BR8904290A - Aparelho para revestir um substrato,sistema de computador,processo para depositar multiplos revestimentos peliculares delgados sobre um substrato e aparelho para revestir um substrato - Google Patents
Aparelho para revestir um substrato,sistema de computador,processo para depositar multiplos revestimentos peliculares delgados sobre um substrato e aparelho para revestir um substratoInfo
- Publication number
- BR8904290A BR8904290A BR898904290A BR8904290A BR8904290A BR 8904290 A BR8904290 A BR 8904290A BR 898904290 A BR898904290 A BR 898904290A BR 8904290 A BR8904290 A BR 8904290A BR 8904290 A BR8904290 A BR 8904290A
- Authority
- BR
- Brazil
- Prior art keywords
- substrate
- appliance
- covering
- coating
- computer system
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23664888A | 1988-08-25 | 1988-08-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
BR8904290A true BR8904290A (pt) | 1990-04-17 |
Family
ID=22890389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR898904290A BR8904290A (pt) | 1988-08-25 | 1989-08-25 | Aparelho para revestir um substrato,sistema de computador,processo para depositar multiplos revestimentos peliculares delgados sobre um substrato e aparelho para revestir um substrato |
Country Status (4)
Country | Link |
---|---|
US (1) | US5234561A (pt) |
KR (1) | KR0157302B1 (pt) |
BR (1) | BR8904290A (pt) |
CA (1) | CA1340811C (pt) |
Families Citing this family (79)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1991000374A1 (de) * | 1989-06-27 | 1991-01-10 | Hauzer Holding Bv | Verfahren und vorrichtung zur beschichtung von substraten |
US5669144A (en) * | 1991-11-15 | 1997-09-23 | The Gillette Company | Razor blade technology |
ZA928617B (en) * | 1991-11-15 | 1993-05-11 | Gillette Co | Shaving system. |
US5441624A (en) * | 1992-08-25 | 1995-08-15 | Northeastern University | Triggered vacuum anodic arc |
US5476134A (en) * | 1993-12-21 | 1995-12-19 | Aluminum Company Of America | CRN coated die-casting tools for casting low aluminum iron alloys and method of making same |
DE4405477A1 (de) * | 1994-02-21 | 1995-08-24 | Hauzer Holding | PVD-Verfahren zur Abscheidung von mehrkomponentigen Hartstoffschichten |
DE19505258C2 (de) * | 1995-02-16 | 1998-08-06 | Samsung Electronics Co Ltd | Beschichtungsvorrichtung |
GB9503304D0 (en) * | 1995-02-20 | 1995-04-12 | Univ Nanyang | Deposition apparatus |
DE29615190U1 (de) * | 1996-03-11 | 1996-11-28 | Balzers Verschleissschutz GmbH, 55411 Bingen | Anlage zur Beschichtung von Werkstücken |
US6009829A (en) * | 1997-08-30 | 2000-01-04 | United Technologies Corporation | Apparatus for driving the arc in a cathodic arc coater |
US5932078A (en) * | 1997-08-30 | 1999-08-03 | United Technologies Corporation | Cathodic arc vapor deposition apparatus |
US5972185A (en) * | 1997-08-30 | 1999-10-26 | United Technologies Corporation | Cathodic arc vapor deposition apparatus (annular cathode) |
US6036828A (en) * | 1997-08-30 | 2000-03-14 | United Technologies Corporation | Apparatus for steering the arc in a cathodic arc coater |
AU4028297A (en) * | 1997-09-12 | 1999-04-05 | Balzers Aktiengesellschaft | Tool having a protective layer system |
DE19832571A1 (de) * | 1998-07-20 | 2000-01-27 | Hauzer Ind Bv | Mehrlagenschicht und Verfahren zu deren Herstellung |
US6245435B1 (en) | 1999-03-01 | 2001-06-12 | Moen Incorporated | Decorative corrosion and abrasion resistant coating |
US6524449B1 (en) | 1999-12-03 | 2003-02-25 | James A. Folta | Method and system for producing sputtered thin films with sub-angstrom thickness uniformity or custom thickness gradients |
DE10001381A1 (de) * | 2000-01-14 | 2001-07-19 | Hauzer Techno Coating Europ B | PVD-Verfahren zur Herstellung einer gefärbten, gegenüber Fingerabdrücken unempfindlichen Beschichtung auf Gegenständen sowie Gegenstände mit einer solchen Beschichtung |
US6620723B1 (en) | 2000-06-27 | 2003-09-16 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
US7732327B2 (en) | 2000-06-28 | 2010-06-08 | Applied Materials, Inc. | Vapor deposition of tungsten materials |
US7101795B1 (en) | 2000-06-28 | 2006-09-05 | Applied Materials, Inc. | Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer |
US7405158B2 (en) | 2000-06-28 | 2008-07-29 | Applied Materials, Inc. | Methods for depositing tungsten layers employing atomic layer deposition techniques |
US7964505B2 (en) | 2005-01-19 | 2011-06-21 | Applied Materials, Inc. | Atomic layer deposition of tungsten materials |
US6551929B1 (en) | 2000-06-28 | 2003-04-22 | Applied Materials, Inc. | Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques |
US6825447B2 (en) * | 2000-12-29 | 2004-11-30 | Applied Materials, Inc. | Apparatus and method for uniform substrate heating and contaminate collection |
US6765178B2 (en) | 2000-12-29 | 2004-07-20 | Applied Materials, Inc. | Chamber for uniform substrate heating |
US6998579B2 (en) | 2000-12-29 | 2006-02-14 | Applied Materials, Inc. | Chamber for uniform substrate heating |
US6951804B2 (en) | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
US20020110700A1 (en) * | 2001-02-12 | 2002-08-15 | Hein Gerald F. | Process for forming decorative films and resulting products |
US6660126B2 (en) | 2001-03-02 | 2003-12-09 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US6878206B2 (en) | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US6734020B2 (en) | 2001-03-07 | 2004-05-11 | Applied Materials, Inc. | Valve control system for atomic layer deposition chamber |
US7211144B2 (en) | 2001-07-13 | 2007-05-01 | Applied Materials, Inc. | Pulsed nucleation deposition of tungsten layers |
US7085616B2 (en) | 2001-07-27 | 2006-08-01 | Applied Materials, Inc. | Atomic layer deposition apparatus |
US7049226B2 (en) | 2001-09-26 | 2006-05-23 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
US6936906B2 (en) | 2001-09-26 | 2005-08-30 | Applied Materials, Inc. | Integration of barrier layer and seed layer |
US6916398B2 (en) | 2001-10-26 | 2005-07-12 | Applied Materials, Inc. | Gas delivery apparatus and method for atomic layer deposition |
US7780785B2 (en) | 2001-10-26 | 2010-08-24 | Applied Materials, Inc. | Gas delivery apparatus for atomic layer deposition |
US6729824B2 (en) | 2001-12-14 | 2004-05-04 | Applied Materials, Inc. | Dual robot processing system |
US6620670B2 (en) | 2002-01-18 | 2003-09-16 | Applied Materials, Inc. | Process conditions and precursors for atomic layer deposition (ALD) of AL2O3 |
US7026057B2 (en) | 2002-01-23 | 2006-04-11 | Moen Incorporated | Corrosion and abrasion resistant decorative coating |
US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
US6998014B2 (en) | 2002-01-26 | 2006-02-14 | Applied Materials, Inc. | Apparatus and method for plasma assisted deposition |
US6827978B2 (en) | 2002-02-11 | 2004-12-07 | Applied Materials, Inc. | Deposition of tungsten films |
US6833161B2 (en) | 2002-02-26 | 2004-12-21 | Applied Materials, Inc. | Cyclical deposition of tungsten nitride for metal oxide gate electrode |
US7439191B2 (en) | 2002-04-05 | 2008-10-21 | Applied Materials, Inc. | Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications |
US6846516B2 (en) | 2002-04-08 | 2005-01-25 | Applied Materials, Inc. | Multiple precursor cyclical deposition system |
US6720027B2 (en) | 2002-04-08 | 2004-04-13 | Applied Materials, Inc. | Cyclical deposition of a variable content titanium silicon nitride layer |
US6875271B2 (en) | 2002-04-09 | 2005-04-05 | Applied Materials, Inc. | Simultaneous cyclical deposition in different processing regions |
US6869838B2 (en) * | 2002-04-09 | 2005-03-22 | Applied Materials, Inc. | Deposition of passivation layers for active matrix liquid crystal display (AMLCD) applications |
JP2003306767A (ja) * | 2002-04-16 | 2003-10-31 | Canon Inc | 堆積膜形成方法 |
US7279432B2 (en) | 2002-04-16 | 2007-10-09 | Applied Materials, Inc. | System and method for forming an integrated barrier layer |
US6821563B2 (en) | 2002-10-02 | 2004-11-23 | Applied Materials, Inc. | Gas distribution system for cyclical layer deposition |
US7262133B2 (en) | 2003-01-07 | 2007-08-28 | Applied Materials, Inc. | Enhancement of copper line reliability using thin ALD tan film to cap the copper line |
JP2007523994A (ja) | 2003-06-18 | 2007-08-23 | アプライド マテリアルズ インコーポレイテッド | バリヤ物質の原子層堆積 |
CN100419117C (zh) * | 2004-02-02 | 2008-09-17 | 株式会社神户制钢所 | 硬质叠层被膜、其制造方法及成膜装置 |
EP1591553A1 (en) * | 2004-04-28 | 2005-11-02 | Becromal S.p.A. | Process for producing an electrode coated with titanium nitride |
JP2007077494A (ja) * | 2005-08-08 | 2007-03-29 | Nanofilm Technologies Internatl Pte Ltd | 金属コーティング |
US20080017501A1 (en) * | 2006-07-21 | 2008-01-24 | Makoto Inagawa | Cooled dark space shield for multi-cathode design |
US7601399B2 (en) * | 2007-01-31 | 2009-10-13 | Surface Modification Systems, Inc. | High density low pressure plasma sprayed focal tracks for X-ray anodes |
CN101368260A (zh) | 2007-09-14 | 2009-02-18 | 山特维克知识产权股份有限公司 | 用于在基底上沉积涂层的方法和设备 |
WO2009079358A1 (en) * | 2007-12-14 | 2009-06-25 | The Regents Of The University Of California | Very low pressure high power impulse triggered magnetron sputtering |
EP2145979A1 (fr) * | 2008-07-16 | 2010-01-20 | AGC Flat Glass Europe SA | Procédé et installation pour le dépôt de couches sur les deux faces d'un substrat de façon simultanée |
US8066857B2 (en) | 2008-12-12 | 2011-11-29 | Fujifilm Corporation | Shaped anode and anode-shield connection for vacuum physical vapor deposition |
US8043487B2 (en) * | 2008-12-12 | 2011-10-25 | Fujifilm Corporation | Chamber shield for vacuum physical vapor deposition |
US8021768B2 (en) * | 2009-04-07 | 2011-09-20 | National Material, L.P. | Plain copper foodware and metal articles with durable and tarnish free multiplayer ceramic coating and method of making |
US8133362B2 (en) * | 2010-02-26 | 2012-03-13 | Fujifilm Corporation | Physical vapor deposition with multi-point clamp |
US9181619B2 (en) * | 2010-02-26 | 2015-11-10 | Fujifilm Corporation | Physical vapor deposition with heat diffuser |
JP5764002B2 (ja) | 2011-07-22 | 2015-08-12 | 株式会社神戸製鋼所 | 真空成膜装置 |
EP2653583B1 (de) * | 2012-04-20 | 2021-03-10 | Oerlikon Surface Solutions AG, Pfäffikon | Beschichtungsverfahren zur Abscheidung eines Schichtsystems auf einem Substrat |
CO6700142A1 (es) * | 2013-06-07 | 2013-06-28 | Univ Del Valle | Recubrimiento biocompatible tipo multicapa-pelicula delgada como tratamiento superficial de sustratos biomédicos y proceso de fabricación del mismo |
CN103668093B (zh) * | 2013-11-27 | 2017-10-20 | 昂纳信息技术(深圳)有限公司 | 一种ar膜和af膜同炉镀膜设备及镀膜方法 |
CZ2016603A3 (cs) * | 2016-09-27 | 2017-10-25 | Fyzikální ústav AV ČR, v.v.i. | Způsob řízení rychlosti depozice tenkých vrstev ve vakuovém vícetryskovém plazmovém systému a zařízení k provádění tohoto způsobu |
CN107130213B (zh) * | 2017-05-03 | 2019-04-09 | 成都真锐科技涂层技术有限公司 | 多元合金复合薄膜制备设备和制备方法 |
US10429673B2 (en) | 2017-09-11 | 2019-10-01 | Quantum Innovations, Inc. | High energy visible light absorbing material for ophthalmic substrate and application method |
CN108085647B (zh) * | 2017-11-28 | 2019-10-15 | 中国科学院宁波材料技术与工程研究所 | 一种用于真空镀膜的螺杆传送装置 |
US11274360B2 (en) * | 2017-12-13 | 2022-03-15 | Plasmionique Inc. | Thin film coating and method of fabrication thereof |
CN111534804B (zh) * | 2020-06-16 | 2022-03-22 | 常州市乐萌压力容器有限公司 | 基于改进灰关联模型的磁控溅射工艺参数优化方法 |
JP7401405B2 (ja) * | 2020-07-15 | 2023-12-19 | 株式会社神戸製鋼所 | 機械学習方法、機械学習装置、機械学習プログラム、通信方法、及び成膜装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3836451A (en) * | 1968-12-26 | 1974-09-17 | A Snaper | Arc deposition apparatus |
US3625848A (en) * | 1968-12-26 | 1971-12-07 | Alvin A Snaper | Arc deposition process and apparatus |
US4180450A (en) * | 1978-08-21 | 1979-12-25 | Vac-Tec Systems, Inc. | Planar magnetron sputtering device |
US4162954A (en) * | 1978-08-21 | 1979-07-31 | Vac-Tec Systems, Inc. | Planar magnetron sputtering device |
US4234622A (en) * | 1979-04-11 | 1980-11-18 | The United States Of American As Represented By The Secretary Of The Army | Vacuum deposition method |
CH645137A5 (de) * | 1981-03-13 | 1984-09-14 | Balzers Hochvakuum | Verfahren und vorrichtung zum verdampfen von material unter vakuum. |
JPS58153776A (ja) * | 1982-03-05 | 1983-09-12 | Citizen Watch Co Ltd | 装飾部品の製造方法およびそれに用いるイオンプレ−テイング装置 |
US4430184A (en) * | 1983-05-09 | 1984-02-07 | Vac-Tec Systems, Inc. | Evaporation arc stabilization |
US4500408A (en) * | 1983-07-19 | 1985-02-19 | Varian Associates, Inc. | Apparatus for and method of controlling sputter coating |
DE3402971A1 (de) * | 1984-01-28 | 1985-08-01 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Vorrichtung zur beschichtung eines substrates mittels plasma-chemical vapour deposition oder hochfrequenz-kathodenzerstaeubung |
US4560462A (en) * | 1984-06-22 | 1985-12-24 | Westinghouse Electric Corp. | Apparatus for coating nuclear fuel pellets with a burnable absorber |
JPS6137960A (ja) * | 1984-07-28 | 1986-02-22 | Tadanobu Okubo | 金属表面加工方法 |
US4724058A (en) * | 1984-08-13 | 1988-02-09 | Vac-Tec Systems, Inc. | Method and apparatus for arc evaporating large area targets |
US4591418A (en) * | 1984-10-26 | 1986-05-27 | The Parker Pen Company | Microlaminated coating |
BG41744A1 (en) * | 1984-11-26 | 1987-08-14 | Savov | Method for control of chimico= thermic processing of work- pieces with glowing dicharge in medium of processing gas and device for implementing this method |
ATE65265T1 (de) * | 1987-08-26 | 1991-08-15 | Balzers Hochvakuum | Verfahren zur aufbringung von schichten auf substraten und vakuumbeschichtungsanlage zur durchfuehrung des verfahrens. |
-
1988
- 1988-08-25 US US07/236,649 patent/US5234561A/en not_active Expired - Lifetime
-
1989
- 1989-08-24 KR KR1019890012066A patent/KR0157302B1/ko not_active IP Right Cessation
- 1989-08-24 CA CA000609236A patent/CA1340811C/en not_active Expired - Fee Related
- 1989-08-25 BR BR898904290A patent/BR8904290A/pt unknown
Also Published As
Publication number | Publication date |
---|---|
US5234561A (en) | 1993-08-10 |
KR0157302B1 (ko) | 1998-11-16 |
CA1340811C (en) | 1999-11-02 |
KR900003406A (ko) | 1990-03-26 |
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