BR112013033271A2 - dispositivo de iluminação baseado em led - Google Patents

dispositivo de iluminação baseado em led

Info

Publication number
BR112013033271A2
BR112013033271A2 BR112013033271A BR112013033271A BR112013033271A2 BR 112013033271 A2 BR112013033271 A2 BR 112013033271A2 BR 112013033271 A BR112013033271 A BR 112013033271A BR 112013033271 A BR112013033271 A BR 112013033271A BR 112013033271 A2 BR112013033271 A2 BR 112013033271A2
Authority
BR
Brazil
Prior art keywords
lighting device
led based
based lighting
led
lighting
Prior art date
Application number
BR112013033271A
Other languages
English (en)
Inventor
Harbers Gerard
J A Bierhuizen Serge
Original Assignee
Xicato Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xicato Inc filed Critical Xicato Inc
Publication of BR112013033271A2 publication Critical patent/BR112013033271A2/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
BR112013033271A 2011-06-24 2012-06-20 dispositivo de iluminação baseado em led BR112013033271A2 (pt)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161500924P 2011-06-24 2011-06-24
US201161566993P 2011-12-05 2011-12-05
US13/527,446 US20120327649A1 (en) 2011-06-24 2012-06-19 Led based illumination module with a lens element
US13/527,443 US20120257386A1 (en) 2011-06-24 2012-06-19 Led based illumination module with a reflective mask
PCT/US2012/043339 WO2012177753A2 (en) 2011-06-24 2012-06-20 Led based illumination module with a reflective mask

Publications (1)

Publication Number Publication Date
BR112013033271A2 true BR112013033271A2 (pt) 2017-03-01

Family

ID=46965995

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013033271A BR112013033271A2 (pt) 2011-06-24 2012-06-20 dispositivo de iluminação baseado em led

Country Status (10)

Country Link
US (2) US20120257386A1 (pt)
EP (1) EP2724076A2 (pt)
JP (1) JP2014520384A (pt)
KR (1) KR20140082631A (pt)
CN (1) CN103765090A (pt)
BR (1) BR112013033271A2 (pt)
CA (1) CA2839991A1 (pt)
MX (1) MX2014000094A (pt)
TW (1) TW201307745A (pt)
WO (1) WO2012177753A2 (pt)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) * 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8735920B2 (en) * 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8866169B2 (en) * 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US8791471B2 (en) * 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US20110037083A1 (en) * 2009-01-14 2011-02-17 Alex Chi Keung Chan Led package with contrasting face
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
EP2748526B1 (en) * 2011-10-26 2015-02-18 Koninklijke Philips N.V. Light-emitting arrangement
DE102012105677B4 (de) * 2012-06-28 2016-06-09 Osram Opto Semiconductors Gmbh Leuchtdiodenmodul und Kfz-Scheinwerfer
US9147816B2 (en) 2012-08-24 2015-09-29 Luminus Devices, Inc. Wavelength converting material deposition methods and associated articles
US20140104858A1 (en) * 2012-10-17 2014-04-17 Lighting Science Group Corporation Lighting device with integrally molded base and associated methods
US20140159084A1 (en) * 2012-12-12 2014-06-12 Cree, Inc. Led dome with improved color spatial uniformity
JP2015035532A (ja) * 2013-08-09 2015-02-19 シチズン電子株式会社 Ｌｅｄ集合プレート及びこれを用いた発光装置
JP2015185760A (ja) * 2014-03-25 2015-10-22 東芝ライテック株式会社 発光モジュール
JP2017527948A (ja) * 2014-06-26 2017-09-21 フィリップス ライティング ホールディング ビー ヴィ 小型ｌｅｄ照明ユニット
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
DE102014214600A1 (de) * 2014-07-24 2016-01-28 Osram Gmbh Bestrahlungsvorrichtung mit einer Pumpstrahlungsquelle
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
JP6092446B1 (ja) 2015-10-23 2017-03-08 デクセリアルズ株式会社 部分駆動型光源装置及びそれを用いた画像表示装置
KR102527387B1 (ko) * 2016-02-24 2023-04-28 삼성전자주식회사 발광 소자 패키지 및 그 제조 방법
US10422501B2 (en) * 2016-12-14 2019-09-24 Ford Global Technologies, Llc Vehicle lighting assembly
WO2018199901A1 (en) * 2017-04-24 2018-11-01 Hewlett-Packard Development Company, L.P. Micro light-emitting diode display with 3d orifice plating and light filtering
US11073725B2 (en) 2018-03-26 2021-07-27 Nichia Corporation Method of manufacturing light emitting module, and light emitting module
JP6879325B2 (ja) * 2018-03-26 2021-06-02 日亜化学工業株式会社 発光モジュールの製造方法及び発光モジュール
CN112635511A (zh) * 2019-10-09 2021-04-09 群创光电股份有限公司 电子装置及电子装置的制造方法
US11846413B2 (en) * 2020-01-13 2023-12-19 Harman Professional Denmark Aps Illumination device light collector and converging optical system
CN115989592A (zh) * 2020-08-28 2023-04-18 电化株式会社 荧光体基板的制造方法以及发光基板的制造方法
WO2022082755A1 (zh) * 2020-10-23 2022-04-28 瑞仪(广州)光电子器件有限公司 光源结构、背光模组及显示装置
JP7381911B2 (ja) * 2021-09-28 2023-11-16 日亜化学工業株式会社 光源及び発光モジュール
WO2023101852A1 (en) * 2021-12-02 2023-06-08 Lumileds Llc Projecting a static light pattern

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5353983U (pt) * 1976-10-12 1978-05-09
US6106137A (en) * 1998-02-20 2000-08-22 Lorin Industries, Inc. Reflector for automotive exterior lighting
US6513949B1 (en) * 1999-12-02 2003-02-04 Koninklijke Philips Electronics N.V. LED/phosphor-LED hybrid lighting systems
US7597459B2 (en) * 2005-03-07 2009-10-06 Sanyo Electric Co., Ltd. Converging element and illuminating device
JP2001287395A (ja) * 2000-04-05 2001-10-16 Fuji Photo Optical Co Ltd カラープリンタ用発光アレイユニット
US6555904B1 (en) * 2001-03-05 2003-04-29 Analog Devices, Inc. Electrically shielded glass lid for a packaged device
JP3905343B2 (ja) * 2001-10-09 2007-04-18 シチズン電子株式会社 発光ダイオード
JP4182783B2 (ja) * 2003-03-14 2008-11-19 豊田合成株式会社 Ｌｅｄパッケージ
US20050276042A1 (en) * 2004-06-10 2005-12-15 Ko-Liang Ho Lighting device
US7144131B2 (en) * 2004-09-29 2006-12-05 Advanced Optical Technologies, Llc Optical system using LED coupled with phosphor-doped reflective materials
US7821023B2 (en) * 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US20060171152A1 (en) * 2005-01-20 2006-08-03 Toyoda Gosei Co., Ltd. Light emitting device and method of making the same
US20060187653A1 (en) * 2005-02-10 2006-08-24 Olsson Mark S LED illumination devices
DE602005009187D1 (de) * 2005-09-14 2008-10-02 Fiat Ricerche Modul für die Projektion eines Lichtstrahls
JP2007081234A (ja) * 2005-09-15 2007-03-29 Toyoda Gosei Co Ltd 照明装置
US7261454B2 (en) * 2005-09-23 2007-08-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. System and method for forming a back-lighted array using an omni-directional light source
JP2007200730A (ja) * 2006-01-27 2007-08-09 Casio Comput Co Ltd 光源ユニット、光源装置及びプロジェクタ
WO2007146295A2 (en) * 2006-06-13 2007-12-21 Powerweb Technologies, Inc. Led light pod with modular optics and heat dissipation structure
US7663152B2 (en) * 2006-08-09 2010-02-16 Philips Lumileds Lighting Company, Llc Illumination device including wavelength converting element side holding heat sink
US7842960B2 (en) * 2006-09-06 2010-11-30 Lumination Llc Light emitting packages and methods of making same
US7736019B2 (en) * 2006-10-10 2010-06-15 Yanchers Corporation Lighting system
KR20080040878A (ko) * 2006-11-06 2008-05-09 삼성전자주식회사 광학렌즈 플레이트, 백라이트 유닛 및 이를 구비하는표시장치
KR100770424B1 (ko) * 2006-12-13 2007-10-26 삼성전기주식회사 발광 다이오드 패키지 및 그 제조 방법
US8172434B1 (en) * 2007-02-23 2012-05-08 DeepSea Power and Light, Inc. Submersible multi-color LED illumination system
US7566147B2 (en) * 2007-05-04 2009-07-28 Ruud Lighting, Inc. Multi-LED light fixture with secure arrangement for LED-array wiring
US8172415B2 (en) * 2007-05-24 2012-05-08 Koninklijke Philips Electronics N.V. Color-tunable illumination system
JP4533405B2 (ja) * 2007-05-31 2010-09-01 株式会社 日立ディスプレイズ 照明装置およびこの照明装置を用いた液晶表示装置
EP2156223B1 (en) * 2007-06-04 2011-12-21 Koninklijke Philips Electronics N.V. Color-tunable illumination system, lamp and luminaire
US7942556B2 (en) * 2007-06-18 2011-05-17 Xicato, Inc. Solid state illumination device
US9086213B2 (en) * 2007-10-17 2015-07-21 Xicato, Inc. Illumination device with light emitting diodes
RU2508616C2 (ru) * 2008-02-27 2014-02-27 Конинклейке Филипс Электроникс Н.В. Осветительное устройство с сид и одним или более пропускающими окнами
KR100924912B1 (ko) * 2008-07-29 2009-11-03 서울반도체 주식회사 웜화이트 발광장치 및 그것을 포함하는 백라이트 모듈
GB0815860D0 (en) * 2008-09-01 2008-10-08 Oxley Dev Co Ltd Light emitting device
US8791471B2 (en) * 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
KR101039957B1 (ko) * 2008-11-18 2011-06-09 엘지이노텍 주식회사 발광 장치 및 이를 구비한 디스플레이 장치
US8169135B2 (en) * 2008-12-17 2012-05-01 Lednovation, Inc. Semiconductor lighting device with wavelength conversion on back-transferred light path
US8408724B2 (en) * 2008-12-26 2013-04-02 Toshiba Lighting & Technology Corporation Light source module and lighting apparatus
US7923741B1 (en) * 2009-01-05 2011-04-12 Lednovation, Inc. Semiconductor lighting device with reflective remote wavelength conversion
WO2010106504A1 (en) * 2009-03-19 2010-09-23 Koninklijke Philips Electronics N.V. Illumination device with remote luminescent material
WO2010138697A1 (en) * 2009-05-27 2010-12-02 Gary Wayne Jones High efficiency and long life optical spectrum conversion device and process
TWI354365B (en) * 2009-08-26 2011-12-11 Quasioptical led package structure for increasing
WO2011074777A2 (ko) * 2009-12-18 2011-06-23 한국기계연구원 회로기판 일체형 ｌｅｄ 패키지를 갖는 ｌｅｄ 조명 장치 및 그 제조 방법
JP5010010B2 (ja) * 2010-04-16 2012-08-29 フェニックス電機株式会社 発光装置
US8558161B2 (en) * 2010-08-10 2013-10-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Lens having multiple conic sections for LEDs and proximity sensors
US20110006331A1 (en) * 2010-09-20 2011-01-13 Alexander Shaikevitch Light-emitting device with a semi-remote phosphor coating
DE202010008705U1 (de) * 2010-10-04 2010-12-30 Harvatek Corp. Arrayartiges Multi-Chip-Gehäuse für LEDs
CN103299422B (zh) * 2010-12-29 2016-11-02 3M创新有限公司 具有宽带输出和可控颜色的远程荧光粉led装置

Also Published As

Publication number Publication date
TW201307745A (zh) 2013-02-16
CA2839991A1 (en) 2012-12-27
WO2012177753A4 (en) 2013-07-18
WO2012177753A3 (en) 2013-05-02
EP2724076A2 (en) 2014-04-30
WO2012177753A2 (en) 2012-12-27
KR20140082631A (ko) 2014-07-02
US20120327649A1 (en) 2012-12-27
CN103765090A (zh) 2014-04-30
JP2014520384A (ja) 2014-08-21
MX2014000094A (es) 2014-07-09
US20120257386A1 (en) 2012-10-11

Similar Documents

Publication Publication Date Title
BR112014002450A2 (pt) dispositivo de iluminação baseado em led
BR112013033271A2 (pt) dispositivo de iluminação baseado em led
BR112014002449A2 (pt) dispositivo de iluminação baseado em led
BR112014006746A2 (pt) dispositivo de iluminação de led
EP2734014A4 (en) LED LIGHTING DEVICE
BR112012022323A2 (pt) dispositivo de iluminação
EP2765834A4 (en) LED LIGHTING DEVICE
BR112012033589A2 (pt) dispositivo de iluminação
BR112013025149A2 (pt) aparelho e dispositivo de iluminação baseado em diodo emissor de luz
DE102011081077A8 (de) Kraftfahrzeugbeleuchtungseinrichtung
BR302012004582S1 (pt) Configuracao aplicada em lampada de led
EP2723148A4 (en) LIGHT EMITTING DEVICE LIGHTING DEVICE
BR112012019621A2 (pt) dispositivo de iluminação
ES1076869Y (es) Estructura de bombilla LED
BR302013001736S1 (pt) Configuração aplicada em dispositivo de iluminação
ES1132205Y (es) Un dispositivo de iluminacion led
EP2743575A4 (en) LED LIGHTING DEVICE
DE102011008613A8 (de) Beleuchtungsvorrichtung
BR112013027429A2 (pt) dispositivo de iluminação e unidade de iluminação
DE112013005283T8 (de) Beleuchtungsvorrichtung
DK3199869T3 (da) Belysningsindretning
BR302012004583S1 (pt) Configuracao aplicada em lampada de led
DE112011100963A5 (de) LED-Beleuchtungssystem
EP2858460A4 (en) LED LIGHTING DEVICE
EP2781831A4 (en) LED LIGHTING DEVICE

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]