BRPI0822296A2 - Transponder e livreto - Google Patents

Transponder e livreto

Info

Publication number
BRPI0822296A2
BRPI0822296A2 BRPI0822296-7A BRPI0822296A BRPI0822296A2 BR PI0822296 A2 BRPI0822296 A2 BR PI0822296A2 BR PI0822296 A BRPI0822296 A BR PI0822296A BR PI0822296 A2 BRPI0822296 A2 BR PI0822296A2
Authority
BR
Brazil
Prior art keywords
booklet
transponder
Prior art date
Application number
BRPI0822296-7A
Other languages
English (en)
Inventor
Junsuke Tanaka
Akihisa Yamamoto
Makoto Maehira
Yoshiyuki Mizuguchi
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Publication of BRPI0822296A2 publication Critical patent/BRPI0822296A2/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/025—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
BRPI0822296-7A 2008-02-22 2008-10-10 Transponder e livreto BRPI0822296A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008041134 2008-02-22
JP2008187007 2008-07-18
PCT/JP2008/068492 WO2009104303A1 (ja) 2008-02-22 2008-10-10 トランスポンダ及び冊子体

Publications (1)

Publication Number Publication Date
BRPI0822296A2 true BRPI0822296A2 (pt) 2015-06-30

Family

ID=40985197

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0822296-7A BRPI0822296A2 (pt) 2008-02-22 2008-10-10 Transponder e livreto

Country Status (15)

Country Link
US (1) US9934459B2 (pt)
EP (1) EP2256672B1 (pt)
JP (1) JP5287731B2 (pt)
KR (1) KR101154170B1 (pt)
CN (1) CN101946254B (pt)
AU (1) AU2008351057B2 (pt)
BR (1) BRPI0822296A2 (pt)
CA (1) CA2712602C (pt)
ES (1) ES2590339T3 (pt)
MX (1) MX2010008213A (pt)
MY (1) MY177316A (pt)
PL (1) PL2256672T3 (pt)
RU (1) RU2467393C2 (pt)
TW (1) TWI479425B (pt)
WO (1) WO2009104303A1 (pt)

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JP5509959B2 (ja) * 2010-03-19 2014-06-04 凸版印刷株式会社 非接触型情報媒体付属冊子
JP2012035486A (ja) * 2010-08-06 2012-02-23 Toppan Printing Co Ltd 非接触ｉｃ媒体及び非接触ｉｃ付き冊子
JP2012137807A (ja) * 2010-12-24 2012-07-19 Toppan Printing Co Ltd Ｉｃ付冊子及びその製造方法
JP5208234B2 (ja) * 2011-02-28 2013-06-12 三菱電機株式会社 無線装置及びこの無線装置を用いたリモートキーレスエントリー装置
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US8763914B2 (en) 2012-01-17 2014-07-01 On Track Innovations Ltd. Decoupled contactless bi-directional systems and methods
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JPWO2013161781A1 (ja) * 2012-04-24 2015-12-24 凸版印刷株式会社 非接触型情報媒体及び非接触型情報媒体付属冊子
CN103729675B (zh) * 2013-12-04 2018-12-28 上海中卡智能卡有限公司 一种非接触智能识别卡inlay层及其制备方法
US20150216610A1 (en) * 2014-02-06 2015-08-06 Augustine Biomedical And Design, Llc System, apparatus and methods for counting and detecting surgical sponges
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JP6844232B2 (ja) * 2016-12-06 2021-03-17 凸版印刷株式会社 冊子体用非接触通信媒体、および、冊子体
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US10461397B2 (en) 2017-09-05 2019-10-29 Augustine Biomedical And Design, Llc Surgical sponges with flexible RFID tags
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JP5287731B2 (ja) 2013-09-11
TWI479425B (zh) 2015-04-01
AU2008351057B2 (en) 2012-04-26
MY177316A (en) 2020-09-11
TW200937303A (en) 2009-09-01
KR20100107053A (ko) 2010-10-04
WO2009104303A1 (ja) 2009-08-27
US9934459B2 (en) 2018-04-03
JPWO2009104303A1 (ja) 2011-06-16
RU2010134567A (ru) 2012-03-27
AU2008351057A1 (en) 2009-08-27
EP2256672B1 (en) 2016-04-13
US20110002107A1 (en) 2011-01-06
CN101946254B (zh) 2014-05-07
CN101946254A (zh) 2011-01-12
CA2712602A1 (en) 2009-08-27
EP2256672A4 (en) 2014-02-19
EP2256672A1 (en) 2010-12-01
KR101154170B1 (ko) 2012-06-14
RU2467393C2 (ru) 2012-11-20
CA2712602C (en) 2014-08-05
ES2590339T3 (es) 2016-11-21
MX2010008213A (es) 2010-09-30

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