BRPI0818269A2 - Placa condutora com área de contato e disposição - Google Patents
Placa condutora com área de contato e disposiçãoInfo
- Publication number
- BRPI0818269A2 BRPI0818269A2 BRPI0818269A BRPI0818269A2 BR PI0818269 A2 BRPI0818269 A2 BR PI0818269A2 BR PI0818269 A BRPI0818269 A BR PI0818269A BR PI0818269 A2 BRPI0818269 A2 BR PI0818269A2
- Authority
- BR
- Brazil
- Prior art keywords
- arrangement
- contact area
- conductive plate
- contact point
- electrically contacted
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Electroluminescent Light Sources (AREA)
- Hybrid Cells (AREA)
- Inert Electrodes (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20070075955 EP2056654A1 (de) | 2007-11-02 | 2007-11-02 | Leiterplatte mit Kontaktfläche und Anordnung |
PCT/EP2008/064878 WO2009056645A1 (de) | 2007-11-02 | 2008-11-03 | Leiterplatte mit kontaktfläche und anordnung |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0818269A2 true BRPI0818269A2 (pt) | 2015-04-14 |
Family
ID=39247652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0818269 BRPI0818269A2 (pt) | 2007-11-02 | 2008-11-03 | Placa condutora com área de contato e disposição |
Country Status (10)
Country | Link |
---|---|
US (1) | US20100321915A1 (pt) |
EP (2) | EP2056654A1 (pt) |
JP (1) | JP2011503860A (pt) |
KR (1) | KR20100103491A (pt) |
CN (1) | CN101843179B (pt) |
AT (1) | ATE510447T1 (pt) |
BR (1) | BRPI0818269A2 (pt) |
MX (1) | MX2010004862A (pt) |
PL (1) | PL2208405T3 (pt) |
WO (1) | WO2009056645A1 (pt) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010014940B4 (de) * | 2010-04-14 | 2013-12-19 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit Anschlusselementen |
DE102022213011A1 (de) | 2022-12-02 | 2024-06-13 | Zf Friedrichshafen Ag | Leistungsmodul für einen Wandler mit verbesserter Feldabschirmung von Signalpins |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4593464A (en) * | 1983-08-15 | 1986-06-10 | Allied Corporation | Method of making a triaxial electrical connector |
JPH0287484A (ja) * | 1988-09-22 | 1990-03-28 | Junkosha Co Ltd | 基板マウント |
US5011066A (en) * | 1990-07-27 | 1991-04-30 | Motorola, Inc. | Enhanced collapse solder interconnection |
CN1123959A (zh) * | 1994-08-05 | 1996-06-05 | 惠特克公司 | 电路板用的连接器 |
US5791911A (en) * | 1996-10-25 | 1998-08-11 | International Business Machines Corporation | Coaxial interconnect devices and methods of making the same |
AU6337998A (en) * | 1997-02-28 | 1998-09-18 | Cornell Research Foundation Inc. | Self-assembled low-insertion force connector assembly |
US5898574A (en) * | 1997-09-02 | 1999-04-27 | Tan; Wiling | Self aligning electrical component |
CN2305794Y (zh) * | 1997-09-03 | 1999-01-27 | 鸿海精密工业股份有限公司 | 板对板连接器 |
DE102005017849B4 (de) * | 2005-04-18 | 2012-11-08 | Siemens Ag | Elektronisches Bauteil |
-
2007
- 2007-11-02 EP EP20070075955 patent/EP2056654A1/de not_active Withdrawn
-
2008
- 2008-11-03 BR BRPI0818269 patent/BRPI0818269A2/pt not_active IP Right Cessation
- 2008-11-03 PL PL08845428T patent/PL2208405T3/pl unknown
- 2008-11-03 KR KR1020107012098A patent/KR20100103491A/ko not_active Application Discontinuation
- 2008-11-03 CN CN200880113837XA patent/CN101843179B/zh not_active Expired - Fee Related
- 2008-11-03 AT AT08845428T patent/ATE510447T1/de active
- 2008-11-03 EP EP20080845428 patent/EP2208405B1/de not_active Not-in-force
- 2008-11-03 MX MX2010004862A patent/MX2010004862A/es active IP Right Grant
- 2008-11-03 JP JP2010532560A patent/JP2011503860A/ja active Pending
- 2008-11-03 US US12/740,938 patent/US20100321915A1/en not_active Abandoned
- 2008-11-03 WO PCT/EP2008/064878 patent/WO2009056645A1/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN101843179B (zh) | 2012-02-29 |
MX2010004862A (es) | 2010-11-09 |
EP2208405B1 (de) | 2011-05-18 |
KR20100103491A (ko) | 2010-09-27 |
PL2208405T3 (pl) | 2011-10-31 |
CN101843179A (zh) | 2010-09-22 |
US20100321915A1 (en) | 2010-12-23 |
EP2056654A1 (de) | 2009-05-06 |
WO2009056645A1 (de) | 2009-05-07 |
ATE510447T1 (de) | 2011-06-15 |
EP2208405A1 (de) | 2010-07-21 |
JP2011503860A (ja) | 2011-01-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 7A ANUIDADE. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2343 DE 01-12-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |