CA2290104A1 - A controlled cleavage process - Google Patents
A controlled cleavage process Download PDFInfo
- Publication number
- CA2290104A1 CA2290104A1 CA002290104A CA2290104A CA2290104A1 CA 2290104 A1 CA2290104 A1 CA 2290104A1 CA 002290104 A CA002290104 A CA 002290104A CA 2290104 A CA2290104 A CA 2290104A CA 2290104 A1 CA2290104 A1 CA 2290104A1
- Authority
- CA
- Canada
- Prior art keywords
- substrate
- energy
- particles
- selected depth
- cleave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims abstract description 149
- 230000008569 process Effects 0.000 title claims description 84
- 238000003776 cleavage reaction Methods 0.000 title description 5
- 230000007017 scission Effects 0.000 title description 5
- 239000000758 substrate Substances 0.000 claims abstract description 205
- 239000000463 material Substances 0.000 claims abstract description 135
- 230000009471 action Effects 0.000 claims abstract description 62
- 239000002245 particle Substances 0.000 claims abstract description 56
- 239000012530 fluid Substances 0.000 claims abstract description 51
- 229910052710 silicon Inorganic materials 0.000 claims description 40
- 239000010703 silicon Substances 0.000 claims description 40
- 239000007789 gas Substances 0.000 claims description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 20
- 239000011521 glass Substances 0.000 claims description 16
- 238000005468 ion implantation Methods 0.000 claims description 10
- 239000010432 diamond Substances 0.000 claims description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 229910003460 diamond Inorganic materials 0.000 claims description 7
- 238000007654 immersion Methods 0.000 claims description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 6
- 230000007935 neutral effect Effects 0.000 claims description 6
- 230000001902 propagating effect Effects 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 239000001307 helium Substances 0.000 claims description 3
- 229910052734 helium Inorganic materials 0.000 claims description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 3
- 150000002483 hydrogen compounds Chemical class 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 238000006467 substitution reaction Methods 0.000 claims 1
- 230000003313 weakening effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 87
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 39
- 239000010408 film Substances 0.000 description 32
- 239000010409 thin film Substances 0.000 description 24
- 238000010586 diagram Methods 0.000 description 23
- 239000007788 liquid Substances 0.000 description 21
- 230000000977 initiatory effect Effects 0.000 description 18
- 239000000126 substance Substances 0.000 description 18
- 238000002513 implantation Methods 0.000 description 13
- 230000005672 electromagnetic field Effects 0.000 description 12
- 239000012212 insulator Substances 0.000 description 12
- 150000002500 ions Chemical class 0.000 description 10
- 235000012239 silicon dioxide Nutrition 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- 238000005498 polishing Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000007943 implant Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 241000894007 species Species 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 239000003989 dielectric material Substances 0.000 description 5
- -1 gases Chemical class 0.000 description 5
- 238000005304 joining Methods 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 239000002210 silicon-based material Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000005485 electric heating Methods 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000013526 supercooled liquid Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 239000013590 bulk material Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052754 neon Inorganic materials 0.000 description 3
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 230000008685 targeting Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000003351 stiffener Substances 0.000 description 2
- 238000007669 thermal treatment Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241001050985 Disco Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- MVFCKEFYUDZOCX-UHFFFAOYSA-N iron(2+);dinitrate Chemical compound [Fe+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MVFCKEFYUDZOCX-UHFFFAOYSA-N 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/28—Splitting layers from work; Mutually separating layers by cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/002—Precutting and tensioning or breaking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US4627697P | 1997-05-12 | 1997-05-12 | |
US60/046,276 | 1997-05-12 | ||
US09/026,027 | 1998-02-19 | ||
US09/026,027 US5994207A (en) | 1997-05-12 | 1998-02-19 | Controlled cleavage process using pressurized fluid |
US09/026,115 US6155909A (en) | 1997-05-12 | 1998-02-19 | Controlled cleavage system using pressurized fluid |
US09/026,115 | 1998-02-19 | ||
PCT/US1998/009567 WO1998052216A1 (en) | 1997-05-12 | 1998-05-11 | A controlled cleavage process |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2290104A1 true CA2290104A1 (en) | 1998-11-19 |
Family
ID=27362676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002290104A Abandoned CA2290104A1 (en) | 1997-05-12 | 1998-05-11 | A controlled cleavage process |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0995227A4 (ja) |
JP (1) | JP2001525991A (ja) |
CN (1) | CN1146973C (ja) |
AU (1) | AU7685198A (ja) |
CA (1) | CA2290104A1 (ja) |
WO (1) | WO1998052216A1 (ja) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG87916A1 (en) | 1997-12-26 | 2002-04-16 | Canon Kk | Sample separating apparatus and method, and substrate manufacturing method |
US6383890B2 (en) | 1997-12-26 | 2002-05-07 | Canon Kabushiki Kaisha | Wafer bonding method, apparatus and vacuum chuck |
US6540861B2 (en) | 1998-04-01 | 2003-04-01 | Canon Kabushiki Kaisha | Member separating apparatus and processing apparatus |
JP2000349264A (ja) * | 1998-12-04 | 2000-12-15 | Canon Inc | 半導体ウエハの製造方法、使用方法および利用方法 |
JP4365920B2 (ja) * | 1999-02-02 | 2009-11-18 | キヤノン株式会社 | 分離方法及び半導体基板の製造方法 |
US6468923B1 (en) | 1999-03-26 | 2002-10-22 | Canon Kabushiki Kaisha | Method of producing semiconductor member |
FR2795865B1 (fr) * | 1999-06-30 | 2001-08-17 | Commissariat Energie Atomique | Procede de realisation d'un film mince utilisant une mise sous pression |
FR2796491B1 (fr) | 1999-07-12 | 2001-08-31 | Commissariat Energie Atomique | Procede de decollement de deux elements et dispositif pour sa mise en oeuvre |
FR2797347B1 (fr) * | 1999-08-04 | 2001-11-23 | Commissariat Energie Atomique | Procede de transfert d'une couche mince comportant une etape de surfragililisation |
AU6905000A (en) * | 1999-08-10 | 2001-03-05 | Silicon Genesis Corporation | A cleaving process to fabricate multilayered substrates using low implantation doses |
US6653209B1 (en) | 1999-09-30 | 2003-11-25 | Canon Kabushiki Kaisha | Method of producing silicon thin film, method of constructing SOI substrate and semiconductor device |
FR2809867B1 (fr) * | 2000-05-30 | 2003-10-24 | Commissariat Energie Atomique | Substrat fragilise et procede de fabrication d'un tel substrat |
FR2811807B1 (fr) * | 2000-07-12 | 2003-07-04 | Commissariat Energie Atomique | Procede de decoupage d'un bloc de materiau et de formation d'un film mince |
JP2002075917A (ja) | 2000-08-25 | 2002-03-15 | Canon Inc | 試料の分離装置及び分離方法 |
FR2817395B1 (fr) | 2000-11-27 | 2003-10-31 | Soitec Silicon On Insulator | Procede de fabrication d'un substrat notamment pour l'optique, l'electronique ou l'optoelectronique et substrat obtenu par ce procede |
FR2818010B1 (fr) * | 2000-12-08 | 2003-09-05 | Commissariat Energie Atomique | Procede de realisation d'une couche mince impliquant l'introduction d'especes gazeuses |
FR2819099B1 (fr) * | 2000-12-28 | 2003-09-26 | Commissariat Energie Atomique | Procede de realisation d'une structure empilee |
JP4803884B2 (ja) * | 2001-01-31 | 2011-10-26 | キヤノン株式会社 | 薄膜半導体装置の製造方法 |
JP2002305293A (ja) | 2001-04-06 | 2002-10-18 | Canon Inc | 半導体部材の製造方法及び半導体装置の製造方法 |
US6770966B2 (en) * | 2001-07-31 | 2004-08-03 | Intel Corporation | Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat |
TW558743B (en) | 2001-08-22 | 2003-10-21 | Semiconductor Energy Lab | Peeling method and method of manufacturing semiconductor device |
FR2834380B1 (fr) | 2002-01-03 | 2005-02-18 | Soitec Silicon On Insulator | Dispositif de coupe de couche d'un substrat, et procede associe |
FR2847714B1 (fr) * | 2002-11-27 | 2005-02-18 | Soitec Silicon On Insulator | Procede et dispositif de recuit de tranche de semiconducteur |
TWI233154B (en) | 2002-12-06 | 2005-05-21 | Soitec Silicon On Insulator | Method for recycling a substrate |
EP1427002B1 (en) * | 2002-12-06 | 2017-04-12 | Soitec | A method for recycling a substrate using local cutting |
JP4151421B2 (ja) * | 2003-01-23 | 2008-09-17 | セイコーエプソン株式会社 | デバイスの製造方法 |
JP2005039114A (ja) * | 2003-07-17 | 2005-02-10 | Disco Abrasive Syst Ltd | 半導体ウェーハ移し替え装置 |
EP1730737B1 (en) * | 2004-03-22 | 2013-01-16 | Singulus Technologies AG | Method and apparatus for separating disc-shaped substrates |
DE102004041378B4 (de) | 2004-08-26 | 2010-07-08 | Siltronic Ag | Halbleiterscheibe mit Schichtstruktur mit geringem Warp und Bow sowie Verfahren zu ihrer Herstellung |
DE102005000826A1 (de) | 2005-01-05 | 2006-07-20 | Siltronic Ag | Halbleiterscheibe mit Silicium-Germanium-Schicht und Verfahren zu deren Herstellung |
US8241996B2 (en) | 2005-02-28 | 2012-08-14 | Silicon Genesis Corporation | Substrate stiffness method and resulting devices for layer transfer process |
JP5064692B2 (ja) * | 2006-02-09 | 2012-10-31 | 信越化学工業株式会社 | Soi基板の製造方法 |
JP5064693B2 (ja) * | 2006-02-13 | 2012-10-31 | 信越化学工業株式会社 | Soi基板の製造方法 |
US8293619B2 (en) * | 2008-08-28 | 2012-10-23 | Silicon Genesis Corporation | Layer transfer of films utilizing controlled propagation |
JP2008112847A (ja) * | 2006-10-30 | 2008-05-15 | Shin Etsu Chem Co Ltd | 単結晶シリコン太陽電池の製造方法及び単結晶シリコン太陽電池 |
JP5284576B2 (ja) * | 2006-11-10 | 2013-09-11 | 信越化学工業株式会社 | 半導体基板の製造方法 |
JP5166745B2 (ja) * | 2007-03-07 | 2013-03-21 | 信越化学工業株式会社 | 単結晶シリコン太陽電池の製造方法 |
US20100193900A1 (en) * | 2007-07-13 | 2010-08-05 | National University Corporation Tohoku University | Soi substrate and semiconductor device using an soi substrate |
JP2010021398A (ja) * | 2008-07-11 | 2010-01-28 | Disco Abrasive Syst Ltd | ウェーハの処理方法 |
US7994064B2 (en) * | 2009-06-15 | 2011-08-09 | Twin Creeks Technologies, Inc. | Selective etch for damage at exfoliated surface |
JP5725430B2 (ja) * | 2011-10-18 | 2015-05-27 | 富士電機株式会社 | 固相接合ウエハの支持基板の剥離方法および半導体装置の製造方法 |
FR2995447B1 (fr) * | 2012-09-07 | 2014-09-05 | Soitec Silicon On Insulator | Procede de separation d'au moins deux substrats selon une interface choisie |
JP2014138189A (ja) * | 2013-01-16 | 2014-07-28 | Silicon Genesis Corp | 制御されたプロセス及び結果として生じるデバイス |
CN103077885B (zh) * | 2013-01-31 | 2016-06-01 | 上海新傲科技股份有限公司 | 受控减薄方法以及半导体衬底 |
JP6213046B2 (ja) * | 2013-08-21 | 2017-10-18 | 信越半導体株式会社 | 貼り合わせウェーハの製造方法 |
FR3032555B1 (fr) * | 2015-02-10 | 2018-01-19 | Soitec | Procede de report d'une couche utile |
CN104979262B (zh) * | 2015-05-14 | 2020-09-22 | 浙江中纳晶微电子科技有限公司 | 一种晶圆分离的方法 |
CN106529159A (zh) * | 2016-10-28 | 2017-03-22 | 山东理工大学 | 压电控制单原子链纳米弦横向振动固有角频率计算方法 |
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US4466852A (en) * | 1983-10-27 | 1984-08-21 | At&T Technologies, Inc. | Method and apparatus for demounting wafers |
DE3803424C2 (de) * | 1988-02-05 | 1995-05-18 | Gsf Forschungszentrum Umwelt | Verfahren zur quantitativen, tiefendifferentiellen Analyse fester Proben |
EP0397237B1 (en) * | 1989-05-08 | 1994-05-18 | Koninklijke Philips Electronics N.V. | Method of cleaving a plate of brittle material |
DE4100526A1 (de) * | 1991-01-10 | 1992-07-16 | Wacker Chemitronic | Vorrichtung und verfahren zum automatischen vereinzeln von gestapelten scheiben |
JPH04359518A (ja) * | 1991-06-06 | 1992-12-11 | Nec Corp | 半導体装置の製造方法 |
FR2681472B1 (fr) * | 1991-09-18 | 1993-10-29 | Commissariat Energie Atomique | Procede de fabrication de films minces de materiau semiconducteur. |
DE69233314T2 (de) * | 1991-10-11 | 2005-03-24 | Canon K.K. | Verfahren zur Herstellung von Halbleiter-Produkten |
US5269880A (en) * | 1992-04-03 | 1993-12-14 | Northern Telecom Limited | Tapering sidewalls of via holes |
FR2715503B1 (fr) * | 1994-01-26 | 1996-04-05 | Commissariat Energie Atomique | Substrat pour composants intégrés comportant une couche mince et son procédé de réalisation. |
JP3293736B2 (ja) * | 1996-02-28 | 2002-06-17 | キヤノン株式会社 | 半導体基板の作製方法および貼り合わせ基体 |
JP3257580B2 (ja) * | 1994-03-10 | 2002-02-18 | キヤノン株式会社 | 半導体基板の作製方法 |
FR2725074B1 (fr) * | 1994-09-22 | 1996-12-20 | Commissariat Energie Atomique | Procede de fabrication d'une structure comportant une couche mince semi-conductrice sur un substrat |
SG65697A1 (en) * | 1996-11-15 | 1999-06-22 | Canon Kk | Process for producing semiconductor article |
CA2233096C (en) * | 1997-03-26 | 2003-01-07 | Canon Kabushiki Kaisha | Substrate and production method thereof |
JP3667079B2 (ja) * | 1997-03-26 | 2005-07-06 | キヤノン株式会社 | 薄膜の形成方法 |
JP2877800B2 (ja) * | 1997-03-27 | 1999-03-31 | キヤノン株式会社 | 複合部材の分離方法、分離された部材、分離装置、半導体基体の作製方法および半導体基体 |
-
1998
- 1998-05-11 CA CA002290104A patent/CA2290104A1/en not_active Abandoned
- 1998-05-11 JP JP54937198A patent/JP2001525991A/ja active Pending
- 1998-05-11 CN CNB988049767A patent/CN1146973C/zh not_active Expired - Lifetime
- 1998-05-11 WO PCT/US1998/009567 patent/WO1998052216A1/en not_active Application Discontinuation
- 1998-05-11 AU AU76851/98A patent/AU7685198A/en not_active Abandoned
- 1998-05-11 EP EP98924756A patent/EP0995227A4/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
AU7685198A (en) | 1998-12-08 |
JP2001525991A (ja) | 2001-12-11 |
WO1998052216A1 (en) | 1998-11-19 |
EP0995227A4 (en) | 2000-07-05 |
CN1146973C (zh) | 2004-04-21 |
CN1255237A (zh) | 2000-05-31 |
EP0995227A1 (en) | 2000-04-26 |
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