JPS63235351A
(ja)
*
|
1987-03-25 |
1988-09-30 |
Kureha Chem Ind Co Ltd |
熱可塑性樹脂組成物
|
DE3712017A1
(de)
*
|
1987-04-09 |
1988-10-27 |
Basf Ag |
Epoxidharzmassen mit verbesserter lagerstabilitaet
|
DE3811014A1
(de)
*
|
1988-03-31 |
1989-10-19 |
Basf Ag |
Schlagfeste thermoplastische formmasse und deren verwendung
|
JPH02117948A
(ja)
*
|
1988-08-30 |
1990-05-02 |
Japan Synthetic Rubber Co Ltd |
変性エポキシ組成物
|
JPH02110127A
(ja)
*
|
1988-10-19 |
1990-04-23 |
Toshiba Chem Corp |
封止用樹脂組成物
|
JP2692208B2
(ja)
*
|
1988-12-14 |
1997-12-17 |
日本合成ゴム株式会社 |
変性エポキシ組成物
|
EP0391183B1
(de)
*
|
1989-04-07 |
1994-06-29 |
Asea Brown Boveri Ag |
Elektrischer Isolator
|
JPH0639562B2
(ja)
*
|
1989-06-08 |
1994-05-25 |
信越化学工業株式会社 |
半導体封止用エポキシ樹脂組成物の製造方法
|
US5002982A
(en)
*
|
1990-02-26 |
1991-03-26 |
Gencorp Inc. |
Paper felts or mats
|
US5789482A
(en)
*
|
1990-03-30 |
1998-08-04 |
Ciba Specialty Chemicals Corporation |
Epoxy resin with anhydride, toughener and active hydrogen-containing compound
|
US5115019A
(en)
*
|
1990-03-30 |
1992-05-19 |
Shell Oil Company |
Carboxy-functional hydrogenated block copolymer dispersed in epoxy resin
|
JPH0762063B2
(ja)
*
|
1990-05-11 |
1995-07-05 |
信越化学工業株式会社 |
エポキシ樹脂組成物
|
US5284912A
(en)
*
|
1990-08-16 |
1994-02-08 |
Japan Synthetic Rubber Co., Ltd. |
Thermoset resin with polyunsaturated monomer-grafted seed particles
|
CA2058331A1
(en)
*
|
1990-12-28 |
1992-06-29 |
Ichiro Sasaki |
Core-shell polymer
|
US5290857A
(en)
*
|
1991-09-04 |
1994-03-01 |
Nippon Zeon Co., Ltd. |
Epoxy resin adhesive composition
|
USH1405H
(en)
*
|
1992-04-09 |
1995-01-03 |
Shell Oil Company |
Epoxy resin composition
|
DE59308794D1
(de)
*
|
1992-06-25 |
1998-08-27 |
Ciba Geigy Ag |
Lagerstabile Suspension von Härtern und Zähigkeitsvermittlern für Epoxidharze
|
DE59310074D1
(de)
*
|
1992-07-09 |
2000-08-17 |
Ciba Sc Holding Ag |
Härtbare Suspensionen auf Basis von Epoxidharzen
|
US5268452A
(en)
*
|
1992-07-22 |
1993-12-07 |
The B.F. Goodrich Company |
RLP modified unsaturated polyester resins blended with reactive liquid polymers
|
US5691416A
(en)
*
|
1992-11-05 |
1997-11-25 |
Nippon Shokubai Co., Ltd. |
(Meth)acrylate polymer particles dispersed in epoxy resin
|
JP3655646B2
(ja)
*
|
1993-05-24 |
2005-06-02 |
日産自動車株式会社 |
エポキシ樹脂用接着補強剤及び該補強剤を含有する自動車用エポキシ樹脂系構造接着性組成物
|
JPH07109337A
(ja)
*
|
1993-08-20 |
1995-04-25 |
Toshiba Corp |
エポキシ樹脂注型材料
|
JPH08100162A
(ja)
*
|
1994-09-29 |
1996-04-16 |
Nippon Zeon Co Ltd |
エポキシ樹脂系接着性組成物を用いる接着方法
|
DE59609259D1
(de)
|
1995-11-29 |
2002-07-04 |
Vantico Ag |
Core/Shell-Partikel und diese enthaltende härtbare Epoxidharzzusammensetzungen
|
US6248204B1
(en)
|
1999-05-14 |
2001-06-19 |
Loctite Corporation |
Two part, reinforced, room temperature curable thermosetting epoxy resin compositions with improved adhesive strength and fracture toughness
|
US6664318B1
(en)
|
1999-12-20 |
2003-12-16 |
3M Innovative Properties Company |
Encapsulant compositions with thermal shock resistance
|
US6344853B1
(en)
*
|
2000-01-06 |
2002-02-05 |
Alcone Marketing Group |
Method and apparatus for selecting, modifying and superimposing one image on another
|
EP1434831B1
(en)
*
|
2001-09-06 |
2005-03-16 |
Valspar Sourcing, Inc. |
Stabilized coating compositions
|
US6916874B2
(en)
*
|
2001-09-06 |
2005-07-12 |
Valspar Sourcing, Inc. |
Coating compositions having epoxy functional stabilizer
|
US6924328B2
(en)
*
|
2001-09-06 |
2005-08-02 |
Valspar Sourcing, Inc. |
Stabilized coating compositions
|
US20030144415A1
(en)
*
|
2002-01-29 |
2003-07-31 |
Dsm N.V. |
Process for the preparation of a thermoplastic elastomer comprising a partially vulcanized rubber concentrate
|
US20030198824A1
(en)
*
|
2002-04-19 |
2003-10-23 |
Fong John W. |
Photocurable compositions containing reactive polysiloxane particles
|
US7566377B2
(en)
*
|
2002-09-19 |
2009-07-28 |
Mitsui Chemicals, Inc. |
Liquid crystal sealing agent composition and manufacturing method of liquid crystal display panel using the same
|
KR100780582B1
(ko)
*
|
2003-06-09 |
2007-11-29 |
카네카 코포레이션 |
변성 에폭시 수지의 제조방법
|
CA2538698A1
(en)
*
|
2003-09-18 |
2005-03-31 |
Kaneka Corporation |
Process for producing rubbery polymer particle and process for producing resin composition containing the same
|
KR100548626B1
(ko)
*
|
2003-10-29 |
2006-01-31 |
주식회사 엘지화학 |
고무라텍스 및 이의 제조방법
|
CA2577681C
(en)
*
|
2004-08-18 |
2013-10-08 |
Kaneka Corporation |
Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material
|
US7649060B2
(en)
*
|
2005-12-02 |
2010-01-19 |
Henkel Corporation |
Curable compositions
|
US8029889B1
(en)
|
2004-12-03 |
2011-10-04 |
Henkel Corporation |
Prepregs, towpregs and preforms
|
US20060182949A1
(en)
*
|
2005-02-17 |
2006-08-17 |
3M Innovative Properties Company |
Surfacing and/or joining method
|
KR100646939B1
(ko)
*
|
2005-08-29 |
2006-11-23 |
삼성에스디아이 주식회사 |
박막트랜지스터 및 그 제조방법
|
JP5031824B2
(ja)
*
|
2006-05-03 |
2012-09-26 |
デルファイ・テクノロジーズ・ホールディング・エス.アー.エール.エル. |
アクチュエーターを被覆するための方法
|
PL2049611T3
(pl)
*
|
2006-07-31 |
2019-04-30 |
Henkel Ag & Co Kgaa |
Utwardzalne kompozycje klejowe oparte na żywicach epoksydowych
|
KR20090080956A
(ko)
|
2006-10-06 |
2009-07-27 |
헨켈 아게 운트 코. 카게아아 |
발수성의 펌핑가능한 에폭시 페이스트 접착제
|
EP2081988B1
(en)
|
2006-11-13 |
2017-01-04 |
Henkel IP & Holding GmbH |
Benzoxazine compositions with core shell rubbers
|
US7537827B1
(en)
|
2006-12-13 |
2009-05-26 |
Henkel Corporation |
Prepreg laminates
|
WO2008085285A1
(en)
*
|
2006-12-19 |
2008-07-17 |
Henkel Corporation |
Cyanoacrylate compositions containing dispersions of core shell rubbers in (meth)acrylates
|
WO2008085286A1
(en)
*
|
2006-12-19 |
2008-07-17 |
Henkel Corporation |
(meth)acrylate compositions containing dispersions of core shell rubbers in (meth)acrylates
|
GB0700960D0
(en)
*
|
2007-01-18 |
2007-02-28 |
3M Innovative Properties Co |
High strength epoxy adhesive and uses thereof
|
EP2123711B1
(en)
*
|
2007-02-28 |
2016-12-14 |
Kaneka Corporation |
Thermosetting resin composition having rubbery polymer particle dispersed therein, and process for production thereof
|
EP2031916B1
(en)
*
|
2007-07-27 |
2011-12-21 |
Research In Motion Limited |
Administration of policies for wireless devices in a wireless communication system
|
US20110003946A1
(en)
*
|
2008-01-18 |
2011-01-06 |
Klaus-Volker Schuett |
Curable reaction resin system
|
US7847034B2
(en)
*
|
2008-03-20 |
2010-12-07 |
Loctite (R&D) Limited |
Adducts and curable compositions using same
|
WO2009126862A1
(en)
*
|
2008-04-11 |
2009-10-15 |
3M Innovative Properties Company |
One-part epoxy-based structural adhesive
|
DE102008023076A1
(de)
*
|
2008-05-09 |
2009-11-12 |
Henkel Ag & Co. Kgaa |
Polymerisierbare Zusammensetzung
|
EP2135909B1
(en)
|
2008-06-12 |
2018-01-10 |
Henkel IP & Holding GmbH |
Next generation, highly toughened two part structural epoxy adhesive compositions
|
US8309633B2
(en)
*
|
2008-07-17 |
2012-11-13 |
Henkel Ireland Ltd. |
Low temperature, cationically curable compositions with improved cure speed and toughness
|
CN102159615B
(zh)
|
2008-07-23 |
2014-10-01 |
3M创新有限公司 |
两部分的环氧基结构粘合剂
|
WO2010011714A2
(en)
|
2008-07-23 |
2010-01-28 |
3M Innovative Properties Company |
Reactive liquid modifiers
|
EP2321370B1
(en)
*
|
2008-07-23 |
2017-03-15 |
3M Innovative Properties Company |
Two-part epoxy-based structural adhesives
|
JP5559053B2
(ja)
|
2008-08-12 |
2014-07-23 |
株式会社カネカ |
不飽和エステル系樹脂組成物、不飽和エステル系硬化物、及びこれらの製造方法
|
GB0817795D0
(en)
*
|
2008-09-30 |
2008-11-05 |
3M Innovative Properties Co |
Fast curing oil-uptaking epozxy-based structural adhesives
|
DE102009001855A1
(de)
*
|
2009-03-25 |
2010-09-30 |
Henkel Ag & Co. Kgaa |
Verfahren zur Herstellung eines faserhaltigen Verbundwerkstoffs
|
EP2451881B1
(en)
*
|
2009-07-08 |
2014-11-12 |
Henkel AG & Co. KGaA |
Electrically conductive adhesives
|
EP2473573B1
(en)
|
2009-08-31 |
2018-06-13 |
Cytec Technology Corporation |
High performance adhesive compositions
|
JP5530524B2
(ja)
|
2009-09-11 |
2014-06-25 |
スリーエム イノベイティブ プロパティズ カンパニー |
硬化性及び硬化済み接着剤組成物
|
KR101719019B1
(ko)
|
2009-09-11 |
2017-03-22 |
쓰리엠 이노베이티브 프로퍼티즈 컴파니 |
경화성 및 경화된 접착제 조성물
|
GB0922599D0
(en)
*
|
2009-12-23 |
2010-02-10 |
Cytec Tech Corp |
Modified resin systems for liquid resin infusion applications, prepreg autoclave applications and hybrids thereof
|
CN103068946B
(zh)
|
2010-08-10 |
2015-05-06 |
3M创新有限公司 |
环氧树脂结构粘合剂
|
JP5629009B2
(ja)
|
2010-09-15 |
2014-11-19 |
ヘンケル アイルランド リミテッド |
二成分系シアノアクリレート/カチオン硬化性接着剤システム
|
US9290683B2
(en)
|
2010-11-12 |
2016-03-22 |
3M Innovative Properties Company |
Curable and cured compositions
|
KR101794388B1
(ko)
|
2010-11-12 |
2017-11-06 |
쓰리엠 이노베이티브 프로퍼티즈 컴파니 |
경화성 조성물
|
EP2468792A1
(en)
|
2010-12-23 |
2012-06-27 |
3M Innovative Properties Company |
Curable adhesive composition
|
WO2012093631A1
(ja)
|
2011-01-05 |
2012-07-12 |
株式会社カネカ |
ポリマー微粒子分散樹脂組成物、及びその製造方法
|
GB201100568D0
(en)
*
|
2011-01-13 |
2011-03-02 |
Cytec Engineered Materials Ltd |
Particle reinforced polymer composition
|
KR20140094527A
(ko)
*
|
2011-11-08 |
2014-07-30 |
다우 글로벌 테크놀로지스 엘엘씨 |
열경화가능 에폭시 수지 조성물을 위한 바이모달 강인화제
|
JP6063477B2
(ja)
|
2011-12-16 |
2017-01-18 |
スリーエム イノベイティブ プロパティズ カンパニー |
オキシラン含有ビスアンヒドロヘキシトール誘導体及びその使用
|
IN2014CN04434A
(pt)
|
2011-12-16 |
2015-09-04 |
3M Innovative Properties Co |
|
WO2014062903A1
(en)
|
2012-10-19 |
2014-04-24 |
Dow Global Technologies Llc |
Polymer particle dispersions with polyols
|
US8981027B2
(en)
|
2013-03-15 |
2015-03-17 |
Henkel IP & Holding GmbH |
Two-part, cyanoacrylate/cationically curable adhesive systems
|
US10577522B2
(en)
|
2013-07-26 |
2020-03-03 |
Zephyros, Inc. |
Thermosetting adhesive films including a fibrous carrier
|
WO2015097283A1
(en)
|
2013-12-24 |
2015-07-02 |
Hexcel Composites Limited |
Improvements to matrix additives
|
EP2957584B1
(en)
|
2014-06-17 |
2017-03-01 |
3M Innovative Properties Company |
Rapid curing epoxy adhesive compositions
|
CN107001898B
(zh)
*
|
2014-11-28 |
2020-10-27 |
大日本印刷株式会社 |
粘合剂组合物和使用该粘合剂组合物的粘合片材
|
DE102014226826A1
(de)
|
2014-12-22 |
2016-06-23 |
Henkel Ag & Co. Kgaa |
Epoxidharz-Zusammensetzung
|
FR3031106B1
(fr)
|
2014-12-24 |
2017-02-03 |
Arkema France |
Composition de polymeres a phases multiples, son procede de preparation, son utilisation et composition la comprenant
|
FR3031108B1
(fr)
*
|
2014-12-24 |
2018-08-17 |
Arkema France |
Composition comprenant un polymere a phases multiples, son procede de preparation et son utlisation
|
FR3031109B1
(fr)
*
|
2014-12-24 |
2018-08-17 |
Arkema France |
Composition de polymeres, son procede de preparation, son utilisation et composition la comprenant
|
JP6838819B2
(ja)
|
2015-07-01 |
2021-03-03 |
スリーエム イノベイティブ プロパティズ カンパニー |
向上した性能及び/又は耐久性を有する複合膜並びに使用方法
|
KR20180023971A
(ko)
|
2015-07-01 |
2018-03-07 |
쓰리엠 이노베이티브 프로퍼티즈 컴파니 |
중합체성 이오노머 분리막 및 사용 방법
|
CN107735163B
(zh)
|
2015-07-01 |
2021-02-23 |
3M创新有限公司 |
含pvp和/或pvl的复合膜以及使用方法
|
DE102017126328A1
(de)
|
2016-11-11 |
2018-05-17 |
GM Global Technology Operations LLC |
Dual-Cure Konstruktionsklebstoff
|
EP3596182B1
(en)
|
2017-03-17 |
2021-06-30 |
Dow Global Technologies LLC |
Epoxy-acrylic hybrid adhesive
|
JP7199354B2
(ja)
|
2017-07-28 |
2023-01-05 |
株式会社カネカ |
エポキシ樹脂組成物
|
JP7167301B2
(ja)
*
|
2018-07-25 |
2022-11-08 |
エルジー・ケム・リミテッド |
接着剤組成物
|
GB2576791B
(en)
|
2018-08-13 |
2022-09-14 |
Henkel Ag & Co Kgaa |
A two-part cyanoacrylate curable adhesive system
|
GB2576792B
(en)
|
2018-08-13 |
2022-09-14 |
Henkel Ag & Co Kgaa |
A two-part cyanoacrylate curable adhesive system
|
GB2582537B
(en)
|
2019-03-04 |
2022-02-23 |
Henkel IP & Holding GmbH |
Two-part, cyanoacrylate/cationically curable adhesive systems
|
JP6923090B2
(ja)
|
2019-04-23 |
2021-08-18 |
Dic株式会社 |
硬化性組成物、硬化物、繊維強化複合材料、成形品及びその製造方法
|
EP3825355A1
(de)
|
2019-11-22 |
2021-05-26 |
Henkel AG & Co. KGaA |
Formulierungen mit hohen glasübergangstemperaturen für laminate
|
EP4143252A1
(en)
|
2020-04-28 |
2023-03-08 |
3M Innovative Properties Company |
Curable composition
|
US11884815B2
(en)
*
|
2020-07-22 |
2024-01-30 |
Arisawa Mfg. Co., Ltd. |
Thermosetting resin composition, coverlay film, adhesive sheet, and flexible printed wiring board
|
TW202219214A
(zh)
|
2020-08-27 |
2022-05-16 |
德商漢高股份有限及兩合公司 |
導電性單組分型(1k)環氧樹脂調配物
|
WO2024003053A1
(en)
|
2022-06-28 |
2024-01-04 |
Henkel Ag & Co. Kgaa |
Method of underwater bonding
|