BRPI0719855A2 - método para transferência de calor e dispositivo para tal. - Google Patents

método para transferência de calor e dispositivo para tal.

Info

Publication number
BRPI0719855A2
BRPI0719855A2 BRPI0719855A BRPI0719855A BRPI0719855A2 BR PI0719855 A2 BRPI0719855 A2 BR PI0719855A2 BR PI0719855 A BRPI0719855 A BR PI0719855A BR PI0719855 A BRPI0719855 A BR PI0719855A BR PI0719855 A2 BRPI0719855 A2 BR PI0719855A2
Authority
BR
Brazil
Prior art keywords
heat transfer
transfer method
heat
transfer
Prior art date
Application number
BRPI0719855A
Other languages
English (en)
Inventor
Jeong Hyun Lee
Original Assignee
Jeong Hyun Lee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jeong Hyun Lee filed Critical Jeong Hyun Lee
Publication of BRPI0719855A2 publication Critical patent/BRPI0719855A2/pt

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283Means for filling or sealing heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2225/00Reinforcing means
    • F28F2225/04Reinforcing means for conduits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Sorption Type Refrigeration Machines (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
BRPI0719855A 2006-10-11 2007-07-27 método para transferência de calor e dispositivo para tal. BRPI0719855A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200607076-7A SG142174A1 (en) 2006-10-11 2006-10-11 Method for heat transfer and device therefor
PCT/KR2007/003622 WO2008044823A1 (en) 2006-10-11 2007-07-27 Method for heat transfer and device therefor

Publications (1)

Publication Number Publication Date
BRPI0719855A2 true BRPI0719855A2 (pt) 2015-11-03

Family

ID=39282999

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0719855A BRPI0719855A2 (pt) 2006-10-11 2007-07-27 método para transferência de calor e dispositivo para tal.

Country Status (9)

Country Link
US (1) US9250025B2 (pt)
EP (1) EP2074373B1 (pt)
KR (1) KR101169441B1 (pt)
CN (1) CN101542226B (pt)
BR (1) BRPI0719855A2 (pt)
IL (1) IL198136A0 (pt)
SG (1) SG142174A1 (pt)
TW (1) TW200826828A (pt)
WO (2) WO2008044823A1 (pt)

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US20140113112A1 (en) * 2011-07-11 2014-04-24 Dow Global Technologies Llc Microcapillary films containing phase change materials
TW201437591A (zh) * 2013-03-26 2014-10-01 Asustek Comp Inc 熱管結構
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US9921004B2 (en) 2014-09-15 2018-03-20 Kelvin Thermal Technologies, Inc. Polymer-based microfabricated thermal ground plane
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
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US10458719B2 (en) * 2015-01-22 2019-10-29 Pimems, Inc. High performance two-phase cooling apparatus
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TWI639806B (zh) * 2016-02-05 2018-11-01 業強科技股份有限公司 導熱裝置及其製造方法
KR102621427B1 (ko) 2016-04-29 2024-01-08 킴벌리-클라크 월드와이드, 인크. 방향성 유체 이송용 표면
US11543188B2 (en) 2016-06-15 2023-01-03 Delta Electronics, Inc. Temperature plate device
US11306974B2 (en) * 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
CN106017174B (zh) * 2016-06-17 2018-05-04 浙江工业大学 一种滴状冷凝且自集水的微制冷器及其制造方法
WO2018089432A1 (en) 2016-11-08 2018-05-17 Kelvin Thermal Technologies, Inc. Method and device for spreading high heat fluxes in thermal ground planes
KR101826341B1 (ko) * 2017-05-29 2018-02-06 주식회사 씨지아이 박판형 히트파이프 제조방법
KR101826339B1 (ko) * 2017-05-29 2018-02-06 주식회사 씨지아이 관체를 이용한 박판형 히트파이프 제조방법
TWM562956U (zh) * 2017-10-12 2018-07-01 泰碩電子股份有限公司 內凸紋構成流道之均溫板
JP6827117B2 (ja) * 2017-12-28 2021-02-10 古河電気工業株式会社 ヒートパイプ
US10739082B2 (en) * 2018-01-03 2020-08-11 Asia Vital Components Co., Ltd. Anti-pressure structure of heat dissipation device
US11306983B2 (en) * 2018-06-11 2022-04-19 The Regents Of The University Of Colorado, A Body Corporate Single and multi-layer mesh structures for enhanced thermal transport
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KR20060059926A (ko) * 2006-04-24 2006-06-02 (주)아이큐리랩 박판 적층 구조를 갖는 판형 냉각 장치 및 이를 사용하는칩셋
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Also Published As

Publication number Publication date
CN101542226B (zh) 2011-12-14
US9250025B2 (en) 2016-02-02
CN101542226A (zh) 2009-09-23
EP2074373A4 (en) 2013-08-28
EP2074373A1 (en) 2009-07-01
KR20090089303A (ko) 2009-08-21
IL198136A0 (en) 2009-12-24
TW200826828A (en) 2008-06-16
WO2008044823A1 (en) 2008-04-17
WO2008045004A1 (en) 2008-04-17
EP2074373B1 (en) 2016-10-12
US20100084113A1 (en) 2010-04-08
WO2008045004A8 (en) 2008-07-17
KR101169441B1 (ko) 2012-07-30
SG142174A1 (en) 2008-05-28

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Legal Events

Date Code Title Description
B25A Requested transfer of rights approved

Owner name: NEXCHIP TECHNOLOGIES (QA)

B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2472 DE 22-05-2018 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.