CA1225630A - Formaldehyde binder - Google Patents
Formaldehyde binderInfo
- Publication number
- CA1225630A CA1225630A CA000446837A CA446837A CA1225630A CA 1225630 A CA1225630 A CA 1225630A CA 000446837 A CA000446837 A CA 000446837A CA 446837 A CA446837 A CA 446837A CA 1225630 A CA1225630 A CA 1225630A
- Authority
- CA
- Canada
- Prior art keywords
- component
- formaldehyde
- formaldehyde binder
- water
- monohydric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
Abstract
A b s t r a c t Formaldehyde Binder A formaldehyde binder is described for use in lignocellulosic sheet materials such as particleboard, plywood or blockboard, in which a formaldehyde-based adhesive is used. The binder comprises an organic hydroxy compound and an amide.
Description
~:~25~30 A Formaldehyde ~inder Boards such as particleboard, chipboard and the like are prepared from lignocellulosic materials using adhesives. The preferred adhesives(or glues) are based on formaldehyde, such as urea-formaldehyde, me-lamine-formaldehyde, phenol-formaldehyde ~nd resorcinol-formaldehyde resins or mixtures thereof. It is a well-known fact that boards prepared using these adhesives have a formaldehyde odour which is both harmful and un-pleasant. Formaldehyde is emitted both during the pro-duction of such boards and during their storage and final use.
Many methods of avoiding the emission of form-aldehyde have been proposed, but all of them are either ineffective or reduce the properties of the boards or require complicated application procedures. Some of these procedures involve spraying or spread coating the warm boards coming out of the press with various solutions, such as solutions of urea andtor ammonia or of ammonium salts. Generally, these types of methods are not desi-rable for industrial application because they require additional process steps and anyway are not very efficient.
Other methods involve the use of very complica-ted mixtures of a large number of components, some ofwhich are natural glues. These products also are not very efficient. One handicap thereof is the fact that the properties of natural products are not constant.
iLZ25630 Another way of reducin~ the content of free form-aldehyde involves the use of an aqueous suspension of urea prills coated with a special wax. This method, too, requi-res a separate feeding line, because the product is not S added to the adhesive rormulation itself.
An object of the present invention is to pro-vide a formaldehyde binder which effectively reduces the formaldehyde odour ~Jithout reducing the properties Or the board, withou~ changing the reactivity Or the 10 adhesive formulations and without requirin~ any additio-nal steps in the production Or particleboard, plywood or blockboard.
The invention provides a rormaldehyce binder when for use in boards prepared from lignocellulosic ma-15 terials using adhesives based on formaldehyde,which com-prises a solution Or (a) at least one or~anic hydroxy compound with the excep-tion of Cl 4 monohydric aliphatic alcohols and (b) at least one amide 20 in water. The formaldehyde binder can also contain (c) an or-ganic compound which acts as a solvent for (a) and (b) and also reacts with formaldehyde and/or (d) an inorganic com-pound soluble in water. The organic compound (c) is prefer-ably a Cl 4 monohydric aliphatic alcohol. The inorganic com-25 pound (d) is preferably a halide salt. Even if the individualcomponents are not soluble in water, they may dissolve in wa-ter if a mixture thereof is heated in water to 70 C.
Preferably the organic hydroxy compounds [com-30 ponent (a)] are soluble in water or in lower monohydric aliphatic alcohols. Examples Or such prererred hydroxy compounds are the dihydric, trihydric and pentahydric alcohols containing up to 6 carbon atoms, the mono-saccharides containing up to G carbon atoms, the di-.
~2Z56~0 3saccharides containing up to 12 carbon atoms and the po-lysaccharides having an Ostwald viscosity up to 200 mPas at 25 C and a concentration corresponding to 37 % refrac-tion. Other ex~mples of preferred hydroxy compounds are the aromatic alcohols and phenols, which preferably are used alone or in combination with one or more of the above-men-tioned dihydric, trihydric and/or pentahydric alcohols and/
or monosaccharides, disaccharides and/or polysaccharidesO
The phenols and aromatic alcohols can be monohydric or polyhydric phenols and monohydric or polyhydric aromatic alcohols containing one benzene ring.
Specific examples of suitable organic hydroxy compounds are monoethyleneglycol, diethyleneglycol, glycerine, pentaerythritol, fructose, mannose, sorbitol, dextrose, sucrose, maltose, lactose, dextrin, phenol, resorcinol, hydroquinone and the like.
Preferably the amides [component (b)] used in the formaldehyde binder of the invention are likewise soluble in water or in lower monohydric aliphatic alcohols. Parti-cularly preferred are the aliphatic amides containing up to 6 carbon atoms and the aromatic amides containing one benzene ring.
Suitable examples of amides are urea, thiourea, formamide, acetamide, benzamide, oxamide, succinamide, malonamide and the like.
If desired, to enhance solubility,the formaldehyde binder of the invention can additionally contain additives [component (c)] which are lower monohydric aliphatic alco-hols such as methanol, ethanol, isopropanol and the like.
A cheaper and more efficient formaldehyde binder ., 1~25630 is obtained if inorganic compounds [component (d)] which are preferably halide salts, more preferably halides of alkali metals or alkaline earth metals, such as sodium chloride, potassium chloride and calcium chloride3 are added.
The ratio of organic hydroxy compound r cor.lponent (a) and component (c), if present] and inorganic compound [component (d), if present] to amide [component (b)]
is preferably 10:100 to 400:100, particularly 10:100 to 200:100, by weight. The formaldehyde binder of the inven-tion can be added to the usual ~lue formulations in quanti-tie8 varying from 1 to 10 %, preferably 3 to 7 %, of form-aldehyde binder solids, based on the weight of the liquid resin containing 65 % by weight of resin solids.
The formaldehyde binder of the invention may contain 20 to 80 % by weight, preferably 50 to 70 % by weight, of the active ingredients [components (a) and (b) and components (c) and/or (d)~ if present]. The water con-tent of the formaldehyde binder depends on the solubilityof the active ingredients and the amount of water which can be tolerated in the glue formulations.
The formaldehyde binder of the invention can be produced by simply adding the active ingredients and water to a mixer and mixing until the active ingredients are dissolved. This can be done at room temperature or at an elevated temperature up to 70 C.
The formaldehyde binder of the invention may be used whenever boards are prepared from lignocellulosic materials using adhesives based on formaldehyde, such as urea-formaldehyde, melamine-formaldehyde, phenol-formaldehyde or resorcinol-formaldehyde resins or mix-~225630 tures thereof.
When using the formaldehyde binder o~ the invention, it is possible to produce boards actually containing less than 10 mg Or free formaldehyde per 100 g of the dry board, as determined by the F.~.S.Y.P. (Fédération Euro-péenne des Syndicats des Fabricants de Panneaux de Par-ticules) perforator method No. EN 120.
The amount of the free formaldehyde reduction depends on many factors and, therefore, can vary widely.
If the emission of free formaldehyde is high (higher than 50 mg of formaldehyde per 100 grams of dry board), the reduction can be as high as up to 60 to 85 %. If the emission of free formaldehyde is relatively low, i.e. 20 to 5C mg of free formaldehyde pèr 100 g of the dry board, the maximum reduction is usually 50 to 60 %. The amount of reduction obtained also depends on the amount of form-aldehyde binder used: The more formaldehyde binder is used, the lower is the amount of free formaldehyde.
When the active ingredients of the formaldehyde binder are used in combination with each other, the free formaldehyde reduction is surprisingly much higher than the sum of the effects of the separate components, and they have no adverse effect on the reactivity of the glue formulation or the properties of the boards.
The following examples illustrate the invention.
Parts and percents are by weight.
~%~630 Example l In this example the organic compound con-taining hydroxyl groups is glycerine and the amide is urea. Here, there is illustrated the synergistic be-haviour of these two compounds. Various glue formula-tions are prepared and each is used subsequently in order to produce particleboard.
The control does not include any of the components of the formaldehyde binder according to the invention. Sample 1 includes both glycerine and urea, sample 2 includes only glycerine and sample 3 includes only urea.
It is noticed from the tables reported here below that glycerine when used on its own (sample 2) is a very efficient formaldehyde binder, but urea (sample 3) gives a poorer formaldehyde reduction and lower mechanical values and water resistance, however, when urea is used in combination with glycerine (sample l), it gives values that are equivalent to those of glycerine on its own.
We may therefore use a cheaper and less efficient product (urea) and make it react as effec-tively as a more expensive and more efficient product (glycerine). The efficiency refers to formaldehyde absorbing capacities as well as to maintaining good mechanical properties and water resistance without changing the reactivity of the glue formulation and without the need to introduce any special apparatus for its use.
Formaldehyde reduction actually is in this case 46 %.
The formulations of the various samples used are as follows:
l 2 3 parts byparts by parts by weight weight weight Glycerine (100 ~) 270 590 Urea (100 %) 320 - 59 Water 410 410 410 % solids 59 59 59 The glue formulations used are as follows:
Control 1 2 3 grams grams gramsgraJns Urea-formalde-hyde resin 65 %3077 3077 3077 3077 (Molar ratio F:U 1.27:1) Hardener 400 400 400 400 (Ammonium chloride 15 %) Paraffin emulsion 250 250 250 250 50 %
Ammonia 25 Baumé 5 5 5 5 Sample l - 308 - -Sample 2 - - 308 Sample 3 - ~ ~ 308 Water 268 Total 4 44 44 44 Gel time in secs. 68 68 71 62 ~2Z5630 Single-layer boards are prepared in the laboratory by spraying each of these formulations onto 25 kgs wood chips. Boards are pressed at 10, and 9 and 8 secs./mm. The thickness of the boards is 17.3 mms.
The temperature of the press is 200 C and the pressure is 35 kg/cm . The dimensions of the boards produced are 40 x 56 cms.
The results obtained are reported in the following table and are average values.
Control 1 2 3 Density (kg/m3) 683 669 663 657 Bending strength (Ntmm ) 19.9 18.1 17.3 16.3 Tensile strength (N/mm ) 0.73 0.72 0.71 0.63
Many methods of avoiding the emission of form-aldehyde have been proposed, but all of them are either ineffective or reduce the properties of the boards or require complicated application procedures. Some of these procedures involve spraying or spread coating the warm boards coming out of the press with various solutions, such as solutions of urea andtor ammonia or of ammonium salts. Generally, these types of methods are not desi-rable for industrial application because they require additional process steps and anyway are not very efficient.
Other methods involve the use of very complica-ted mixtures of a large number of components, some ofwhich are natural glues. These products also are not very efficient. One handicap thereof is the fact that the properties of natural products are not constant.
iLZ25630 Another way of reducin~ the content of free form-aldehyde involves the use of an aqueous suspension of urea prills coated with a special wax. This method, too, requi-res a separate feeding line, because the product is not S added to the adhesive rormulation itself.
An object of the present invention is to pro-vide a formaldehyde binder which effectively reduces the formaldehyde odour ~Jithout reducing the properties Or the board, withou~ changing the reactivity Or the 10 adhesive formulations and without requirin~ any additio-nal steps in the production Or particleboard, plywood or blockboard.
The invention provides a rormaldehyce binder when for use in boards prepared from lignocellulosic ma-15 terials using adhesives based on formaldehyde,which com-prises a solution Or (a) at least one or~anic hydroxy compound with the excep-tion of Cl 4 monohydric aliphatic alcohols and (b) at least one amide 20 in water. The formaldehyde binder can also contain (c) an or-ganic compound which acts as a solvent for (a) and (b) and also reacts with formaldehyde and/or (d) an inorganic com-pound soluble in water. The organic compound (c) is prefer-ably a Cl 4 monohydric aliphatic alcohol. The inorganic com-25 pound (d) is preferably a halide salt. Even if the individualcomponents are not soluble in water, they may dissolve in wa-ter if a mixture thereof is heated in water to 70 C.
Preferably the organic hydroxy compounds [com-30 ponent (a)] are soluble in water or in lower monohydric aliphatic alcohols. Examples Or such prererred hydroxy compounds are the dihydric, trihydric and pentahydric alcohols containing up to 6 carbon atoms, the mono-saccharides containing up to G carbon atoms, the di-.
~2Z56~0 3saccharides containing up to 12 carbon atoms and the po-lysaccharides having an Ostwald viscosity up to 200 mPas at 25 C and a concentration corresponding to 37 % refrac-tion. Other ex~mples of preferred hydroxy compounds are the aromatic alcohols and phenols, which preferably are used alone or in combination with one or more of the above-men-tioned dihydric, trihydric and/or pentahydric alcohols and/
or monosaccharides, disaccharides and/or polysaccharidesO
The phenols and aromatic alcohols can be monohydric or polyhydric phenols and monohydric or polyhydric aromatic alcohols containing one benzene ring.
Specific examples of suitable organic hydroxy compounds are monoethyleneglycol, diethyleneglycol, glycerine, pentaerythritol, fructose, mannose, sorbitol, dextrose, sucrose, maltose, lactose, dextrin, phenol, resorcinol, hydroquinone and the like.
Preferably the amides [component (b)] used in the formaldehyde binder of the invention are likewise soluble in water or in lower monohydric aliphatic alcohols. Parti-cularly preferred are the aliphatic amides containing up to 6 carbon atoms and the aromatic amides containing one benzene ring.
Suitable examples of amides are urea, thiourea, formamide, acetamide, benzamide, oxamide, succinamide, malonamide and the like.
If desired, to enhance solubility,the formaldehyde binder of the invention can additionally contain additives [component (c)] which are lower monohydric aliphatic alco-hols such as methanol, ethanol, isopropanol and the like.
A cheaper and more efficient formaldehyde binder ., 1~25630 is obtained if inorganic compounds [component (d)] which are preferably halide salts, more preferably halides of alkali metals or alkaline earth metals, such as sodium chloride, potassium chloride and calcium chloride3 are added.
The ratio of organic hydroxy compound r cor.lponent (a) and component (c), if present] and inorganic compound [component (d), if present] to amide [component (b)]
is preferably 10:100 to 400:100, particularly 10:100 to 200:100, by weight. The formaldehyde binder of the inven-tion can be added to the usual ~lue formulations in quanti-tie8 varying from 1 to 10 %, preferably 3 to 7 %, of form-aldehyde binder solids, based on the weight of the liquid resin containing 65 % by weight of resin solids.
The formaldehyde binder of the invention may contain 20 to 80 % by weight, preferably 50 to 70 % by weight, of the active ingredients [components (a) and (b) and components (c) and/or (d)~ if present]. The water con-tent of the formaldehyde binder depends on the solubilityof the active ingredients and the amount of water which can be tolerated in the glue formulations.
The formaldehyde binder of the invention can be produced by simply adding the active ingredients and water to a mixer and mixing until the active ingredients are dissolved. This can be done at room temperature or at an elevated temperature up to 70 C.
The formaldehyde binder of the invention may be used whenever boards are prepared from lignocellulosic materials using adhesives based on formaldehyde, such as urea-formaldehyde, melamine-formaldehyde, phenol-formaldehyde or resorcinol-formaldehyde resins or mix-~225630 tures thereof.
When using the formaldehyde binder o~ the invention, it is possible to produce boards actually containing less than 10 mg Or free formaldehyde per 100 g of the dry board, as determined by the F.~.S.Y.P. (Fédération Euro-péenne des Syndicats des Fabricants de Panneaux de Par-ticules) perforator method No. EN 120.
The amount of the free formaldehyde reduction depends on many factors and, therefore, can vary widely.
If the emission of free formaldehyde is high (higher than 50 mg of formaldehyde per 100 grams of dry board), the reduction can be as high as up to 60 to 85 %. If the emission of free formaldehyde is relatively low, i.e. 20 to 5C mg of free formaldehyde pèr 100 g of the dry board, the maximum reduction is usually 50 to 60 %. The amount of reduction obtained also depends on the amount of form-aldehyde binder used: The more formaldehyde binder is used, the lower is the amount of free formaldehyde.
When the active ingredients of the formaldehyde binder are used in combination with each other, the free formaldehyde reduction is surprisingly much higher than the sum of the effects of the separate components, and they have no adverse effect on the reactivity of the glue formulation or the properties of the boards.
The following examples illustrate the invention.
Parts and percents are by weight.
~%~630 Example l In this example the organic compound con-taining hydroxyl groups is glycerine and the amide is urea. Here, there is illustrated the synergistic be-haviour of these two compounds. Various glue formula-tions are prepared and each is used subsequently in order to produce particleboard.
The control does not include any of the components of the formaldehyde binder according to the invention. Sample 1 includes both glycerine and urea, sample 2 includes only glycerine and sample 3 includes only urea.
It is noticed from the tables reported here below that glycerine when used on its own (sample 2) is a very efficient formaldehyde binder, but urea (sample 3) gives a poorer formaldehyde reduction and lower mechanical values and water resistance, however, when urea is used in combination with glycerine (sample l), it gives values that are equivalent to those of glycerine on its own.
We may therefore use a cheaper and less efficient product (urea) and make it react as effec-tively as a more expensive and more efficient product (glycerine). The efficiency refers to formaldehyde absorbing capacities as well as to maintaining good mechanical properties and water resistance without changing the reactivity of the glue formulation and without the need to introduce any special apparatus for its use.
Formaldehyde reduction actually is in this case 46 %.
The formulations of the various samples used are as follows:
l 2 3 parts byparts by parts by weight weight weight Glycerine (100 ~) 270 590 Urea (100 %) 320 - 59 Water 410 410 410 % solids 59 59 59 The glue formulations used are as follows:
Control 1 2 3 grams grams gramsgraJns Urea-formalde-hyde resin 65 %3077 3077 3077 3077 (Molar ratio F:U 1.27:1) Hardener 400 400 400 400 (Ammonium chloride 15 %) Paraffin emulsion 250 250 250 250 50 %
Ammonia 25 Baumé 5 5 5 5 Sample l - 308 - -Sample 2 - - 308 Sample 3 - ~ ~ 308 Water 268 Total 4 44 44 44 Gel time in secs. 68 68 71 62 ~2Z5630 Single-layer boards are prepared in the laboratory by spraying each of these formulations onto 25 kgs wood chips. Boards are pressed at 10, and 9 and 8 secs./mm. The thickness of the boards is 17.3 mms.
The temperature of the press is 200 C and the pressure is 35 kg/cm . The dimensions of the boards produced are 40 x 56 cms.
The results obtained are reported in the following table and are average values.
Control 1 2 3 Density (kg/m3) 683 669 663 657 Bending strength (Ntmm ) 19.9 18.1 17.3 16.3 Tensile strength (N/mm ) 0.73 0.72 0.71 0.63
2 hr. thickness swelling (%) 5.2 4.9 4.5 5.4 24 hr. thickness swelling (%) 51.449.9 47.4 53.1 Free formaldehyde 15. 8 8. 5 8.7 11.7 (mg/100 g dry board) Example 2 This is another example illustratin~ the synergistic behaviour of glycerine and urea in reducing the free formaldehyde of particleboards while main-taining the mechanical properties of the boards and thewater resistance as well.
The control does not in^lude any of the com-ponents of the formaldehyde binder according to the invention. Sample 1 contains both components of the form-aldehyde binder according to the invention and sample 2 contains only one of the two components (the most efficient of the two components).
It is noticed here again that only sample 1 gives free formaldehyde that is below 10 mg/100 g. dry board (which is the desir-~2ZS~
- g ed level for Elclass) and is the only one to have ab-solutely equivalent mechanical properties and water resistance. Formaldehyde reduction actually is 34 %.
The formulations of the various samples used are as follows:
parts by_weight parts by weight Glycerine (100 %)128 128 Urea (100 %) 424 Water 448 872 % solids 55.2 12.8 The glue formulations used are as follows:
Control 1 2 grams ~rams grams _ Urea formaldehyde resin 65 % 3077 3077 3077 (Molar ratlo F:U = 1.27:1) Hardener 400 400 400 (Ammonium chloride 15 %) Paraffin emulsion250 250 250 50 %
Ammonia 25 Baumé 5 5 5 Sample 1 - 268 Sample 2 - - 268 Water 268 Total 4000 4000 4000 Gel time in secs.66 67 69 -" ~225630 Single-layer boards are prepared in the laboratory by spraying each of these formulations onto 25 kgs wood chips. Boards are pressed at 10, 9 and 8 secs./mm. The thickness of the boards is 17.3 mms.
5 The temperature of the press is 200 ~C and the pressure is 35 kg/cm . The dimensions of the boards produce~
are 40 x 56 cms.
The results obtained are reported in the following table and are average values.
Control 1 2 Density (kg/m3) 685 684 687 Bending strength (N/mm2) 20. 7 20. 6 19.4 ~ensile strength (~/mm2) 0.740.73 0.67 2 hr. thickness swelling (%) 11.0 7.9 8.6 24 hr. absorption (%)23.5 23.2 23.7 Free formaldehyde 14.3 9.5 12.3 (mg/100 g dry board) Example 3 This example illustrates the efficiency of mono-ethyleneglycol together with urea as a formaldehyde binder.
Two formulations are prepared: the control without any of the ingredients of the formaldehyde binder according to the invention and sample 1 which includes both monoethyleneglycol and urea.
Boards are produced from these two glue formulations and it is proved here, too, that with the formaldehyde binder according to our invention we obtain with a urea-formaldehyde resin that gives : , .
~225630 normally boards classified as E 2 (control), boards classified as E 1 (sample 1).
The formaldehyde reduction is in this case 37 %.
The formulation of sample 1 used is as follows:
Sample 1 partæ by weight Monoethyleneglycol 100 % 360 Urea 100 % 365 Water 275 15 % solids 72.5 The glue formulations used are as follows:
Control grams grams Urea formaldehyde resin 65 % 3077 3077 (Molar ratio F:U - 1.27:1) Hardener 400 400 (Ammonium chloride 15 %) Paraffin emulsion 50 % 250 250 Ammonia 25 Baumé 5 5 Sample 1 - 268 Water 268 Total 4000 4000 30 Gel time in secs. 66 60 Single-layer boards are prepared in the laboratory by spraying each of these formulations onto 25 kgs wood chips. Boards are pressed at 10, 9 and ~2;2S63~1 8 secs./m~. The thickness of the boards is 17.3 mms.
The temperature of the press is 200 C and the pressure is 35 kg/cm2. The dimensions of the boards produced are 40 x 56 mms.
The results obtained are reported in the following table and are average values.
Control Density (kg/m3) 685 684 Bending strength (N/mm2) 20.7 20.2 Tensile strength (N/mm2) 0.74 0.74 2 hr.thickness swelling (%) 11.0 8.6 24 hr. absorption (%) 23.~22.6 Free formaldehyde 14.3 9.0 (mg/100 g dry board) Example 4 In this example we are illustrating the synergistic behaviour of monoethyleneglycol and urea.
Boards are prepared from three different formulations: the control wherein no ingredients of the formaldehyde binder according to the invention are used, sample 1 wherein both ingredients of the formaldehyde binder of the present invention are used and sample 2 wherein only one ingredient is used.
It is obvious from the results obtained and reported here in below that sample 1 containing both ingredients is much more effective than sample 2 con-taining only one ingredient (the most efficient of the two ingredients).
The formaldehyde reduction obtained in this case is 32 %.
The formulations of the various samples used are as follows:
parts by weight parts by weight Monoethyleneglycol 100 %230 580 Urea 100 % 350 Water 420 420 % solids 58 58 The glue formulations are as follows:
Control 1 2 gramsgramsgrams Urea formaldehyde 3077 3077 3077 20 resin 65 %
(Molar ratio F:U = 1.27:1) Hardener 400 400 400 (Ammonium chloride 15 %) Paraffin emulsion 50 % 250 250 250 Ammonia 25 Baumé 5 5 5 Sample 1 - 268 Sample 2 - - 268 Water 268 Total 4 4 4 Gel time in secs. 70 71 76 Single-layer boards are prepared in the laboratory by spraying each of these formulations onto 25 kgs wood chips. Boards are pressed at 10, 9 and lZZ5630 8 secs./mm. The thickness of the boards is 17.3 mms.
The temperature of the press is 200 C and the pressure is 35 kg/cm2. The dimensions of the boards produced are 40 x 56 mms.
The results obtained are reported in the following table and are average values.
Control 1 2 10 Density (kg/m3) 688 688 687 Bending strength (N/mm2)17.6 17.6 17.5 Tensile strength (N/mm2)0.55 0.60 0.56 2 hr. thickness swelling (%) 6.7 4.9 4.7 24 hr. absorption (%) 20.1 20.1 19.5 15 Free formaldehyde 15.0 10.3 12.3 (mg/100 g dry board) Example 5 In this example the use of a resin of diffe-rent molar ratio is illustrated as well as variouslevels of addition of the formaldehyde binder itself.
The formaldehyde binder used has the follo-wing formulation:
parts by weight Glycerine 100 % 270 Urea 100 % 318 Water 412 % solids 58.8 The glue formulations used in the varioussamples are as follows:
i ~22S~;30 Control 1 2 3 grams grams grams grams Urea formaldehyde resin 65 % 30773077 3077 3077 (Molar ratio F:U = 1.4:1) Hardener 293 380 380 380 (Ammonium chloride 15 % ) Paraf~in emulsion 50 % 250 250 250 250 Ammonia 25 Baumé 5 5 5 5 Formaldehyde binder - 154 215 375 Water 375 134 73 Total 4000 4000 4000 4087 Gel time in secs. 73 73 72 75 Single-layer boards are prepared in the 15 laboratory by spraying each of these formulations onto 25 kgs wood chips. Boards are pressed at 10, 9 and 8 secs./mm. The thickness of the boards is 17.3 mms.
The temperature of the press is 200 C and the pressure is 35 k~/cm2. The dimensions of the boards produced 20 are 40 x 56 cms.
The results obtained are reported in the following table and are average values.
Control 1 2 3 Density (kg/m3) 680 687 685 688 Bending strength (N/mm2)22.022.5 22.3 21.6 Tensile strength (N/mm2)0. 610.63 o .66 0 ~ 6 2 hr. thickness swelling (%)10.1 9. 3 8.8 9.5 24 hr. thickness swelling (%)20.6 21.8 21.0 21.5 Free formaldehyde 22.2 13.0 10.1 9.5 (mg/100 g dry board) It is noticed that the mechanical properties and water resistance of the boards are equivalent andthe formaldehyde reduction is 41 % in case of sample 1, 55 % in case of sample 2 and 57 % in case of sample 3.
Example 6 In this example six different types of poly-alcohols are illustrated, two different types of amides, one additive and a variation in the ratio of alcohol to amide covering a range from 57.5/100 to 385/100.
The various types of formaldehyde binder used are as follows:
- ~ZZ5630 o o o o o o r~
~D I I ~ I ~ I ~0 ~ I C- O
o o o o o o ~ ~
Ll~ I I I I I J ~ Ir~ I ~ O ~D
r~,-~ 0C~
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o o o ol o ~ ,1 ~ II ~ I I I o I ~ ~ o ~o ~ o~ O
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~ 3 ~d . I .
All above-mentioned figures are in parts by weight.
The glue formulations used in the various samples are as follows:
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;630 U~
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h O 1-~ N r~ ~1 ~0 ~ ~r ~n .
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m o s ~1 rl C) ~ O
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a) O h ~2256:~0 Single-layer boards are prepared in the lab-oratory by spraying each of these formulations onto 25 kgs wood chips. Boards are pressed at 10, 9 and 8 secs./mm. The thickness of the boards is 17.3 mms.
The temperature of the press is 200 C and the pressure is 35 kg/cm2. The dimensions of the boards produced are 40 x 56 cms.
The results obtained are reported in the following table and are average values.
. .
~225630 O
s t-- ~ ar~
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r~ ~ L~ ~ OC
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The control does not in^lude any of the com-ponents of the formaldehyde binder according to the invention. Sample 1 contains both components of the form-aldehyde binder according to the invention and sample 2 contains only one of the two components (the most efficient of the two components).
It is noticed here again that only sample 1 gives free formaldehyde that is below 10 mg/100 g. dry board (which is the desir-~2ZS~
- g ed level for Elclass) and is the only one to have ab-solutely equivalent mechanical properties and water resistance. Formaldehyde reduction actually is 34 %.
The formulations of the various samples used are as follows:
parts by_weight parts by weight Glycerine (100 %)128 128 Urea (100 %) 424 Water 448 872 % solids 55.2 12.8 The glue formulations used are as follows:
Control 1 2 grams ~rams grams _ Urea formaldehyde resin 65 % 3077 3077 3077 (Molar ratlo F:U = 1.27:1) Hardener 400 400 400 (Ammonium chloride 15 %) Paraffin emulsion250 250 250 50 %
Ammonia 25 Baumé 5 5 5 Sample 1 - 268 Sample 2 - - 268 Water 268 Total 4000 4000 4000 Gel time in secs.66 67 69 -" ~225630 Single-layer boards are prepared in the laboratory by spraying each of these formulations onto 25 kgs wood chips. Boards are pressed at 10, 9 and 8 secs./mm. The thickness of the boards is 17.3 mms.
5 The temperature of the press is 200 ~C and the pressure is 35 kg/cm . The dimensions of the boards produce~
are 40 x 56 cms.
The results obtained are reported in the following table and are average values.
Control 1 2 Density (kg/m3) 685 684 687 Bending strength (N/mm2) 20. 7 20. 6 19.4 ~ensile strength (~/mm2) 0.740.73 0.67 2 hr. thickness swelling (%) 11.0 7.9 8.6 24 hr. absorption (%)23.5 23.2 23.7 Free formaldehyde 14.3 9.5 12.3 (mg/100 g dry board) Example 3 This example illustrates the efficiency of mono-ethyleneglycol together with urea as a formaldehyde binder.
Two formulations are prepared: the control without any of the ingredients of the formaldehyde binder according to the invention and sample 1 which includes both monoethyleneglycol and urea.
Boards are produced from these two glue formulations and it is proved here, too, that with the formaldehyde binder according to our invention we obtain with a urea-formaldehyde resin that gives : , .
~225630 normally boards classified as E 2 (control), boards classified as E 1 (sample 1).
The formaldehyde reduction is in this case 37 %.
The formulation of sample 1 used is as follows:
Sample 1 partæ by weight Monoethyleneglycol 100 % 360 Urea 100 % 365 Water 275 15 % solids 72.5 The glue formulations used are as follows:
Control grams grams Urea formaldehyde resin 65 % 3077 3077 (Molar ratio F:U - 1.27:1) Hardener 400 400 (Ammonium chloride 15 %) Paraffin emulsion 50 % 250 250 Ammonia 25 Baumé 5 5 Sample 1 - 268 Water 268 Total 4000 4000 30 Gel time in secs. 66 60 Single-layer boards are prepared in the laboratory by spraying each of these formulations onto 25 kgs wood chips. Boards are pressed at 10, 9 and ~2;2S63~1 8 secs./m~. The thickness of the boards is 17.3 mms.
The temperature of the press is 200 C and the pressure is 35 kg/cm2. The dimensions of the boards produced are 40 x 56 mms.
The results obtained are reported in the following table and are average values.
Control Density (kg/m3) 685 684 Bending strength (N/mm2) 20.7 20.2 Tensile strength (N/mm2) 0.74 0.74 2 hr.thickness swelling (%) 11.0 8.6 24 hr. absorption (%) 23.~22.6 Free formaldehyde 14.3 9.0 (mg/100 g dry board) Example 4 In this example we are illustrating the synergistic behaviour of monoethyleneglycol and urea.
Boards are prepared from three different formulations: the control wherein no ingredients of the formaldehyde binder according to the invention are used, sample 1 wherein both ingredients of the formaldehyde binder of the present invention are used and sample 2 wherein only one ingredient is used.
It is obvious from the results obtained and reported here in below that sample 1 containing both ingredients is much more effective than sample 2 con-taining only one ingredient (the most efficient of the two ingredients).
The formaldehyde reduction obtained in this case is 32 %.
The formulations of the various samples used are as follows:
parts by weight parts by weight Monoethyleneglycol 100 %230 580 Urea 100 % 350 Water 420 420 % solids 58 58 The glue formulations are as follows:
Control 1 2 gramsgramsgrams Urea formaldehyde 3077 3077 3077 20 resin 65 %
(Molar ratio F:U = 1.27:1) Hardener 400 400 400 (Ammonium chloride 15 %) Paraffin emulsion 50 % 250 250 250 Ammonia 25 Baumé 5 5 5 Sample 1 - 268 Sample 2 - - 268 Water 268 Total 4 4 4 Gel time in secs. 70 71 76 Single-layer boards are prepared in the laboratory by spraying each of these formulations onto 25 kgs wood chips. Boards are pressed at 10, 9 and lZZ5630 8 secs./mm. The thickness of the boards is 17.3 mms.
The temperature of the press is 200 C and the pressure is 35 kg/cm2. The dimensions of the boards produced are 40 x 56 mms.
The results obtained are reported in the following table and are average values.
Control 1 2 10 Density (kg/m3) 688 688 687 Bending strength (N/mm2)17.6 17.6 17.5 Tensile strength (N/mm2)0.55 0.60 0.56 2 hr. thickness swelling (%) 6.7 4.9 4.7 24 hr. absorption (%) 20.1 20.1 19.5 15 Free formaldehyde 15.0 10.3 12.3 (mg/100 g dry board) Example 5 In this example the use of a resin of diffe-rent molar ratio is illustrated as well as variouslevels of addition of the formaldehyde binder itself.
The formaldehyde binder used has the follo-wing formulation:
parts by weight Glycerine 100 % 270 Urea 100 % 318 Water 412 % solids 58.8 The glue formulations used in the varioussamples are as follows:
i ~22S~;30 Control 1 2 3 grams grams grams grams Urea formaldehyde resin 65 % 30773077 3077 3077 (Molar ratio F:U = 1.4:1) Hardener 293 380 380 380 (Ammonium chloride 15 % ) Paraf~in emulsion 50 % 250 250 250 250 Ammonia 25 Baumé 5 5 5 5 Formaldehyde binder - 154 215 375 Water 375 134 73 Total 4000 4000 4000 4087 Gel time in secs. 73 73 72 75 Single-layer boards are prepared in the 15 laboratory by spraying each of these formulations onto 25 kgs wood chips. Boards are pressed at 10, 9 and 8 secs./mm. The thickness of the boards is 17.3 mms.
The temperature of the press is 200 C and the pressure is 35 k~/cm2. The dimensions of the boards produced 20 are 40 x 56 cms.
The results obtained are reported in the following table and are average values.
Control 1 2 3 Density (kg/m3) 680 687 685 688 Bending strength (N/mm2)22.022.5 22.3 21.6 Tensile strength (N/mm2)0. 610.63 o .66 0 ~ 6 2 hr. thickness swelling (%)10.1 9. 3 8.8 9.5 24 hr. thickness swelling (%)20.6 21.8 21.0 21.5 Free formaldehyde 22.2 13.0 10.1 9.5 (mg/100 g dry board) It is noticed that the mechanical properties and water resistance of the boards are equivalent andthe formaldehyde reduction is 41 % in case of sample 1, 55 % in case of sample 2 and 57 % in case of sample 3.
Example 6 In this example six different types of poly-alcohols are illustrated, two different types of amides, one additive and a variation in the ratio of alcohol to amide covering a range from 57.5/100 to 385/100.
The various types of formaldehyde binder used are as follows:
- ~ZZ5630 o o o o o o r~
~D I I ~ I ~ I ~0 ~ I C- O
o o o o o o ~ ~
Ll~ I I I I I J ~ Ir~ I ~ O ~D
r~,-~ 0C~
f g O O O O r~
J ~ I I O I I I 1~ I t-- O ~O ~
Ln ~ l~t O Ln O
o o o ol o ~ ,1 ~ II ~ I I I o I ~ ~ o ~o ~ o~ O
oO O ~ o I r~ I I I I I O I ~ O ~
s.~ ~ ~ ~o, ~, o ~ o , g, l o ~
~I J r~l ,0~ L~
o ~1 C) O
~` ~ ' ~ .
0 S~
0 ~1 .C ~ O O Q) ~ ~
O ~ 0 ~ S~ ~ rl ~ O
O ~ h ~1 ~1 ~ ,C
O ~ ,~ S ~ O ~ c~ O bO O
x a) ~ ~ 0 rl ~ rl O r~ ~ O al ~ s ~d O a) ,~
~ 3 ~d . I .
All above-mentioned figures are in parts by weight.
The glue formulations used in the various samples are as follows:
... .
;630 U~
O O r- =r c~
~D ~ ~ O Lr~ I I I O I
h O 1-~ N r~ ~1 ~0 ~ ~r ~n .
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S ~ O L~ N r~ ~1 bC t'~ J
~q t- O O t-O U~ I I I O I I I I ~ ~O
h O In N ~ r--l bl) ~ J
~n E t-- O O t--t- o L~ I I o I I I I I r~ ~o h O Lt~ N r~ r~l tlO ~ J
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,1 ~ c- o In I o I i I I I I ~ ~
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m o s ~1 rl C) ~ O
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a) O h ~2256:~0 Single-layer boards are prepared in the lab-oratory by spraying each of these formulations onto 25 kgs wood chips. Boards are pressed at 10, 9 and 8 secs./mm. The thickness of the boards is 17.3 mms.
The temperature of the press is 200 C and the pressure is 35 kg/cm2. The dimensions of the boards produced are 40 x 56 cms.
The results obtained are reported in the following table and are average values.
. .
~225630 O
s t-- ~ ar~
CP~ O ~D ~ 0 ~1 ) a~ ~J ~1 ~r ~D
N
r~ ~ L~ ~ OC
L~ O`\ O ~D O C~
U~ 0 ~D
~ 1 ~ O
O o o ~ J
3 ~ t~J r~ 3 ~D
Lr ~ U~ CO O
U~ O~ O U~ CJ~ ~1 ~ ~ ~ ,1 ~O
1~ ~D O O ~D
oc, o Ir~ o ~ t--co ~1 ~ ~
~D
O~
U~
0~ 0 ~D 0~
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h ~ ~ O
D
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^ ^ S: S:
e e ~ ,1 .~ ~ ~ ~ o ~ a) ~ ~ .,, z æ ~
V) h C) S S ~ ~ O ~1 o w a) ~ S s~
a u~ S S ~ ~D S
~o a) o o O ~
~rl rl ~rl ~ h ~I td S S a) e a) a~ ~ ~ ~ ~ o a m E~
" :
Z5~i30 The above-mentioned results prove that all samples used have values equivalent to the control and that the formaldehyde reduction is of the order of 32 to 47 %
Example 7 In this example three different types of organic compounds containing hydroxyl groups are exemplified by means of dextrin, phenol and resor-cinol.
One monohydric alcohol acting as an additive other than methanol is also illustrated, namely ethyl alcohol.
The various types of formaldehyde binder used are as follows:
l 2 3 4 20 Monethyleneglycol 230 Dextrin - 140 Phenol - - 130 Resorcinol - - - 130 Methanol - 140 130 130 25 ~thanol 80 - - -Urea 350 350 370 370 Water 340 370 370 370 % solids 66 63 63 63 All above-mentioned figures are in parts by weight. The formaldehyde binder samples are used in this example to substitute a part of the resin used.
lZ25630 The glue formulations actually used are as follows:
Control 1 2 ~ 4 grams grams grams grams grams -5Urea formaldehyde 3077 2770 2770 2770 2770 resin (Molar ratio F:U = 1.27:1) Hardener 400 500 400 450 400 (Ammonium chloride 15 % solution) Paraffin emulsion 50 % 250 250 250 ~50 250 Ammonia 25 Baum~ 5 ~ormaldehyde binder Sample 1 - 307 - - -15 Sample 2 ~ ~ 37 Sample 3 - ~ ~ 37 Sample 4 - ~ ~ ~ 307 Water 268 Total 4 3827 3727 37773727 Gel time in secs.65 64 62 63 63 Single-layer boards are prepared in the laboratory by spraying each of these formulations onto 25 kgs wood chips~ Boards are pressed at 10, 9 and 8 secs./mm. The thickness of the boards is 17.3 mms.
The temperature of the press is 200 C and the pressure is 35 kg/cm . The dimensions of the boards pressed are 40 x 56 cms.
The results obtained are reported in the following table and are average values.
~Z~5~30 C~ t- ~' O O O ~ ~ O
~1 r-O ~ ~ o~
O O ~ ~ o~
O ~ ~ r~
L~
t~ ~ N
Ln O~ O ~ ~ O~ O
~I CJ~
~o U~
oo a~ o a~
~D
~1 O U~
~ ' ~ O O ~ O
O O C~
C~ C-~ ba O
Z Z;
S S ~q ~ ~ O
Q ~ P
~0 bO ~ a) S h q s s ~ ~o s o o ~ ~ ~ s ~ a) ~0 ~
a) a) a~ ~ 3 h Ei O
~5630 The above-mentioned results prove that all samples have values that are equivalent to the control sample that contains no formaldehyde binder even though the latter substitutes an equivalent amount of urea-formaldehyde resin in the formulation. The formaldehydereduction varies in this example from 24 to 37 %.
Example 8 In this example one type of formaldehyde binder is used and the resin is based on phenol-melamine-urea formaldehyde resin.
The formaldehyde binder used has the follo-wing formulation:
parts by wei~ht Monoethyleneglycol 300 Urea 33 Water 370 The glue formulations used are as follows:
Control grams grams 25 Phenol-melamine-urea-formal-dehyde resin 63 % 5600 5600 Hardener (solution in water of 15.5 % ammonium chloride) 840 840 Paraffin emulsion 50 % 150 150 30 Formaldehyde binder - 560 Total 6590 7150 Gel time in secs. 73 79 - ~ Z S ~ 3 Single-layer boards are prepared in the laboratory by spraying each of these formulations onto 25 kgs wood chips. Boards are pressed at 10, 9 and 8 secs./mm. The thickness of the boards is 17.3 mms.
The temperature of the press is 200 C and the pressure is 35 kg/cm . The dimensions of the boards produced are 40 x 56 cms.
The results obtained are reported in the following table and are average values.
Control Density (kg/m3) 705 695 Bending strength (N/mm ) 26.2 25.9 Tensile strength (N/mm2)0.27 0.26 Tensile strength V100 (N/mm2) 2.7 2.6 2 hr. thickness swelling (%) 7.1 6.2 24 hr. thickness swelling (%) 12.0 11.3 Free formaldehyde (mg/100 g dry board) 12.8 7 Formaldehy~ reduction (%) - 45 The above-mentioned results prove that the formaldehyde binder according to the present invention can be used also for phenol-melamine-urea-fo~E~dehyde resins reducing considerably the free formaldehyde emission without adversely affecting the properties of the boards.
3o . , :
Example 9 In this example the formaldehyde binder used includes an inorganic compound [component (d)], illu-strated in this case by sodium chloride.
The formaldehyde binder used has the follow-ing formulation:
Parts by weight Monoethyleneglycol 100 % 270 10 Urea 100 % 318 Sodium chloride 100 % 50 Water 362 Total 1000 % solids . 63.8 The glue formulations used in the various samples are as follows:
Control grams grams Urea-formaldehyde resin (Molar ratio F:U=1.27:1)3077 2770 Hardener 25 ( Ammonium chloride 15 %
solution) 400 450 Paraffin emulsion 50 %250 250 Ammonia 25 Baumé 5 Formaldehyde binder - 307 30 Water 26~ -Total 4000 3777 Gel time in secs. 65 64 , lZ2563~) Single-layer boards are prepared in the laboratory by spraying each of these formulations onto 25 kg wood chips.
Boards are pressed at 10, 9 and 8 secs/mm. The thickness of the boards is 17.3 mms. The temperature of the press is 200 C and the pressure is 35 kg/cm2. The dimensions of the boards pressed are 40 x 56 cms.
The results obtained are reported in the follow-ing table and are average values.
Control Density (kg/m3) 695 699 Bending strength (N/mm ) 19.9 19.5 Tensile strength (N/mm2) 0.71 0.73 2 hr. thickness swelling (%) 7.0 6.6 2Y hr. thickness swelling (%) 20.5 20.8 Free formaldehyde (mg/100 g dry board) 17 9.5 Formaldehyde reduction (%) - 44 The results prove that the sample including the formaldehyde binder gives values that are equivalent to the control sample in spite of the fact that the formaldehyde binder substitutes a part of the urea-formaldehyde resin in the formulation. The formaldehyde reduction is 44 %.
3o
Lr ~ U~ CO O
U~ O~ O U~ CJ~ ~1 ~ ~ ~ ,1 ~O
1~ ~D O O ~D
oc, o Ir~ o ~ t--co ~1 ~ ~
~D
O~
U~
0~ 0 ~D 0~
~1 co ~1 ~I J
~D
h ~ ~ O
D
O CO ~1 C) ~D
^ ^ S: S:
e e ~ ,1 .~ ~ ~ ~ o ~ a) ~ ~ .,, z æ ~
V) h C) S S ~ ~ O ~1 o w a) ~ S s~
a u~ S S ~ ~D S
~o a) o o O ~
~rl rl ~rl ~ h ~I td S S a) e a) a~ ~ ~ ~ ~ o a m E~
" :
Z5~i30 The above-mentioned results prove that all samples used have values equivalent to the control and that the formaldehyde reduction is of the order of 32 to 47 %
Example 7 In this example three different types of organic compounds containing hydroxyl groups are exemplified by means of dextrin, phenol and resor-cinol.
One monohydric alcohol acting as an additive other than methanol is also illustrated, namely ethyl alcohol.
The various types of formaldehyde binder used are as follows:
l 2 3 4 20 Monethyleneglycol 230 Dextrin - 140 Phenol - - 130 Resorcinol - - - 130 Methanol - 140 130 130 25 ~thanol 80 - - -Urea 350 350 370 370 Water 340 370 370 370 % solids 66 63 63 63 All above-mentioned figures are in parts by weight. The formaldehyde binder samples are used in this example to substitute a part of the resin used.
lZ25630 The glue formulations actually used are as follows:
Control 1 2 ~ 4 grams grams grams grams grams -5Urea formaldehyde 3077 2770 2770 2770 2770 resin (Molar ratio F:U = 1.27:1) Hardener 400 500 400 450 400 (Ammonium chloride 15 % solution) Paraffin emulsion 50 % 250 250 250 ~50 250 Ammonia 25 Baum~ 5 ~ormaldehyde binder Sample 1 - 307 - - -15 Sample 2 ~ ~ 37 Sample 3 - ~ ~ 37 Sample 4 - ~ ~ ~ 307 Water 268 Total 4 3827 3727 37773727 Gel time in secs.65 64 62 63 63 Single-layer boards are prepared in the laboratory by spraying each of these formulations onto 25 kgs wood chips~ Boards are pressed at 10, 9 and 8 secs./mm. The thickness of the boards is 17.3 mms.
The temperature of the press is 200 C and the pressure is 35 kg/cm . The dimensions of the boards pressed are 40 x 56 cms.
The results obtained are reported in the following table and are average values.
~Z~5~30 C~ t- ~' O O O ~ ~ O
~1 r-O ~ ~ o~
O O ~ ~ o~
O ~ ~ r~
L~
t~ ~ N
Ln O~ O ~ ~ O~ O
~I CJ~
~o U~
oo a~ o a~
~D
~1 O U~
~ ' ~ O O ~ O
O O C~
C~ C-~ ba O
Z Z;
S S ~q ~ ~ O
Q ~ P
~0 bO ~ a) S h q s s ~ ~o s o o ~ ~ ~ s ~ a) ~0 ~
a) a) a~ ~ 3 h Ei O
~5630 The above-mentioned results prove that all samples have values that are equivalent to the control sample that contains no formaldehyde binder even though the latter substitutes an equivalent amount of urea-formaldehyde resin in the formulation. The formaldehydereduction varies in this example from 24 to 37 %.
Example 8 In this example one type of formaldehyde binder is used and the resin is based on phenol-melamine-urea formaldehyde resin.
The formaldehyde binder used has the follo-wing formulation:
parts by wei~ht Monoethyleneglycol 300 Urea 33 Water 370 The glue formulations used are as follows:
Control grams grams 25 Phenol-melamine-urea-formal-dehyde resin 63 % 5600 5600 Hardener (solution in water of 15.5 % ammonium chloride) 840 840 Paraffin emulsion 50 % 150 150 30 Formaldehyde binder - 560 Total 6590 7150 Gel time in secs. 73 79 - ~ Z S ~ 3 Single-layer boards are prepared in the laboratory by spraying each of these formulations onto 25 kgs wood chips. Boards are pressed at 10, 9 and 8 secs./mm. The thickness of the boards is 17.3 mms.
The temperature of the press is 200 C and the pressure is 35 kg/cm . The dimensions of the boards produced are 40 x 56 cms.
The results obtained are reported in the following table and are average values.
Control Density (kg/m3) 705 695 Bending strength (N/mm ) 26.2 25.9 Tensile strength (N/mm2)0.27 0.26 Tensile strength V100 (N/mm2) 2.7 2.6 2 hr. thickness swelling (%) 7.1 6.2 24 hr. thickness swelling (%) 12.0 11.3 Free formaldehyde (mg/100 g dry board) 12.8 7 Formaldehy~ reduction (%) - 45 The above-mentioned results prove that the formaldehyde binder according to the present invention can be used also for phenol-melamine-urea-fo~E~dehyde resins reducing considerably the free formaldehyde emission without adversely affecting the properties of the boards.
3o . , :
Example 9 In this example the formaldehyde binder used includes an inorganic compound [component (d)], illu-strated in this case by sodium chloride.
The formaldehyde binder used has the follow-ing formulation:
Parts by weight Monoethyleneglycol 100 % 270 10 Urea 100 % 318 Sodium chloride 100 % 50 Water 362 Total 1000 % solids . 63.8 The glue formulations used in the various samples are as follows:
Control grams grams Urea-formaldehyde resin (Molar ratio F:U=1.27:1)3077 2770 Hardener 25 ( Ammonium chloride 15 %
solution) 400 450 Paraffin emulsion 50 %250 250 Ammonia 25 Baumé 5 Formaldehyde binder - 307 30 Water 26~ -Total 4000 3777 Gel time in secs. 65 64 , lZ2563~) Single-layer boards are prepared in the laboratory by spraying each of these formulations onto 25 kg wood chips.
Boards are pressed at 10, 9 and 8 secs/mm. The thickness of the boards is 17.3 mms. The temperature of the press is 200 C and the pressure is 35 kg/cm2. The dimensions of the boards pressed are 40 x 56 cms.
The results obtained are reported in the follow-ing table and are average values.
Control Density (kg/m3) 695 699 Bending strength (N/mm ) 19.9 19.5 Tensile strength (N/mm2) 0.71 0.73 2 hr. thickness swelling (%) 7.0 6.6 2Y hr. thickness swelling (%) 20.5 20.8 Free formaldehyde (mg/100 g dry board) 17 9.5 Formaldehyde reduction (%) - 44 The results prove that the sample including the formaldehyde binder gives values that are equivalent to the control sample in spite of the fact that the formaldehyde binder substitutes a part of the urea-formaldehyde resin in the formulation. The formaldehyde reduction is 44 %.
3o
Claims (57)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. A formaldehyde binder for use in boards prepared from lignocellulosic materials, using adhesives based on formaldehyde, which includes a solution of (a) at least one organic hydroxy compound with the exception of C1-4 monohydric aliphatic alcohols and (b) at least one amide in water the solution containing from 20 to 80% by weight of the combination of (a) and (b).
2. The formaldehyde binder of claim 1 which, in addition, contains (c) an organic compound which acts as a solvent for (a) and (b) and also reacts with formaldehyde.
3. The formaldehyde binder of claim 2 wherein (c) is a C1-4 aliphatic monohydric alcohol.
4. The formaldehyde binder of claim 1 which, in addition, contains (d) an inorganic compound soluble in water.
5. The formaldehyde binder of claim 4 wherein (d) is a water-soluble halide salt.
6. The formaldehyde binder of claim 5 wherein (d) is a water-soluble halide of an alkali metal or an alkaline earth metal.
7. The formaldehyde binder of claim 6 wherein (d) is sodium chloride, potassium chloride or calcium chloride.
8. The formaldehyde binder of claim 1 wherein component (a) is soluble in water or in a C1-4 monohydric aliphatic alcohol.
9. The formaldehyde binder of claim 8, wherein component (a) is selected from dihydric, trihydric and pentahydric alcohols containing up to 6 carbon atoms, monosaccharides containing up to 6 carbon atoms, and disaccharides containing up to 12 carbon atoms and polysaccharides having a Ostwald viscosity up to 200 mPas at 25°C and a concentration corresponding to 37% refraction.
10. The formaldehyde binder of claim 8, wherein component (a) is selected from aromatic alcohols and phenols.
11. The formaldehyde binder of claim 10, wherein component (a) is selected from monohydric and polyhydric aromatic alcohols containing one benzene ring and monohydric and polyhydric phenols.
12. The formaldehyde binder of claim 1 wherein component (b) is soluble in water, or in a C1-4 monohydric aliphatic alcohol.
13. The formaldehyde binder of claim 12, wherein component (b) is selected from aliphatic amides containing up to 6 carbon atoms and aromatic amides containing one benzene ring.
14. The formaldehyde binder of claims 1, 2 or 4 wherein the ratio by weight of component (a) plus components (c) and (d), if present, to component (b) is 10:100 to 400:100.
15. The formaldehyde binder of claim 1, which contains 50 to 70% by weight of the active ingredients.
16. A process for preparing the formaldehyde binder as claimed in claim 1, wherein (a) at least one organic hydroxy compound with the exception of C1-4 monohydric aliphatic alcohols, (b) at least one amide and (c) optionally at least one organic compound which acts as a solvent for (a) and (b) and also reacts with formaldehyde and (d) optionally an inorganic compound soluble in water and water are mixed at a temperature from room temperature to 70°C, to provide a solution which contains from 20 to 80% by weight of the combination of (a) and (b).
17. A process as claimed in claim 16 wherein (c) is a C1-4 monohydric aliphatic alcohol.
18. A process as claimed in claim 16 wherein (d) is a water-soluble halide salt.
19. A process as claimed in claim 18 wherein (d) is a water-soluble halide of an alkali metal or an alkaline earth metal.
20. A process as claimed in claim 19 wherein (d) is sodium chloride, potassium chloride or calcium chloride.
21. A process according to claim 16 wherein component (a) is soluble in water or in a C1-4 monohydric aliphatic alcohol.
22. A process according to claim 21, wherein component (a) is selected from dihydric, trihydric and pentahydric alcohols containing up to 6 carbon atoms, monosaccharides containing up to 6 carbon atoms, disaccharides containing up to 12 carbon atoms and polysaccharides having an Ostwald viscosity up to 200 mPas at 25°C and a concentration corresponding to 37% refraction.
23. A process according to claim 21, wherein component (a) is selected from aromatic alcohols and phenols.
24. A process according to claim 23, wherein component (a) is selected from monohydric and polyhydric aromatic alcohols containing one benzene ring and monohydric and polyhydric phenols.
25. A process according to claim 16, wherein component (b) is soluble in water or in C1-C4 monohydric aliphatic alcohols.
26. A process according to claim 25, wherein component (b) is selected from aliphatic amides containing up to 6 carbon atoms and aromatic amides containing one benzene ring.
27. A process according to claim 16, wherein the ratio by weight of component (a) plus components (c) and (d), if present, to component (b) is 10:100 to 400:100.
28. A process according to claim 16, wherein formaldehyde binder contains 50 to 70% by weight of the active ingredients.
29. A process for preparing boards from lignocellulosic materials using an adhesive based on formaldehyde, wherein a formaldehyde binder according to claim 1 is added to the adhesive.
30. Boards prepared from lignocellulosic materials and produced by a process as claimed in claim 29.
31. A formaldehyde binder for use in boards prepared from lignocellulosic materials, using adhesives based on formaldehyde, which includes a solution of (a) at least one organic hydroxy compound which is selected from dihydric, trihydric and pentahydric alcohols containing up to 6 carbon atoms, monosaccharides containing up to 6 carbon atoms and disaccharides containing up to 12 carbon atoms, (b) at least one amide, in water, the ratio by weight of component (a) to component (b) being in the range of from 10:100 to 400:100.
32. The formaldehyde binder of claim 31 which, in addition, contains (c) an organic compound which acts as a solvent for (a) and (b) and also reacts with formaldehyde.
33. The formaldehyde binder of claim 32 wherein (c) is a C1-4 aliphatic monohydric alcohol.
34. The formaldehyde binder of claim31which, in addition, contains (d) an inorganic compound soluble in water.
35. The formaldehyde binder of claim 34 wherein (d) is a water-soluble halide salt.
36. The formaldehyde binder of claim 35 wherein (d) is a water-soluble halide of an alkali metal or an alkaline earth metal.
37. The formaldehyde binder of claim 36 wherein (d) is sodium chloride, potassium chloride or calcium chloride.
38. The formaldehyde binder of claim 31 wherein component (a) is soluble in water or in a C1-4 monohydric aliphatic alcohol.
39. The formaldehyde binder of claim 31, wherein component (a) is selected from aromatic alcohols and phenols.
40. The formaldehyde binder of claim 39, wherein component (a) is selected from monohydric and polyhydric aromatic alcohols containing one benzene ring and monohydric and polyhydric phenols.
41. The formaldehyde binder of claim 31 wherein component (b) is soluble in water, or in a C1-4 monohydric aliphatic alcohol.
42. The formaldehyde binder of claim 41, wherein component (b) is selected from aliphatic amides containing up to 6 carbon atoms and aromatic amides containing one benzene ring.
43. The formaldehyde binder of claims 32 or 34, wherein the ratio by weight of component (a) plus components (c) and/or (d) to component (b) is 10:100 to 400:100.
44. The formaldehyde binder of claim 31, which contains 20 to 80% by weight of the active ingredients.
45. A process for preparing the formaldehyde binder as claimed in claim 31, wherein:
(a) at least one organic hydroxy compound which is selected from dihydric, trihydric and pentahydric alcohols containing up to 6 carbon atoms, monosaccharides containing up to 6 carbon atoms, and disaccharides containing up to 12 carbon atoms, (b) at least one amide, and (c) optionally at least one organic compound which acts as a solvent for (a) and (b) and also reacts with formaldehyde and (d) optionally an inorganic compound soluble in water, and water are mixed at a temperature from room temperature to 70°C, wherein the ratio by weight of component (a) plus components (c) and (d), if present, to component (b) is in the range of from 10:100 to 400:100.
(a) at least one organic hydroxy compound which is selected from dihydric, trihydric and pentahydric alcohols containing up to 6 carbon atoms, monosaccharides containing up to 6 carbon atoms, and disaccharides containing up to 12 carbon atoms, (b) at least one amide, and (c) optionally at least one organic compound which acts as a solvent for (a) and (b) and also reacts with formaldehyde and (d) optionally an inorganic compound soluble in water, and water are mixed at a temperature from room temperature to 70°C, wherein the ratio by weight of component (a) plus components (c) and (d), if present, to component (b) is in the range of from 10:100 to 400:100.
46. A process as claimed in claim 45 wherein (c) is a C1-4 monohydric aliphatic alcohol.
47. A process as claimed in claim 45 wherein (d) is a water-soluble halide salt.
48. A process as claimed in claim 47 wherein (d) is a water-soluble halide of an alkali metal or an alkaline earth metal.
49. A process as claimed in claim 48 wherein (d) is sodium chloride, potassium chloride or calcium chloride.
50. A process according to claim 45 wherein component (a) is soluble in water or in a C1-4 monohydric aliphatic alcohol.
51. A process according to claim 50, wherein component (a) is selected from aromatic alcohols and phenols.
52. A process according to claim 51, wherein component (a) is selected from monohydric and polyhydric aromatic alcohols containing one benzene ring and monohydric and polyhydric phenols.
53, A process according to claim 45, wherein component (b) is soluble in water or in C1-4 monohydric aliphatic alcohols.
54. A process according to claim 53, wherein component (b) is selected from aliphatic amides containing up to 6 carbon atoms and aromatic amides containing one benzene ring.
55. A process according to claim 45, wherein formaldehyde binder contains 20 to 80% by weight of the active ingredients.
56. A process for preparing boards from lignocellulosic materials using an adhesive based on formaldehyde, wherein a formaldehyde binder according to claim 31 is added to the adhesive.
57. Boards prepared from lignocellulosic materials and produced by a processed as claimed in claim 56.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB838303350A GB8303350D0 (en) | 1983-02-07 | 1983-02-07 | Formaldehyde binder |
| GB8303350 | 1983-02-07 | ||
| GB8320128 | 1983-07-26 | ||
| GB838320128A GB8320128D0 (en) | 1983-02-07 | 1983-07-26 | Formaldehyde binder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1225630A true CA1225630A (en) | 1987-08-18 |
Family
ID=26285158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000446837A Expired CA1225630A (en) | 1983-02-07 | 1984-02-06 | Formaldehyde binder |
Country Status (28)
| Country | Link |
|---|---|
| JP (1) | JPH0613686B2 (en) |
| AR (1) | AR242246A1 (en) |
| AT (1) | AT385513B (en) |
| AU (1) | AU570028B2 (en) |
| CA (1) | CA1225630A (en) |
| CH (1) | CH658218A5 (en) |
| DD (1) | DD232018A5 (en) |
| DE (1) | DE3403136C2 (en) |
| DK (1) | DK165184C (en) |
| ES (1) | ES8505398A1 (en) |
| FI (1) | FI840448A (en) |
| FR (1) | FR2540506B1 (en) |
| GB (1) | GB2136008B (en) |
| GR (1) | GR79713B (en) |
| HU (1) | HU197591B (en) |
| IL (1) | IL70844A (en) |
| IT (1) | IT1177542B (en) |
| LU (1) | LU85195A1 (en) |
| MX (1) | MX168053B (en) |
| MY (1) | MY8700455A (en) |
| NL (1) | NL8400322A (en) |
| NO (1) | NO169848C (en) |
| NZ (1) | NZ206859A (en) |
| PL (1) | PL144282B1 (en) |
| PT (1) | PT78066B (en) |
| RO (1) | RO88986A (en) |
| SE (1) | SE463717B (en) |
| YU (1) | YU44138B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3439929A1 (en) * | 1984-11-02 | 1986-05-07 | Basf Ag, 6700 Ludwigshafen | HARDENER FOR AMINOPLAST RESIN, ITS USE IN THE LAMINATION AND FUNCTIONING OF WOODEN MATERIALS AND METHOD FOR LAMINATING AND FUNCTIONING WOODEN MATERIAL |
| GB2170208B (en) * | 1985-01-29 | 1988-06-22 | Enigma Nv | A formaldehyde binder |
| GB2191207B (en) * | 1986-06-06 | 1989-12-13 | Enigma Nv | Substitute for amino and phenolic resins |
| NZ220437A (en) * | 1986-06-06 | 1989-06-28 | Enigma Nv | Aldehyde/sugar/lignosulphonate mixture as a substitute for amino and phenolic resins in bonding agents |
| DE3815204A1 (en) * | 1988-05-04 | 1989-11-16 | Gruber & Weber Gmbh Co Kg | PROCESS FOR PRODUCING COMPOSITE MATERIALS WITH REDUCED FORMALDEHYDE EMISSION |
| DE3943488C2 (en) * | 1989-09-14 | 1999-05-27 | Dieter Ekkehard Dip Autenrieth | Process for reducing or eliminating free formaldehyde with carbamates, which are generated on the substrate in the critical phase when formaldehyde is released |
| DE10021849A1 (en) | 2000-05-05 | 2001-11-08 | Solutia Germany Gmbh & Co Kg | Aqueous aminoplast composition, used for impregnating paper or cardboard for use as finish foil or edge for furniture, contains specified formaldehyde-binding additive and optionally acrylate resin dispersion |
| SG90767A1 (en) * | 2001-01-03 | 2002-08-20 | Yang Kuo Chen | Method of making non-polluting products |
| US6720392B2 (en) | 2001-05-17 | 2004-04-13 | Solutia Germany Gmbh & Co. Kg | Aqueous amino resin blends |
| GB201517867D0 (en) | 2015-10-09 | 2015-11-25 | Knauf Insulation Ltd | Wood particle boards |
| BR112020019194A2 (en) | 2018-03-23 | 2021-01-05 | Foresa Technologies S.L.U. | HYDROPHOBIC AND SEQUESTRANT COMPOSITIONS OF FORMALDEHYDE UNDERSTANDING WAX AND RESORCINOL EMULSIONS AND THEIR USE TO INCREASE THE HYDROPHOBICITY OF WOODEN COMPOSITE PLATES AND FIBERGLASS INSULATION |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1054232B (en) * | 1956-03-29 | 1959-04-02 | Basf Ag | Process for the production of foams |
| AT261190B (en) * | 1965-03-25 | 1968-04-10 | Wilhelmi Holzwerk | Process for the treatment of wood chips with binding and impregnating agents |
| GB1254786A (en) * | 1968-03-12 | 1971-11-24 | Beck Koller And Co England Ltd | Phenol modified urea-formaldehyde resins |
| CH531091A (en) * | 1968-09-24 | 1972-08-15 | Ciba Geigy Ag | Process for the continuous dyeing and printing of textile fiber materials containing polyamides |
| GB1280961A (en) * | 1969-10-29 | 1972-07-12 | Goldschmidt Ag Th | Aminoplast resin precondensates and a method of producing them |
| GB1427927A (en) * | 1970-05-30 | 1976-03-10 | British Industrial Plastics | Hardener for urea-formaldehyde resin foams |
| CH540947A (en) * | 1970-09-07 | 1973-08-31 | Ciba Geigy Ag | Process for the production of plasticized melamine-formaldehyde condensation products and their use |
| FR2128472B1 (en) * | 1971-03-04 | 1976-03-26 | Basf Ag | |
| BE789804A (en) * | 1971-10-07 | 1973-04-06 | Cassella Farbwerke Mainkur Ag | AMINOPLASTE INTENDED FOR COATING WOOD-BASED MATERIALS AND LAMINATES AS WELL AS A PROCESS FOR THE PREPARATION OF THIS AMINOPLAST |
| DE2206696C3 (en) * | 1972-02-12 | 1978-05-24 | Eib, Wilhelm, 7417 Pfullingen | Use of molecular compounds as additives to adhesives based on formaldehyde-releasing condensates |
| BE795631A (en) * | 1972-02-19 | 1973-08-20 | Basf Ag | AMINOPLAST BINDERS FOR WOOD-BASED MATERIALS |
| FR2309575A1 (en) * | 1975-04-30 | 1976-11-26 | Saint Gobain | AQUEOUS SOLUTIONS OF ETHERIFIED MELAMINE-FORMALDEHYDE RESINS WITH A LONG SHELF LIFE AND LOW FREE FORMALDEHYDE CONTENT |
| DE2324046A1 (en) * | 1973-05-12 | 1974-11-28 | Basf Ag | Fire-resistant, temp-variation resistant chipboard prepn. - by adding alcohol to glue or wood chips |
| US3983084A (en) * | 1974-10-18 | 1976-09-28 | Krause Milling Company | Art of manufacturing compression molded particle board with nitrogenous modified amylaceous binder |
| DE2740207B1 (en) * | 1977-09-07 | 1978-11-09 | Basf Ag | Process for the production of wood-based materials with reduced subsequent release of formaldehyde |
| US4139507A (en) * | 1978-01-12 | 1979-02-13 | Allied Chemical Corporation | One-component binder for fiberboard |
| US4192923A (en) * | 1978-10-27 | 1980-03-11 | Allied Chemical Corporation | Amino resin foam, one-phase solution foam precursor and method of producing foam |
| DE3222195A1 (en) * | 1982-06-12 | 1983-12-15 | Basf Ag, 6700 Ludwigshafen | METHOD FOR THE PRODUCTION OF CHIPWOOD MATERIALS WITH REDUCED FORMALDEHYDEMISSION |
-
1984
- 1984-01-17 NZ NZ206859A patent/NZ206859A/en unknown
- 1984-01-17 GB GB08401225A patent/GB2136008B/en not_active Expired
- 1984-01-26 AU AU23810/84A patent/AU570028B2/en not_active Ceased
- 1984-01-30 DE DE3403136A patent/DE3403136C2/en not_active Expired - Fee Related
- 1984-01-30 AT AT0029784A patent/AT385513B/en not_active IP Right Cessation
- 1984-01-31 GR GR73668A patent/GR79713B/el unknown
- 1984-02-01 SE SE8400509A patent/SE463717B/en unknown
- 1984-02-01 DK DK045184A patent/DK165184C/en active
- 1984-02-01 CH CH471/84A patent/CH658218A5/en not_active IP Right Cessation
- 1984-02-01 IL IL70844A patent/IL70844A/en not_active IP Right Cessation
- 1984-02-02 NL NL8400322A patent/NL8400322A/en not_active Application Discontinuation
- 1984-02-02 NO NO840403A patent/NO169848C/en unknown
- 1984-02-03 RO RO84113506A patent/RO88986A/en unknown
- 1984-02-03 FI FI840448A patent/FI840448A/en not_active Application Discontinuation
- 1984-02-03 IT IT47647/84A patent/IT1177542B/en active
- 1984-02-06 HU HU84470A patent/HU197591B/en not_active IP Right Cessation
- 1984-02-06 FR FR8401767A patent/FR2540506B1/en not_active Expired
- 1984-02-06 JP JP59020671A patent/JPH0613686B2/en not_active Expired - Lifetime
- 1984-02-06 CA CA000446837A patent/CA1225630A/en not_active Expired
- 1984-02-06 LU LU85195A patent/LU85195A1/en unknown
- 1984-02-06 PT PT78066A patent/PT78066B/en not_active IP Right Cessation
- 1984-02-06 ES ES529473A patent/ES8505398A1/en not_active Expired
- 1984-02-06 DD DD84259887A patent/DD232018A5/en unknown
- 1984-02-07 MX MX200262A patent/MX168053B/en unknown
- 1984-02-07 PL PL1984246098A patent/PL144282B1/en unknown
- 1984-02-07 AR AR84295655A patent/AR242246A1/en active
-
1986
- 1986-05-20 YU YU827/86A patent/YU44138B/en unknown
-
1987
- 1987-12-30 MY MY455/87A patent/MY8700455A/en unknown
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| MKEX | Expiry |