CA2737276A1 - Structure et procede de montage d'une borne - Google Patents

Structure et procede de montage d'une borne Download PDF

Info

Publication number
CA2737276A1
CA2737276A1 CA2737276A CA2737276A CA2737276A1 CA 2737276 A1 CA2737276 A1 CA 2737276A1 CA 2737276 A CA2737276 A CA 2737276A CA 2737276 A CA2737276 A CA 2737276A CA 2737276 A1 CA2737276 A1 CA 2737276A1
Authority
CA
Canada
Prior art keywords
substrate
terminal
elastic
conductor
fixing portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA2737276A
Other languages
English (en)
Inventor
Miki Yoneyama
Kohichiro Kawate
Kenji Kuwahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008236868A external-priority patent/JP5197263B2/ja
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CA2737276A1 publication Critical patent/CA2737276A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1084—Notched leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
CA2737276A 2008-09-16 2009-01-23 Structure et procede de montage d'une borne Abandoned CA2737276A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008236868A JP5197263B2 (ja) 2007-10-01 2008-09-16 端子取付け構造及び端子取付け方法
JP2008-236868 2008-09-16
PCT/US2009/031879 WO2010033259A1 (fr) 2008-09-16 2009-01-23 Structure et procédé de montage d'une borne

Publications (1)

Publication Number Publication Date
CA2737276A1 true CA2737276A1 (fr) 2010-03-25

Family

ID=42040253

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2737276A Abandoned CA2737276A1 (fr) 2008-09-16 2009-01-23 Structure et procede de montage d'une borne

Country Status (4)

Country Link
EP (1) EP2340587A1 (fr)
CN (1) CN102160240A (fr)
CA (1) CA2737276A1 (fr)
WO (1) WO2010033259A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5208816B2 (ja) * 2009-03-06 2013-06-12 日本板硝子株式会社 端子付ガラス及び端子付ガラス搭載車両
CN102738600B (zh) * 2012-06-16 2014-06-11 九星控股集团有限公司 铜材之间或铜材与其他元器件之间导电连接结构和方法
CN108351488B (zh) * 2015-08-31 2020-12-15 Lg伊诺特有限公司 透镜驱动单元、相机模块和光学仪器
US9997846B1 (en) * 2017-02-21 2018-06-12 Ford Global Technologies, Llc Window electrical terminals
DE102020004282A1 (de) * 2019-07-24 2021-01-28 AGC lnc. Elektrische verbindungsstruktur
CN112563845B (zh) * 2020-12-14 2022-09-27 湖南凯通电子有限公司 一种tph片的端子***设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001056334A1 (fr) * 2000-01-25 2001-08-02 Società Italiana Vetro - Siv - S.P.A. Vitrage muni d'une borne electrique
JP2002111346A (ja) * 2000-10-02 2002-04-12 Fujikura Ltd フィルムセンサ
EP1488972B2 (fr) * 2002-03-11 2015-06-24 Nippon Sheet Glass Company, Limited Article de verre assemble au moyen d'une fixation metallique, et structure de joint utilisant ledit article
JP2004079527A (ja) * 2002-08-01 2004-03-11 Fuji Name Plate Kk 面状ヒータ用電源供給端子及び該面状ヒータ用電源供給端子を備えた面状ヒータ
JP4276883B2 (ja) * 2003-04-30 2009-06-10 日本圧着端子製造株式会社 多層プリント配線板の接続構造
JP4276882B2 (ja) * 2003-04-30 2009-06-10 日本圧着端子製造株式会社 多層プリント配線板の接続構造
JP2005347172A (ja) * 2004-06-04 2005-12-15 Asahi Glass Co Ltd ガラス板の電気接続構造
JP2007018981A (ja) * 2005-07-11 2007-01-25 Nippon Sheet Glass Co Ltd 窓ガラスへの端子取付け構造

Also Published As

Publication number Publication date
CN102160240A (zh) 2011-08-17
WO2010033259A1 (fr) 2010-03-25
EP2340587A1 (fr) 2011-07-06

Similar Documents

Publication Publication Date Title
US20110163569A1 (en) Terminal mounting structure and method
EP0272707B1 (fr) Structure de terminaux à une plaque flexible à circuits imprimés
US7510400B2 (en) LED interconnect spring clip assembly
CA2737276A1 (fr) Structure et procede de montage d'une borne
JP2000307056A (ja) 車載用半導体装置
CN108370142B (zh) 电路结构体及电气接线盒
CN101577262A (zh) 功率半导体模块***
JPS62264647A (ja) チツプキヤリヤを用いた集積回路ボ−ド，及び該集積回路ボ−ドを製作する方法
JPH098223A (ja) 半導体パワーモジュールおよびその製造方法
JP5240982B2 (ja) 熱コンジット
CN112189383A (zh) Fpc连接结构和使用fpc连接结构连接到印刷电路板的方法
CN101292576A (zh) 适合于安装在基板上的器件和安装表面安装设备的方法
KR101676747B1 (ko) 연성접합부를 포함한 연성인쇄회로기판의 접합구조
US3238421A (en) Modified electronic module
US6858807B2 (en) Substrate for receiving a circuit configuration and method for producing the substrate
CN103379743A (zh) 电子组件和将金属体连接于柔性载体的导电线路上的方法
US10451810B1 (en) Adapter for electrically connecting a laser diode to a circuit board
JP4028160B2 (ja) フレキシブル基板の端子構造及びその製造方法
JP7414878B2 (ja) 電力変換装置
CN217064308U (zh) 一种转接电路结构
JP2013197104A (ja) 外部接続導体付き回路基板及びその製造方法
JP2013197040A (ja) フラット配線材及びそれを用いた実装体
CN216288866U (zh) 采样组件及具有其的电池模组
JPH0837048A (ja) コネクタ
WO2022217549A1 (fr) Mise à la terre de carte de circuit imprimé

Legal Events

Date Code Title Description
FZDE Dead

Effective date: 20150123