CA1131746A - Plaquette de circuit a composants incorpores, et methode de fabrication connexe - Google Patents
Plaquette de circuit a composants incorpores, et methode de fabrication connexeInfo
- Publication number
- CA1131746A CA1131746A CA322,462A CA322462A CA1131746A CA 1131746 A CA1131746 A CA 1131746A CA 322462 A CA322462 A CA 322462A CA 1131746 A CA1131746 A CA 1131746A
- Authority
- CA
- Canada
- Prior art keywords
- circuit board
- conductor
- component
- solder
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2809013A DE2809013C2 (de) | 1978-02-28 | 1978-02-28 | Verfahren zum Herstellen einer mit Bauelementen bestückten gedruckten Schaltungsplatte |
GBP2809013.3 | 1978-02-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1131746A true CA1131746A (fr) | 1982-09-14 |
Family
ID=6033380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA322,462A Expired CA1131746A (fr) | 1978-02-28 | 1979-02-28 | Plaquette de circuit a composants incorpores, et methode de fabrication connexe |
Country Status (9)
Country | Link |
---|---|
JP (2) | JPS54118573A (fr) |
AT (1) | AT377889B (fr) |
AU (1) | AU531356B2 (fr) |
CA (1) | CA1131746A (fr) |
DE (1) | DE2809013C2 (fr) |
DK (1) | DK152480C (fr) |
IL (1) | IL56306A (fr) |
IT (1) | IT7947865A0 (fr) |
SE (1) | SE443276B (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5144535A (en) * | 1989-04-20 | 1992-09-01 | U.S. Philips Corporation | Method of mounting electrical and/or electronic components of a printed circuit board |
JPH0468198A (ja) * | 1990-07-09 | 1992-03-03 | Tekken Constr Co Ltd | トンネルの構築工法 |
DE4028978C2 (de) * | 1990-09-12 | 1993-10-14 | Siemens Ag | Lötkontaktelement für Leiterplatten zur Verlötung von oberflächenmontierbaren SMD-Bauteilen, und bevorzugte Verwendung desselben zur Verlötung von übereinanderliegenden Bauteilen |
US20040108130A1 (en) * | 2002-12-09 | 2004-06-10 | Yazaki Corporation | Mounting structure for electronic component |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3143484A (en) * | 1959-12-29 | 1964-08-04 | Gen Electric | Method of making plated circuit boards |
DE1246840B (de) * | 1963-09-30 | 1967-08-10 | Siemens Ag | Gedruckte Schaltung |
CA939831A (en) * | 1969-03-27 | 1974-01-08 | Frederick W. Schneble (Jr.) | Plated through hole printed circuit boards |
JPS48100660A (fr) * | 1972-04-04 | 1973-12-19 | ||
JPS5629805Y2 (fr) * | 1974-08-02 | 1981-07-15 |
-
1978
- 1978-02-28 DE DE2809013A patent/DE2809013C2/de not_active Expired
- 1978-08-31 DK DK385578A patent/DK152480C/da active
- 1978-09-04 SE SE7809290A patent/SE443276B/sv not_active IP Right Cessation
- 1978-09-29 AT AT0704878A patent/AT377889B/de not_active IP Right Cessation
- 1978-10-14 JP JP12675778A patent/JPS54118573A/ja active Granted
- 1978-12-26 IL IL56306A patent/IL56306A/xx unknown
-
1979
- 1979-02-02 IT IT7947865A patent/IT7947865A0/it unknown
- 1979-02-21 AU AU44454/79A patent/AU531356B2/en not_active Ceased
- 1979-02-28 CA CA322,462A patent/CA1131746A/fr not_active Expired
-
1982
- 1982-08-10 JP JP1982122152U patent/JPS58103163U/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
AT377889B (de) | 1985-05-10 |
JPS639396B2 (fr) | 1988-02-29 |
IL56306A0 (en) | 1979-03-12 |
IL56306A (en) | 1982-07-30 |
DK152480B (da) | 1988-02-29 |
ATA704878A (de) | 1984-09-15 |
DE2809013C2 (de) | 1985-08-01 |
DK385578A (da) | 1979-08-29 |
JPS54118573A (en) | 1979-09-14 |
SE443276B (sv) | 1986-02-17 |
AU4445479A (en) | 1979-09-06 |
SE7809290L (sv) | 1979-08-29 |
DK152480C (da) | 1988-07-25 |
AU531356B2 (en) | 1983-08-18 |
JPS58103163U (ja) | 1983-07-13 |
DE2809013A1 (de) | 1979-08-30 |
IT7947865A0 (it) | 1979-02-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4104111A (en) | Process for manufacturing printed circuit boards | |
US4993148A (en) | Method of manufacturing a circuit board | |
US4610756A (en) | Printed circuit board and process for its manufacture | |
US3742597A (en) | Method for making a coated printed circuit board | |
EP0784914B1 (fr) | Procede de fabrication de plaquettes de circuits imprimes | |
EP0127955B1 (fr) | Fabrication de plaquettes à circuit imprimé | |
CA1131746A (fr) | Plaquette de circuit a composants incorpores, et methode de fabrication connexe | |
JPH09232741A (ja) | プリント配線板 | |
JP2004200412A (ja) | 半田バンプ付き配線基板およびその製造方法 | |
GB2026918A (en) | Component-carrying printed circuit board | |
JP2004140248A (ja) | バンプ付き配線基板およびその製造方法 | |
JP2665293B2 (ja) | 配線回路基板 | |
JPH05259614A (ja) | プリント配線板の樹脂埋め法 | |
JPH03262186A (ja) | 印刷配線基板 | |
JP4434702B2 (ja) | 配線基板の製造方法 | |
JPH0548249A (ja) | プリント配線板の表面処理方法 | |
JPH04188689A (ja) | プリント配線板 | |
JPH0653640A (ja) | プリント配線板及びその製造方法 | |
JPH04133492A (ja) | 印刷配線板の製造方法 | |
JPH08186357A (ja) | プリント配線板及びその製造方法 | |
JPH11251477A (ja) | 半導体パッケージ、半導体装置、およびこれらの製造方法 | |
JPH05259624A (ja) | プリント配線板およびその製造方法 | |
JP2008251869A (ja) | 配線基板およびその製造方法 | |
JPH07283520A (ja) | プリント配線板及びその製造方法 | |
JPH0750470A (ja) | プリント基板およびその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MKEX | Expiry |