CA2347568C - Carte de circuit et methode de fabrication - Google Patents
Carte de circuit et methode de fabrication Download PDFInfo
- Publication number
- CA2347568C CA2347568C CA002347568A CA2347568A CA2347568C CA 2347568 C CA2347568 C CA 2347568C CA 002347568 A CA002347568 A CA 002347568A CA 2347568 A CA2347568 A CA 2347568A CA 2347568 C CA2347568 C CA 2347568C
- Authority
- CA
- Canada
- Prior art keywords
- circuit board
- board according
- individual
- individual layer
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10023736.3 | 2000-05-15 | ||
DE10023736A DE10023736A1 (de) | 2000-05-15 | 2000-05-15 | Leiterplatte sowie Verfahren zur Herstellung einer Leiterplatte |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2347568A1 CA2347568A1 (fr) | 2001-11-15 |
CA2347568C true CA2347568C (fr) | 2006-03-28 |
Family
ID=7642100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002347568A Expired - Fee Related CA2347568C (fr) | 2000-05-15 | 2001-05-14 | Carte de circuit et methode de fabrication |
Country Status (5)
Country | Link |
---|---|
US (1) | US6717060B2 (fr) |
EP (1) | EP1156708A3 (fr) |
JP (1) | JP2002016340A (fr) |
CA (1) | CA2347568C (fr) |
DE (1) | DE10023736A1 (fr) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020163781A1 (en) * | 2001-05-01 | 2002-11-07 | Ericsson Inc. | Integrated cooling of a printed circuit board structure |
DE10228344B4 (de) * | 2002-06-25 | 2007-02-08 | Infineon Technologies Ag | Verfahren zur Herstellung von Mikrostrukturen sowie Anordnung von Mikrostrukturen |
TWI297095B (en) * | 2003-10-02 | 2008-05-21 | Au Optronics Corp | Bonding pad structure for a display and fabrication method thereof |
DE112004002975A5 (de) * | 2004-07-20 | 2007-07-12 | Technische Universität Braunschweig | Gekühlte integrierte Schaltung |
DE102004062441B3 (de) * | 2004-12-16 | 2006-07-20 | Schweizer Electronic Ag | Mehrschichtaufbau mit Temperierfluidkanal und Herstellungsverfahren |
DE102005034998B4 (de) * | 2005-07-27 | 2016-06-23 | Behr Industry Gmbh & Co. Kg | Verfahren zur Herstellung einer Vorrichtung zur Kühlung von elektronischen Bauelementen sowie Vorrichtung zur Kühlung von elektronischen Bauelementen |
WO2007074567A1 (fr) * | 2005-12-27 | 2007-07-05 | Ibiden Co., Ltd. | Carte de câblage composite optique et électrique et procédé de fabrication de celle-ci |
JP4740765B2 (ja) * | 2006-02-24 | 2011-08-03 | エルピーダメモリ株式会社 | 半導体装置及びその製造方法 |
US7956633B2 (en) * | 2006-03-06 | 2011-06-07 | Formfactor, Inc. | Stacked guard structures |
JP2008034654A (ja) * | 2006-07-28 | 2008-02-14 | Mitsui Chemicals Inc | 配線基板の製造方法並びにその製造に用いられる配線構造体及びその製造方法 |
DE102007019576A1 (de) * | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Modulträger für ein elektronisches Modul, elektronisches Modul mit einem derartigen Modulträger, Modulanordnung mit einer Mehrzahl von Modulen und Bausatz für eine Modulanordnung |
JP2008159933A (ja) * | 2006-12-25 | 2008-07-10 | Matsushita Electric Works Ltd | 積層基板 |
US7974505B2 (en) * | 2007-10-17 | 2011-07-05 | Bae Systems Information And Electronic Systems Integration Inc. | Method for fabricating selectively coupled optical waveguides on a substrate |
WO2009104558A1 (fr) * | 2008-02-19 | 2009-08-27 | 日本電気株式会社 | Dispositif d'interconnexion optique |
CN101565160A (zh) * | 2008-04-21 | 2009-10-28 | 鸿富锦精密工业(深圳)有限公司 | 微机电***及其封装方法 |
US8179676B2 (en) * | 2010-07-21 | 2012-05-15 | Telefonaktiebolaget L M Ericsson (Publ) | Optical interconnects in cooling substrates |
US8007291B1 (en) * | 2010-10-15 | 2011-08-30 | International Business Machines Corporation | Implementing differential signal circuit board electrical contact |
DE102012013920A1 (de) | 2011-07-14 | 2013-01-17 | Hotoprint Elektronik GmbH & Co. KG | Identifizierbare mehrschichtige Leiterplatte sowie Herstellungsverfahren dazu |
DE102011089891B4 (de) * | 2011-12-23 | 2022-08-11 | Vitesco Technologies GmbH | Schaltungsträger und Verfahren zur Herstellung von einem Schaltungsträger, Schaltungsanordnung mit einem Schaltungsträger |
DE102012200343A1 (de) * | 2012-01-11 | 2013-07-11 | E.G.O. Elektro-Gerätebau GmbH | Bauteilträger, elektrischer Leiter und Verfahren zur Herstellung eines Bauteilträgers sowie eines elektrischen Leiters |
US9743555B2 (en) * | 2013-04-02 | 2017-08-22 | Gerald Ho Kim | Silicon-based heat dissipation device for heat-generating devices |
US10177065B2 (en) * | 2013-04-02 | 2019-01-08 | Gerald Ho Kim | Silicon-based heat dissipation device for heat-generating devices |
DE102013007042A1 (de) * | 2013-04-24 | 2014-10-30 | Gottfried Wilhelm Leibniz Universität Hannover | Leiterplatte und Verfahren zum Herstellen einer Leiterplatte |
KR20140144487A (ko) * | 2013-06-11 | 2014-12-19 | 에스케이하이닉스 주식회사 | 패키지 기판 및 제조 방법 |
CN104159399B (zh) * | 2014-08-01 | 2017-12-15 | 深圳市华星光电技术有限公司 | 一种电路板及显示面板 |
CN106879194A (zh) * | 2017-03-17 | 2017-06-20 | 深圳崇达多层线路板有限公司 | 一种薄芯板的水平棕化方法 |
DE102018009292A1 (de) * | 2018-11-26 | 2020-05-28 | Harting Ag | Elektrooptische Baugruppe mit Wärmeabführung sowie Verfahren zur Herstellung einer solchen Baugruppe |
EP3714822B1 (fr) | 2019-03-25 | 2023-01-18 | Erbe Elektromedizin GmbH | Dispositif de commande de fluide pour un appareil médical |
CN113286451B (zh) * | 2021-05-24 | 2022-07-19 | 四川海英电子科技有限公司 | 一种hdi多层电路板叠层导盲孔制作方法 |
US20230047568A1 (en) * | 2021-08-10 | 2023-02-16 | Imagine Tf, Llc | Printed circuit boards with embossed metalized circuit traces |
US12052830B2 (en) * | 2021-12-06 | 2024-07-30 | Advantest America, Inc. | Method and process for creating high-performance coax sockets |
CN115360170B (zh) * | 2022-10-19 | 2023-01-31 | 睿力集成电路有限公司 | 一种半导体结构及其形成方法 |
JP7518957B1 (ja) | 2023-11-29 | 2024-07-18 | 太陽ホールディングス株式会社 | 導電パターンを有する構造体 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3398232A (en) * | 1965-10-19 | 1968-08-20 | Amp Inc | Circuit board with interconnected signal conductors and interconnected shielding conductors |
US4606787A (en) * | 1982-03-04 | 1986-08-19 | Etd Technology, Inc. | Method and apparatus for manufacturing multi layer printed circuit boards |
US4604799A (en) * | 1982-09-03 | 1986-08-12 | John Fluke Mfg. Co., Inc. | Method of making molded circuit board |
DE3412290A1 (de) * | 1984-04-03 | 1985-10-03 | System Kontakt Gesellschaft für elektronische Bauelemente mbH, 7107 Bad Friedrichshall | Mehrlagige leiterplatte in multilayer- oder stapeltechnik |
US4591220A (en) * | 1984-10-12 | 1986-05-27 | Rollin Mettler | Injection molded multi-layer circuit board and method of making same |
EP0204568A3 (fr) * | 1985-06-05 | 1988-07-27 | Harry Arthur Hele Spence-Bate | Composants de circuits à basse puissance |
DE3805851A1 (de) * | 1988-02-25 | 1989-08-31 | Standard Elektrik Lorenz Ag | Leiterplatte mit einer kuehlvorrichtung |
DE4020048A1 (de) * | 1990-06-23 | 1992-01-02 | Ant Nachrichtentech | Anordnung aus substrat und bauelement und verfahren zur herstellung |
ATE154259T1 (de) * | 1991-02-28 | 1997-06-15 | Heinze Dyconex Patente | Verfahren zur herstellung eines aus mikrosieben bestehenden verbundkörpers |
US5207887A (en) * | 1991-08-30 | 1993-05-04 | Hughes Aircraft Company | Semi-additive circuitry with raised features using formed mandrels |
JPH07105420B2 (ja) * | 1991-08-26 | 1995-11-13 | ヒューズ・エアクラフト・カンパニー | 成形された接点をもった電気接続 |
JPH0773155B2 (ja) * | 1992-04-20 | 1995-08-02 | 大宏電機株式会社 | 回路部品の製造方法 |
DE59403626D1 (de) * | 1993-09-29 | 1997-09-11 | Siemens Nv | Verfahren zur Herstellung einer zwei- oder mehrlagigen Verdrahtung und danach hergestellte zwei- oder mehrlagige Verdrahtung |
JPH07170077A (ja) * | 1993-12-16 | 1995-07-04 | Hitachi Cable Ltd | 射出成形回路部品の製造方法 |
US5666272A (en) * | 1994-11-29 | 1997-09-09 | Sgs-Thomson Microelectronics, Inc. | Detachable module/ball grid array package |
US5764119A (en) * | 1995-10-16 | 1998-06-09 | Kabushiki Kaisha Toshiba | Wiring board for high-frequency signals and semiconductor module for high-frequency signals using the wiring board |
DE19601202A1 (de) * | 1996-01-15 | 1997-03-06 | Siemens Ag | Datenträgerkarte und Verfahren zu deren Herstellung |
US5712607A (en) * | 1996-04-12 | 1998-01-27 | Dittmer; Timothy W. | Air-dielectric stripline |
US5914534A (en) * | 1996-05-03 | 1999-06-22 | Ford Motor Company | Three-dimensional multi-layer molded electronic device and method for manufacturing same |
US5825630A (en) * | 1996-11-07 | 1998-10-20 | Ncr Corporation | Electronic circuit board including a second circuit board attached there to to provide an area of increased circuit density |
US5766979A (en) * | 1996-11-08 | 1998-06-16 | W. L. Gore & Associates, Inc. | Wafer level contact sheet and method of assembly |
US6188028B1 (en) * | 1997-06-09 | 2001-02-13 | Tessera, Inc. | Multilayer structure with interlocking protrusions |
US6007669A (en) * | 1998-01-07 | 1999-12-28 | Packard Hughes Interconnect Company | Layer to layer interconnect |
DE19838519A1 (de) * | 1998-08-25 | 2000-03-02 | Bosch Gmbh Robert | Leiterplatte und Verfahren zur Herstellung |
JP3629375B2 (ja) * | 1998-11-27 | 2005-03-16 | 新光電気工業株式会社 | 多層回路基板の製造方法 |
US6326560B1 (en) * | 1999-08-04 | 2001-12-04 | Witek Enterprise Co., Ltd. | Adapter for a ball grid array device |
US6490168B1 (en) * | 1999-09-27 | 2002-12-03 | Motorola, Inc. | Interconnection of circuit substrates on different planes in electronic module |
-
2000
- 2000-05-15 DE DE10023736A patent/DE10023736A1/de not_active Ceased
-
2001
- 2001-05-10 EP EP01111146A patent/EP1156708A3/fr not_active Withdrawn
- 2001-05-14 US US09/854,779 patent/US6717060B2/en not_active Expired - Fee Related
- 2001-05-14 CA CA002347568A patent/CA2347568C/fr not_active Expired - Fee Related
- 2001-05-15 JP JP2001145512A patent/JP2002016340A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP1156708A2 (fr) | 2001-11-21 |
JP2002016340A (ja) | 2002-01-18 |
DE10023736A1 (de) | 2001-11-22 |
US6717060B2 (en) | 2004-04-06 |
CA2347568A1 (fr) | 2001-11-15 |
EP1156708A3 (fr) | 2003-10-29 |
US20020011349A1 (en) | 2002-01-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |
Effective date: 20160516 |