BE1022358A1 - Sputterinrichting met bewegend doelwit - Google Patents

Sputterinrichting met bewegend doelwit Download PDF

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Publication number
BE1022358A1
BE1022358A1 BE201505433A BE201505433A BE1022358A1 BE 1022358 A1 BE1022358 A1 BE 1022358A1 BE 201505433 A BE201505433 A BE 201505433A BE 201505433 A BE201505433 A BE 201505433A BE 1022358 A1 BE1022358 A1 BE 1022358A1
Authority
BE
Belgium
Prior art keywords
moving target
sputtering device
sputtering
target
moving
Prior art date
Application number
BE201505433A
Other languages
English (en)
Other versions
BE1022358B1 (nl
Inventor
Bosscher Wilmert De
De Putte Ivan Van
Original Assignee
Soleras Advanced Coatings Bvba
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP14176303.7A external-priority patent/EP2966192A1/en
Application filed by Soleras Advanced Coatings Bvba filed Critical Soleras Advanced Coatings Bvba
Publication of BE1022358A1 publication Critical patent/BE1022358A1/nl
Application granted granted Critical
Publication of BE1022358B1 publication Critical patent/BE1022358B1/nl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/347—Thickness uniformity of coated layers or desired profile of target erosion

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
BE2015/5433A 2014-07-09 2015-07-08 Sputterinrichting met bewegend doelwit BE1022358B1 (nl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14176303.7 2014-07-09
EP14176303.7A EP2966192A1 (en) 2014-07-09 2014-07-09 Sputter device with moving target
EP15166011 2015-04-30

Publications (2)

Publication Number Publication Date
BE1022358A1 true BE1022358A1 (nl) 2016-03-16
BE1022358B1 BE1022358B1 (nl) 2016-03-24

Family

ID=53540749

Family Applications (1)

Application Number Title Priority Date Filing Date
BE2015/5433A BE1022358B1 (nl) 2014-07-09 2015-07-08 Sputterinrichting met bewegend doelwit

Country Status (6)

Country Link
US (1) US10424468B2 (nl)
JP (1) JP6805124B2 (nl)
KR (1) KR102124786B1 (nl)
CN (1) CN106488996B (nl)
BE (1) BE1022358B1 (nl)
WO (1) WO2016005476A1 (nl)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1024754B9 (nl) 2016-11-29 2018-07-24 Soleras Advanced Coatings Bvba Een universeel monteerbaar eindblok
DE102016125273A1 (de) * 2016-12-14 2018-06-14 Schneider Gmbh & Co. Kg Anlage, Verfahren und Träger zur Beschichtung von Brillengläsern
JP2019052371A (ja) * 2017-09-14 2019-04-04 エフ・ハー・エル・アンラーゲンバウ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング ３ｄサブストレートを均一にコーティングするための方法及び装置
JP6999380B2 (ja) * 2017-11-27 2022-01-18 株式会社アルバック スパッタ装置
JP6580113B2 (ja) * 2017-12-05 2019-09-25 キヤノントッキ株式会社 スパッタ装置及びその制御方法
JP6657535B2 (ja) * 2017-12-26 2020-03-04 キヤノントッキ株式会社 スパッタ成膜装置およびスパッタ成膜方法
JP6673590B2 (ja) * 2017-12-27 2020-03-25 キヤノントッキ株式会社 スパッタ成膜装置
EP3587619B1 (en) * 2018-06-25 2022-06-22 Deutsches Elektronen-Synchrotron DESY An apparatus for depositing material on the surface of a substrate
JP7202815B2 (ja) * 2018-08-31 2023-01-12 キヤノントッキ株式会社 成膜装置、成膜方法、および電子デバイスの製造方法
JP7202814B2 (ja) * 2018-08-31 2023-01-12 キヤノントッキ株式会社 成膜装置、成膜方法、および電子デバイスの製造方法
JP7136648B2 (ja) * 2018-09-28 2022-09-13 キヤノントッキ株式会社 成膜装置、成膜方法、および電子デバイスの製造方法
KR102399748B1 (ko) * 2018-10-01 2022-05-19 주식회사 테토스 입체형 대상물 표면의 금속막 증착 장치
JP7220562B2 (ja) * 2018-12-27 2023-02-10 キヤノントッキ株式会社 成膜装置、成膜方法、および電子デバイスの製造方法
JP7229014B2 (ja) * 2018-12-27 2023-02-27 キヤノントッキ株式会社 成膜装置、成膜方法、および電子デバイスの製造方法
JP7229016B2 (ja) * 2018-12-27 2023-02-27 キヤノントッキ株式会社 成膜装置、成膜方法、および電子デバイスの製造方法
JP7242293B2 (ja) * 2018-12-27 2023-03-20 キヤノントッキ株式会社 成膜装置、成膜方法、および電子デバイスの製造方法
CN111719122A (zh) * 2019-03-21 2020-09-29 广东太微加速器有限公司 靶
JP2020200520A (ja) * 2019-06-12 2020-12-17 株式会社アルバック 成膜装置、スパッタリングターゲット機構及び成膜方法
CN115427605A (zh) 2019-06-24 2022-12-02 通快许廷格有限公司 调整向等离子体供电的电源的输出功率的方法、等离子体设备以及电源
BE1027427B1 (nl) * 2019-07-14 2021-02-08 Soleras Advanced Coatings Bv Bewegingssystemen voor sputter coaten van niet-vlakke substraten
GB2588937B (en) * 2019-11-15 2023-01-04 Dyson Technology Ltd Sputter deposition
CN114075650A (zh) * 2020-08-18 2022-02-22 群创光电股份有限公司 曲面基板的镀膜装置及其镀膜方法
JP7170016B2 (ja) * 2020-10-06 2022-11-11 キヤノントッキ株式会社 成膜装置
CN117568771B (zh) * 2023-12-08 2024-07-02 成都国泰真空设备有限公司 一种磁控溅射镀膜传动装置
CN117512545A (zh) * 2024-01-08 2024-02-06 中国科学院长春光学精密机械与物理研究所 大口径光学膜层沉积方法及镀膜设备

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US6488824B1 (en) 1998-11-06 2002-12-03 Raycom Technologies, Inc. Sputtering apparatus and process for high rate coatings
WO2000028104A1 (en) 1998-11-06 2000-05-18 Scivac Sputtering apparatus and process for high rate coatings
JP2003183823A (ja) 2001-12-17 2003-07-03 Sharp Corp スパッタ装置
WO2006007504A1 (en) * 2004-07-01 2006-01-19 Cardinal Cg Company Cylindrical target with oscillating magnet from magnetron sputtering
TWI312012B (en) 2005-07-13 2009-07-11 Applied Materials Inc Improved magnetron sputtering system for large-area substrates having removable anodes
US7563725B2 (en) 2007-04-05 2009-07-21 Solyndra, Inc. Method of depositing materials on a non-planar surface
EP2159821B1 (de) * 2008-09-02 2020-01-15 Oerlikon Surface Solutions AG, Pfäffikon Beschichtungsvorrichtung zum Beschichten eines Substrats, sowie ein Verfahren zum Beschichten eines Substrats
FR2940321B1 (fr) * 2008-12-19 2011-12-23 Carewave Shielding Technologies Machine de depot sous vide,sur un substrat,de materiaux en couches minces,par pulverisation cathodique.
EP2306489A1 (en) 2009-10-02 2011-04-06 Applied Materials, Inc. Method for coating a substrate and coater
EP2437280A1 (en) 2010-09-30 2012-04-04 Applied Materials, Inc. Systems and methods for forming a layer of sputtered material
EP2640865B1 (en) * 2010-11-17 2020-05-13 Soleras Advanced Coatings bvba Soft sputtering magnetron system
JP5687045B2 (ja) 2010-12-20 2015-03-18 キヤノンアネルバ株式会社 スパッタリング装置およびスパッタリング方法
JP2014074188A (ja) * 2010-12-27 2014-04-24 Canon Anelva Corp スパッタリング装置およびスパッタリング方法
JP2013001920A (ja) 2011-06-14 2013-01-07 Hitachi High-Technologies Corp スパッタリング装置、スパッタリング装置を用いた成膜装置、およびそれらの成膜方法

Also Published As

Publication number Publication date
JP2017521560A (ja) 2017-08-03
CN106488996A (zh) 2017-03-08
CN106488996B (zh) 2019-07-23
US10424468B2 (en) 2019-09-24
KR20170029561A (ko) 2017-03-15
US20170207071A1 (en) 2017-07-20
JP6805124B2 (ja) 2020-12-23
KR102124786B1 (ko) 2020-06-22
BE1022358B1 (nl) 2016-03-24
WO2016005476A1 (en) 2016-01-14

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Legal Events

Date Code Title Description
PD Change of ownership

Owner name: SOLERAS ADVANCED COATINGS BV; BE

Free format text: DETAILS ASSIGNMENT: CHANGE OF OWNER(S), CESSION

Effective date: 20200512