BR112017008885A2 - capacitor, e, conjunto eletrônico. - Google Patents
capacitor, e, conjunto eletrônico.Info
- Publication number
- BR112017008885A2 BR112017008885A2 BR112017008885A BR112017008885A BR112017008885A2 BR 112017008885 A2 BR112017008885 A2 BR 112017008885A2 BR 112017008885 A BR112017008885 A BR 112017008885A BR 112017008885 A BR112017008885 A BR 112017008885A BR 112017008885 A2 BR112017008885 A2 BR 112017008885A2
- Authority
- BR
- Brazil
- Prior art keywords
- winding element
- conductive end
- capacitor
- conductive
- layer
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title abstract 2
- 238000004804 winding Methods 0.000 abstract 9
- 239000004020 conductor Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/236—Terminals leading through the housing, i.e. lead-through
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/106—Fixing the capacitor in a housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
um capacitor (100) compreende um primeiro elemento de enrolamento (58), onde o primeiro elemento de enrolamento (58) compreende uma primeira camada dielétrica (56) e uma primeira camada condutora (50). um segundo elemento de enrolamento (60) compreende uma segunda camada dielétrica (57) e segunda camada condutora (52). o primeiro elemento de enrolamento (58) é intercalado, parcial ou totalmente, com a segunda camada de enrolamento (60). um invólucro dielétrico (24) ou invólucro está adaptado para pelo menos radialmente conter ou circundar o primeiro elemento de enrolamento (58) e o segundo elemento de enrolamento (60). o primeiro elemento de enrolamento (58) é eletricamente conectado a uma primeira extremidade condutora (20). um segundo elemento de enrolamento (60) é eletricamente conectado a uma segunda extremidade condutora (21). a segunda extremidade condutora (21) está oposta à primeira extremidade condutora (20). a primeira extremidade condutora (20) forma um primeiro condutor; a segunda extremidade condutora (21) forma um segundo condutor.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/568,682 US9439278B2 (en) | 2014-12-12 | 2014-12-12 | Film capacitor having a package for heat transfer |
US14/568,682 | 2014-12-12 | ||
PCT/US2015/061846 WO2016094059A1 (en) | 2014-12-12 | 2015-11-20 | Film capacitor having a package for heat transfer |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112017008885A2 true BR112017008885A2 (pt) | 2017-12-19 |
BR112017008885B1 BR112017008885B1 (pt) | 2022-12-13 |
Family
ID=56107941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112017008885-1A BR112017008885B1 (pt) | 2014-12-12 | 2015-11-20 | Capacitor, e, conjunto eletrônico |
Country Status (5)
Country | Link |
---|---|
US (1) | US9439278B2 (pt) |
EP (1) | EP3230994B1 (pt) |
CN (1) | CN107112132B (pt) |
BR (1) | BR112017008885B1 (pt) |
WO (1) | WO2016094059A1 (pt) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6435905B2 (ja) * | 2015-02-13 | 2018-12-12 | 株式会社デンソー | 電力変換装置 |
US9860987B2 (en) * | 2015-02-13 | 2018-01-02 | Deere & Company | Electronic assembly with one or more heat sinks |
US9480187B2 (en) * | 2015-03-29 | 2016-10-25 | Banqiu Wu | Cooling method for a 3D IC computer system |
US10461021B2 (en) | 2017-02-28 | 2019-10-29 | Deere & Company | Electronic assembly with enhanced thermal dissipation |
DE102018201842A1 (de) | 2018-02-06 | 2019-08-08 | Siemens Aktiengesellschaft | Leistungselektronische Schaltung mit mehreren Leistungsmodulen |
EP3522188A1 (de) * | 2018-02-06 | 2019-08-07 | Siemens Aktiengesellschaft | Kondensatoraufbau und leistungsmodul mit einem leistungselektronischen bauelement |
US11075141B2 (en) * | 2018-09-14 | 2021-07-27 | Raytheon Company | Module base with integrated thermal spreader and heat sink for thermal and structural management of high-performance integrated circuits or other devices |
US11387598B2 (en) * | 2019-02-19 | 2022-07-12 | Aptiv Technologies Limited | Electrical connector assembly with modular cooling features |
US20200328027A1 (en) * | 2019-04-12 | 2020-10-15 | Karma Automotive Llc | Integrated dc busbar and dc-link capacitor |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB306100A (pt) * | 1928-02-15 | 1929-11-21 | Elektrizitats - Aktiengesellschaft Hydrawerk | |
US1725123A (en) | 1928-05-15 | 1929-08-20 | Wireless Specialty Apparatus | Electrical condenser |
GB331803A (en) * | 1928-12-28 | 1930-07-10 | Elek Zitaets Ag Hydrawerk | Improvements in or relating to electric condensers |
US2948838A (en) | 1956-06-13 | 1960-08-09 | Sprague Electric Co | Tubular capactitor |
US4603373A (en) * | 1983-07-13 | 1986-07-29 | Electronic Concepts, Inc. | Outer wrapping for a metallized wound capacitor |
US5053916A (en) | 1989-03-13 | 1991-10-01 | U.S. Philips Corporation | Surface-mounted multilayer capacitor and printed circuit board having such a multilayer capacitor |
US5375035A (en) | 1993-03-22 | 1994-12-20 | Compaq Computer Corporation | Capacitor mounting structure for printed circuit boards |
JPH09283376A (ja) | 1996-04-09 | 1997-10-31 | Rohm Co Ltd | 固体電解コンデンサのプリント基板への実装方法 |
US5973932A (en) | 1997-02-14 | 1999-10-26 | Pulse Engineering, Inc. | Soldered component bonding in a printed circuit assembly |
US6888235B2 (en) | 2001-09-26 | 2005-05-03 | Molex Incorporated | Power delivery system for integrated circuits utilizing discrete capacitors |
JP2003133183A (ja) * | 2001-10-26 | 2003-05-09 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサおよびその製造方法 |
WO2004100264A1 (ja) * | 2003-05-09 | 2004-11-18 | Matsushita Electric Industrial Co. Ltd. | 回路素子内蔵モジュール |
JP2005079463A (ja) * | 2003-09-02 | 2005-03-24 | Nec Tokin Corp | 積層型固体電解コンデンサおよび積層型伝送線路素子 |
WO2006116967A2 (de) | 2005-05-02 | 2006-11-09 | Epcos Ag | Leistungskondensator |
US8159811B2 (en) * | 2007-10-19 | 2012-04-17 | Oh Young Joo | Metal capacitor and manufacturing method thereof |
US7907411B2 (en) * | 2008-12-03 | 2011-03-15 | Goodrich Corporation | Heat sink assembly having interdigitated cooling fins |
TWI395244B (zh) * | 2009-07-10 | 2013-05-01 | 片狀堆疊式固態電解電容器 | |
JP5267586B2 (ja) * | 2011-01-28 | 2013-08-21 | 株式会社村田製作所 | 固体電解コンデンサおよびその製造方法 |
US20120281338A1 (en) * | 2011-05-05 | 2012-11-08 | Inpaq Technology Co., Ltd. | Aluminum electrolytic capacitor and method of manfacturing the same |
JP5435007B2 (ja) * | 2011-10-21 | 2014-03-05 | 株式会社村田製作所 | 固体電解コンデンサおよびその製造方法 |
WO2013073332A1 (ja) * | 2011-11-18 | 2013-05-23 | 三洋電機株式会社 | 固体電解コンデンサ及びその製造方法 |
WO2013088954A1 (ja) * | 2011-12-14 | 2013-06-20 | 株式会社村田製作所 | 固体電解コンデンサ及びその製造方法 |
JP2013131627A (ja) * | 2011-12-21 | 2013-07-04 | Nec Tokin Corp | 固体電解コンデンサ及びその製造方法 |
KR101452068B1 (ko) * | 2012-12-18 | 2014-10-16 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 적층 세라믹 커패시터가 실장된 회로 기판 |
KR102064008B1 (ko) | 2013-01-15 | 2020-02-17 | 삼성전기주식회사 | 적층 커패시터, 적층 커패시터가 실장된 기판 |
-
2014
- 2014-12-12 US US14/568,682 patent/US9439278B2/en active Active
-
2015
- 2015-11-20 EP EP15868421.7A patent/EP3230994B1/en active Active
- 2015-11-20 WO PCT/US2015/061846 patent/WO2016094059A1/en active Application Filing
- 2015-11-20 CN CN201580061683.4A patent/CN107112132B/zh active Active
- 2015-11-20 BR BR112017008885-1A patent/BR112017008885B1/pt active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP3230994B1 (en) | 2023-06-07 |
BR112017008885B1 (pt) | 2022-12-13 |
CN107112132B (zh) | 2019-10-18 |
US9439278B2 (en) | 2016-09-06 |
US20160174356A1 (en) | 2016-06-16 |
EP3230994A4 (en) | 2018-08-01 |
EP3230994A1 (en) | 2017-10-18 |
CN107112132A (zh) | 2017-08-29 |
WO2016094059A1 (en) | 2016-06-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 20/11/2015, OBSERVADAS AS CONDICOES LEGAIS |