IL56306A - Printed circuit board and its production - Google Patents
Printed circuit board and its productionInfo
- Publication number
- IL56306A IL56306A IL56306A IL5630678A IL56306A IL 56306 A IL56306 A IL 56306A IL 56306 A IL56306 A IL 56306A IL 5630678 A IL5630678 A IL 5630678A IL 56306 A IL56306 A IL 56306A
- Authority
- IL
- Israel
- Prior art keywords
- production
- circuit board
- printed circuit
- printed
- board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2809013A DE2809013C2 (en) | 1978-02-28 | 1978-02-28 | Method of manufacturing a printed circuit board loaded with components |
Publications (2)
Publication Number | Publication Date |
---|---|
IL56306A0 IL56306A0 (en) | 1979-03-12 |
IL56306A true IL56306A (en) | 1982-07-30 |
Family
ID=6033380
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL56306A IL56306A (en) | 1978-02-28 | 1978-12-26 | Printed circuit board and its production |
Country Status (9)
Country | Link |
---|---|
JP (2) | JPS54118573A (en) |
AT (1) | AT377889B (en) |
AU (1) | AU531356B2 (en) |
CA (1) | CA1131746A (en) |
DE (1) | DE2809013C2 (en) |
DK (1) | DK152480C (en) |
IL (1) | IL56306A (en) |
IT (1) | IT7947865A0 (en) |
SE (1) | SE443276B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5144535A (en) * | 1989-04-20 | 1992-09-01 | U.S. Philips Corporation | Method of mounting electrical and/or electronic components of a printed circuit board |
JPH0468198A (en) * | 1990-07-09 | 1992-03-03 | Tekken Constr Co Ltd | Construction method of tunnel |
DE4028978C2 (en) * | 1990-09-12 | 1993-10-14 | Siemens Ag | Solder contact element for printed circuit boards for soldering surface-mountable SMD components, and preferred use of the same for soldering superimposed components |
US20040108130A1 (en) * | 2002-12-09 | 2004-06-10 | Yazaki Corporation | Mounting structure for electronic component |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3143484A (en) * | 1959-12-29 | 1964-08-04 | Gen Electric | Method of making plated circuit boards |
DE1246840B (en) * | 1963-09-30 | 1967-08-10 | Siemens Ag | Printed circuit |
CA939831A (en) * | 1969-03-27 | 1974-01-08 | Frederick W. Schneble (Jr.) | Plated through hole printed circuit boards |
JPS48100660A (en) * | 1972-04-04 | 1973-12-19 | ||
JPS5629805Y2 (en) * | 1974-08-02 | 1981-07-15 |
-
1978
- 1978-02-28 DE DE2809013A patent/DE2809013C2/en not_active Expired
- 1978-08-31 DK DK385578A patent/DK152480C/en active
- 1978-09-04 SE SE7809290A patent/SE443276B/en not_active IP Right Cessation
- 1978-09-29 AT AT0704878A patent/AT377889B/en not_active IP Right Cessation
- 1978-10-14 JP JP12675778A patent/JPS54118573A/en active Granted
- 1978-12-26 IL IL56306A patent/IL56306A/en unknown
-
1979
- 1979-02-02 IT IT7947865A patent/IT7947865A0/en unknown
- 1979-02-21 AU AU44454/79A patent/AU531356B2/en not_active Ceased
- 1979-02-28 CA CA322,462A patent/CA1131746A/en not_active Expired
-
1982
- 1982-08-10 JP JP1982122152U patent/JPS58103163U/en active Pending
Also Published As
Publication number | Publication date |
---|---|
DK152480C (en) | 1988-07-25 |
AT377889B (en) | 1985-05-10 |
SE443276B (en) | 1986-02-17 |
SE7809290L (en) | 1979-08-29 |
DE2809013A1 (en) | 1979-08-30 |
IL56306A0 (en) | 1979-03-12 |
JPS54118573A (en) | 1979-09-14 |
JPS58103163U (en) | 1983-07-13 |
CA1131746A (en) | 1982-09-14 |
AU531356B2 (en) | 1983-08-18 |
ATA704878A (en) | 1984-09-15 |
JPS639396B2 (en) | 1988-02-29 |
IT7947865A0 (en) | 1979-02-02 |
DK152480B (en) | 1988-02-29 |
DK385578A (en) | 1979-08-29 |
AU4445479A (en) | 1979-09-06 |
DE2809013C2 (en) | 1985-08-01 |
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