BRPI0810798A2 - Processo para aplicação de revestimento metálico em um substrato não-condutor. - Google Patents

Processo para aplicação de revestimento metálico em um substrato não-condutor.

Info

Publication number
BRPI0810798A2
BRPI0810798A2 BRPI0810798-0A2A BRPI0810798A BRPI0810798A2 BR PI0810798 A2 BRPI0810798 A2 BR PI0810798A2 BR PI0810798 A BRPI0810798 A BR PI0810798A BR PI0810798 A2 BRPI0810798 A2 BR PI0810798A2
Authority
BR
Brazil
Prior art keywords
application
metal coating
conducting substrate
conducting
substrate
Prior art date
Application number
BRPI0810798-0A2A
Other languages
English (en)
Inventor
Sigrid Schadow
Brigitte Dyrbusch
Carl Christian Fels
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of BRPI0810798A2 publication Critical patent/BRPI0810798A2/pt
Publication of BRPI0810798B1 publication Critical patent/BRPI0810798B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886—Multistep pretreatment
    • C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
BRPI0810798-0A 2007-05-03 2008-04-24 Processo para aplicação de revestimento metálico em um substrato não-condutor. BRPI0810798B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP07008950.3 2007-05-03
EP07008950A EP1988192B1 (en) 2007-05-03 2007-05-03 Process for applying a metal coating to a non-conductive substrate
PCT/EP2008/003345 WO2008135179A1 (en) 2007-05-03 2008-04-24 Process for applying a metal coating to a non-conductive substrate

Publications (2)

Publication Number Publication Date
BRPI0810798A2 true BRPI0810798A2 (pt) 2014-10-29
BRPI0810798B1 BRPI0810798B1 (pt) 2020-03-24

Family

ID=38468848

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0810798-0A BRPI0810798B1 (pt) 2007-05-03 2008-04-24 Processo para aplicação de revestimento metálico em um substrato não-condutor.

Country Status (10)

Country Link
US (1) US8152914B2 (pt)
EP (1) EP1988192B1 (pt)
JP (1) JP5279815B2 (pt)
KR (3) KR101579191B1 (pt)
CN (1) CN101675186B (pt)
BR (1) BRPI0810798B1 (pt)
ES (1) ES2395736T3 (pt)
PL (1) PL1988192T3 (pt)
PT (1) PT1988192E (pt)
WO (1) WO2008135179A1 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2305856A1 (en) * 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Process for applying a metal coating to a non-conductive substrate
EP2581469B1 (en) * 2011-10-10 2015-04-15 Enthone, Inc. Aqueous activator solution and process for electroless copper deposition on laser-direct structured substrates
EP2809825B1 (en) * 2012-02-01 2018-07-18 ATOTECH Deutschland GmbH Electroless nickel plating bath
EP2784181B1 (en) * 2013-03-27 2015-12-09 ATOTECH Deutschland GmbH Electroless copper plating solution
CN104916820B (zh) * 2015-05-12 2017-05-10 北京理工大学 一种新型锂离子电池用导电材料掺杂硅基负极材料及制备方法
EP3296428B1 (en) * 2016-09-16 2019-05-15 ATOTECH Deutschland GmbH Method for depositing a metal or metal alloy on a surface
CN115135803A (zh) * 2020-02-19 2022-09-30 日产化学株式会社 包含高分子和金属微粒的非电解镀基底剂
CN111778496B (zh) * 2020-07-14 2022-04-19 赤壁市聚茂新材料科技有限公司 锡合金活化铜层镀镍的活化剂和镀镍方法

Family Cites Families (27)

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Publication number Priority date Publication date Assignee Title
US3011920A (en) 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3682671A (en) 1970-02-05 1972-08-08 Kollmorgen Corp Novel precious metal sensitizing solutions
US3984290A (en) 1973-10-01 1976-10-05 Georgy Avenirovich Kitaev Method of forming intralayer junctions in a multilayer structure
AT331943B (de) 1973-11-05 1976-08-25 Erz & Stahl Ges M B H Losungsmittel fur lacke
US5007990A (en) 1987-07-10 1991-04-16 Shipley Company Inc. Electroplating process
US4810333A (en) 1987-12-14 1989-03-07 Shipley Company Inc. Electroplating process
WO1989008375A1 (en) 1988-03-03 1989-09-08 Blasberg-Oberflächentechnik Gmbh New through-hole plated printed circuit board and process for manufacturing same
US4919768A (en) 1989-09-22 1990-04-24 Shipley Company Inc. Electroplating process
RU1819556C (ru) * 1990-01-15 1993-06-07 Институт физиологии и биохимии растений АН МССР Состав дл регулировани роста и развити плодовых деревьев
US5213841A (en) 1990-05-15 1993-05-25 Shipley Company Inc. Metal accelerator
DE4024552A1 (de) * 1990-08-02 1992-02-06 Henkel Kgaa Derivat der aminobernsteinsaeure als komplexierungsmittel
US5376248A (en) * 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process
ES2155075T3 (es) * 1993-03-18 2001-05-01 Atotech Usa Inc Metodo de revestimiento por inmersion, auto-acelerante y auto-renovador, sin formaldehido.
DE19510855C2 (de) * 1995-03-17 1998-04-30 Atotech Deutschland Gmbh Verfahren zum selektiven oder partiellen elektrolytischen Metallisieren von Substraten aus nichtleitenden Materialien
JPH08325742A (ja) * 1995-05-31 1996-12-10 Nitto Chem Ind Co Ltd モノアミン型生分解性キレート剤を用いた無電解Ｃｕメッキ浴
JPH08296049A (ja) * 1995-04-24 1996-11-12 Nitto Chem Ind Co Ltd モノアミン型生分解性キレート剤を用いた無電解Ｎｉメッキ浴
US5910340A (en) * 1995-10-23 1999-06-08 C. Uyemura & Co., Ltd. Electroless nickel plating solution and method
DE69735999T2 (de) * 1997-04-07 2007-05-03 Okuno Chemical Industries Co., Ltd. Verfahren zur elektrobeschichtung eines nichtleitenden geformten kunststoffgegenstands
JP2000144439A (ja) * 1998-10-30 2000-05-26 Kizai Kk 不導体素材へのめっき処理方法とそのための無電解処理液組成物
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Also Published As

Publication number Publication date
ES2395736T3 (es) 2013-02-14
KR20100017608A (ko) 2010-02-16
KR20150063593A (ko) 2015-06-09
WO2008135179A1 (en) 2008-11-13
US20100119713A1 (en) 2010-05-13
JP5279815B2 (ja) 2013-09-04
PL1988192T3 (pl) 2013-04-30
PT1988192E (pt) 2013-01-24
KR101579191B1 (ko) 2015-12-21
JP2010526205A (ja) 2010-07-29
US8152914B2 (en) 2012-04-10
EP1988192A1 (en) 2008-11-05
CN101675186B (zh) 2012-03-07
EP1988192B1 (en) 2012-12-05
CN101675186A (zh) 2010-03-17
KR20150038717A (ko) 2015-04-08
BRPI0810798B1 (pt) 2020-03-24

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

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