BR112015018354A2 - resfriamento de líquido - Google Patents

resfriamento de líquido

Info

Publication number
BR112015018354A2
BR112015018354A2 BR112015018354A BR112015018354A BR112015018354A2 BR 112015018354 A2 BR112015018354 A2 BR 112015018354A2 BR 112015018354 A BR112015018354 A BR 112015018354A BR 112015018354 A BR112015018354 A BR 112015018354A BR 112015018354 A2 BR112015018354 A2 BR 112015018354A2
Authority
BR
Brazil
Prior art keywords
cooling
channel
fluid
liquid cooling
support member
Prior art date
Application number
BR112015018354A
Other languages
English (en)
Inventor
A Moore David
P Franz John
L Sabotta Michael
Cader Tahir
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Publication of BR112015018354A2 publication Critical patent/BR112015018354A2/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geometry (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Gasket Seals (AREA)

Abstract

resumo “resfriamento de líquido” trata-se, no presente documento, de uma montagem para resfriamento de líquido. a montagem inclui um membro térmico, um membro de suporte e uma gaxeta. o membro térmico inclui um arranjo de pinos de resfriamento formado por um material termicamente condutor para estender-se a partir do membro térmico. o membro de suporte inclui um canal de entrada e um canal de saída. o canal de entrada fornece um fluido ao arranjo de pinos de resfriamento. o canal de saída recebe o fluido a partir do arranjo de pinos de resfriamento. a gaxeta entre o membro térmico e o membro de suporte forma um canal de resfriamento com uma vedação hermética ao fluido entre os mesmos.
BR112015018354A 2013-01-31 2013-01-31 resfriamento de líquido BR112015018354A2 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2013/024037 WO2014120182A1 (en) 2013-01-31 2013-01-31 Liquid cooling

Publications (1)

Publication Number Publication Date
BR112015018354A2 true BR112015018354A2 (pt) 2017-07-18

Family

ID=51262747

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015018354A BR112015018354A2 (pt) 2013-01-31 2013-01-31 resfriamento de líquido

Country Status (7)

Country Link
US (3) US9803937B2 (pt)
EP (1) EP2952076B1 (pt)
JP (1) JP6082479B2 (pt)
CN (2) CN107743351B (pt)
BR (1) BR112015018354A2 (pt)
TW (1) TWI608212B (pt)
WO (1) WO2014120182A1 (pt)

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BR112015018354A2 (pt) * 2013-01-31 2017-07-18 Hewlett Packard Development Co resfriamento de líquido
US10237999B2 (en) * 2015-10-30 2019-03-19 Hewlett Packard Enterprise Development Lp Configurable node expansion space
IT201700095093A1 (it) * 2017-08-22 2019-02-22 Hutchinson Srl Sistema di raffreddamento modulare per un componente elettrico, in particolare per una batteria elettrica di un veicolo elettrico o ibrido
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DE102019214724A1 (de) * 2019-09-26 2021-04-01 Robert Bosch Gmbh Elektronikmodul und Kühlanordnung
CN110943985B (zh) * 2019-11-26 2022-03-22 武汉虹旭信息技术有限责任公司 基于5g移动通信网络的安全审计***及方法
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US10330395B2 (en) 2019-06-25
US10458724B2 (en) 2019-10-29
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US20180094875A1 (en) 2018-04-05
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JP6082479B2 (ja) 2017-02-15
US9803937B2 (en) 2017-10-31
EP2952076A4 (en) 2016-09-21
WO2014120182A1 (en) 2014-08-07
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CN107743351B (zh) 2020-11-06
TWI608212B (zh) 2017-12-11
US20180017341A1 (en) 2018-01-18

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