BR112017008885A2 - capacitor, e, conjunto eletrônico. - Google Patents

capacitor, e, conjunto eletrônico.

Info

Publication number
BR112017008885A2
BR112017008885A2 BR112017008885A BR112017008885A BR112017008885A2 BR 112017008885 A2 BR112017008885 A2 BR 112017008885A2 BR 112017008885 A BR112017008885 A BR 112017008885A BR 112017008885 A BR112017008885 A BR 112017008885A BR 112017008885 A2 BR112017008885 A2 BR 112017008885A2
Authority
BR
Brazil
Prior art keywords
winding element
conductive end
capacitor
conductive
layer
Prior art date
Application number
BR112017008885A
Other languages
English (en)
Other versions
BR112017008885B1 (pt
Inventor
N Singh Brij
Roan Thomas
Original Assignee
Deere & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deere & Co filed Critical Deere & Co
Publication of BR112017008885A2 publication Critical patent/BR112017008885A2/pt
Publication of BR112017008885B1 publication Critical patent/BR112017008885B1/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/236Terminals leading through the housing, i.e. lead-through
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10Housing; Encapsulation
    • H01G2/106Fixing the capacitor in a housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/32Wound capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/38Multiple capacitors, i.e. structural combinations of fixed capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

um capacitor (100) compreende um primeiro elemento de enrolamento (58), onde o primeiro elemento de enrolamento (58) compreende uma primeira camada dielétrica (56) e uma primeira camada condutora (50). um segundo elemento de enrolamento (60) compreende uma segunda camada dielétrica (57) e segunda camada condutora (52). o primeiro elemento de enrolamento (58) é intercalado, parcial ou totalmente, com a segunda camada de enrolamento (60). um invólucro dielétrico (24) ou invólucro está adaptado para pelo menos radialmente conter ou circundar o primeiro elemento de enrolamento (58) e o segundo elemento de enrolamento (60). o primeiro elemento de enrolamento (58) é eletricamente conectado a uma primeira extremidade condutora (20). um segundo elemento de enrolamento (60) é eletricamente conectado a uma segunda extremidade condutora (21). a segunda extremidade condutora (21) está oposta à primeira extremidade condutora (20). a primeira extremidade condutora (20) forma um primeiro condutor; a segunda extremidade condutora (21) forma um segundo condutor.
BR112017008885-1A 2014-12-12 2015-11-20 Capacitor, e, conjunto eletrônico BR112017008885B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/568,682 US9439278B2 (en) 2014-12-12 2014-12-12 Film capacitor having a package for heat transfer
US14/568,682 2014-12-12
PCT/US2015/061846 WO2016094059A1 (en) 2014-12-12 2015-11-20 Film capacitor having a package for heat transfer

Publications (2)

Publication Number Publication Date
BR112017008885A2 true BR112017008885A2 (pt) 2017-12-19
BR112017008885B1 BR112017008885B1 (pt) 2022-12-13

Family

ID=56107941

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112017008885-1A BR112017008885B1 (pt) 2014-12-12 2015-11-20 Capacitor, e, conjunto eletrônico

Country Status (5)

Country Link
US (1) US9439278B2 (pt)
EP (1) EP3230994B1 (pt)
CN (1) CN107112132B (pt)
BR (1) BR112017008885B1 (pt)
WO (1) WO2016094059A1 (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6435905B2 (ja) * 2015-02-13 2018-12-12 株式会社デンソー 電力変換装置
US9860987B2 (en) * 2015-02-13 2018-01-02 Deere & Company Electronic assembly with one or more heat sinks
US9480187B2 (en) * 2015-03-29 2016-10-25 Banqiu Wu Cooling method for a 3D IC computer system
US10461021B2 (en) 2017-02-28 2019-10-29 Deere & Company Electronic assembly with enhanced thermal dissipation
DE102018201842A1 (de) 2018-02-06 2019-08-08 Siemens Aktiengesellschaft Leistungselektronische Schaltung mit mehreren Leistungsmodulen
EP3522188A1 (de) * 2018-02-06 2019-08-07 Siemens Aktiengesellschaft Kondensatoraufbau und leistungsmodul mit einem leistungselektronischen bauelement
US11075141B2 (en) * 2018-09-14 2021-07-27 Raytheon Company Module base with integrated thermal spreader and heat sink for thermal and structural management of high-performance integrated circuits or other devices
US11387598B2 (en) * 2019-02-19 2022-07-12 Aptiv Technologies Limited Electrical connector assembly with modular cooling features
US20200328027A1 (en) * 2019-04-12 2020-10-15 Karma Automotive Llc Integrated dc busbar and dc-link capacitor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB306100A (pt) * 1928-02-15 1929-11-21 Elektrizitats - Aktiengesellschaft Hydrawerk
US1725123A (en) 1928-05-15 1929-08-20 Wireless Specialty Apparatus Electrical condenser
GB331803A (en) * 1928-12-28 1930-07-10 Elek Zitaets Ag Hydrawerk Improvements in or relating to electric condensers
US2948838A (en) 1956-06-13 1960-08-09 Sprague Electric Co Tubular capactitor
US4603373A (en) * 1983-07-13 1986-07-29 Electronic Concepts, Inc. Outer wrapping for a metallized wound capacitor
US5053916A (en) 1989-03-13 1991-10-01 U.S. Philips Corporation Surface-mounted multilayer capacitor and printed circuit board having such a multilayer capacitor
US5375035A (en) 1993-03-22 1994-12-20 Compaq Computer Corporation Capacitor mounting structure for printed circuit boards
JPH09283376A (ja) 1996-04-09 1997-10-31 Rohm Co Ltd 固体電解コンデンサのプリント基板への実装方法
US5973932A (en) 1997-02-14 1999-10-26 Pulse Engineering, Inc. Soldered component bonding in a printed circuit assembly
US6888235B2 (en) 2001-09-26 2005-05-03 Molex Incorporated Power delivery system for integrated circuits utilizing discrete capacitors
JP2003133183A (ja) * 2001-10-26 2003-05-09 Matsushita Electric Ind Co Ltd 固体電解コンデンサおよびその製造方法
WO2004100264A1 (ja) * 2003-05-09 2004-11-18 Matsushita Electric Industrial Co. Ltd. 回路素子内蔵モジュール
JP2005079463A (ja) * 2003-09-02 2005-03-24 Nec Tokin Corp 積層型固体電解コンデンサおよび積層型伝送線路素子
WO2006116967A2 (de) 2005-05-02 2006-11-09 Epcos Ag Leistungskondensator
US8159811B2 (en) * 2007-10-19 2012-04-17 Oh Young Joo Metal capacitor and manufacturing method thereof
US7907411B2 (en) * 2008-12-03 2011-03-15 Goodrich Corporation Heat sink assembly having interdigitated cooling fins
TWI395244B (zh) * 2009-07-10 2013-05-01 片狀堆疊式固態電解電容器
JP5267586B2 (ja) * 2011-01-28 2013-08-21 株式会社村田製作所 固体電解コンデンサおよびその製造方法
US20120281338A1 (en) * 2011-05-05 2012-11-08 Inpaq Technology Co., Ltd. Aluminum electrolytic capacitor and method of manfacturing the same
JP5435007B2 (ja) * 2011-10-21 2014-03-05 株式会社村田製作所 固体電解コンデンサおよびその製造方法
WO2013073332A1 (ja) * 2011-11-18 2013-05-23 三洋電機株式会社 固体電解コンデンサ及びその製造方法
WO2013088954A1 (ja) * 2011-12-14 2013-06-20 株式会社村田製作所 固体電解コンデンサ及びその製造方法
JP2013131627A (ja) * 2011-12-21 2013-07-04 Nec Tokin Corp 固体電解コンデンサ及びその製造方法
KR101452068B1 (ko) * 2012-12-18 2014-10-16 삼성전기주식회사 적층 세라믹 커패시터 및 적층 세라믹 커패시터가 실장된 회로 기판
KR102064008B1 (ko) 2013-01-15 2020-02-17 삼성전기주식회사 적층 커패시터, 적층 커패시터가 실장된 기판

Also Published As

Publication number Publication date
EP3230994B1 (en) 2023-06-07
BR112017008885B1 (pt) 2022-12-13
CN107112132B (zh) 2019-10-18
US9439278B2 (en) 2016-09-06
US20160174356A1 (en) 2016-06-16
EP3230994A4 (en) 2018-08-01
EP3230994A1 (en) 2017-10-18
CN107112132A (zh) 2017-08-29
WO2016094059A1 (en) 2016-06-16

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Legal Events

Date Code Title Description
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 20/11/2015, OBSERVADAS AS CONDICOES LEGAIS