en) * 1967-09-20 1969-05-27 Crawford Fitting Co Connector for electrical conductors

Also Published As

Publication number Publication date
NL7110016A (fr) 1972-01-31
GB1350131A (en) 1974-04-18
SE379917B (fr) 1975-10-20
CA963584A (en) 1975-02-25
NL172203C (nl) 1983-07-18
DE2136467A1 (de) 1972-02-03
FR2103336A5 (fr) 1972-04-07
BE770483A (fr) 1971-12-01
US3663920A (en) 1972-05-16
JPS5436452B1 (fr) 1979-11-09
ES393650A1 (es) 1973-08-16

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Legal Events

Date Code Title Description
PL Patent ceased