BE1022358A1 - Sputterinrichting met bewegend doelwit - Google Patents
Sputterinrichting met bewegend doelwit Download PDFInfo
- Publication number
- BE1022358A1 BE1022358A1 BE201505433A BE201505433A BE1022358A1 BE 1022358 A1 BE1022358 A1 BE 1022358A1 BE 201505433 A BE201505433 A BE 201505433A BE 201505433 A BE201505433 A BE 201505433A BE 1022358 A1 BE1022358 A1 BE 1022358A1
- Authority
- BE
- Belgium
- Prior art keywords
- moving target
- sputtering device
- sputtering
- target
- moving
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3417—Arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/342—Hollow targets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3464—Operating strategies
- H01J37/347—Thickness uniformity of coated layers or desired profile of target erosion
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14176303.7 | 2014-07-09 | ||
EP14176303.7A EP2966192A1 (en) | 2014-07-09 | 2014-07-09 | Sputter device with moving target |
EP15166011 | 2015-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
BE1022358A1 true BE1022358A1 (nl) | 2016-03-16 |
BE1022358B1 BE1022358B1 (nl) | 2016-03-24 |
Family
ID=53540749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE2015/5433A BE1022358B1 (nl) | 2014-07-09 | 2015-07-08 | Sputterinrichting met bewegend doelwit |
Country Status (6)
Country | Link |
---|---|
US (1) | US10424468B2 (nl) |
JP (1) | JP6805124B2 (nl) |
KR (1) | KR102124786B1 (nl) |
CN (1) | CN106488996B (nl) |
BE (1) | BE1022358B1 (nl) |
WO (1) | WO2016005476A1 (nl) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE1024754B9 (nl) | 2016-11-29 | 2018-07-24 | Soleras Advanced Coatings Bvba | Een universeel monteerbaar eindblok |
DE102016125273A1 (de) * | 2016-12-14 | 2018-06-14 | Schneider Gmbh & Co. Kg | Anlage, Verfahren und Träger zur Beschichtung von Brillengläsern |
JP2019052371A (ja) * | 2017-09-14 | 2019-04-04 | エフ・ハー・エル・アンラーゲンバウ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング | 3dサブストレートを均一にコーティングするための方法及び装置 |
JP6999380B2 (ja) * | 2017-11-27 | 2022-01-18 | 株式会社アルバック | スパッタ装置 |
JP6580113B2 (ja) * | 2017-12-05 | 2019-09-25 | キヤノントッキ株式会社 | スパッタ装置及びその制御方法 |
JP6657535B2 (ja) * | 2017-12-26 | 2020-03-04 | キヤノントッキ株式会社 | スパッタ成膜装置およびスパッタ成膜方法 |
JP6673590B2 (ja) * | 2017-12-27 | 2020-03-25 | キヤノントッキ株式会社 | スパッタ成膜装置 |
EP3587619B1 (en) * | 2018-06-25 | 2022-06-22 | Deutsches Elektronen-Synchrotron DESY | An apparatus for depositing material on the surface of a substrate |
JP7202815B2 (ja) * | 2018-08-31 | 2023-01-12 | キヤノントッキ株式会社 | 成膜装置、成膜方法、および電子デバイスの製造方法 |
JP7202814B2 (ja) * | 2018-08-31 | 2023-01-12 | キヤノントッキ株式会社 | 成膜装置、成膜方法、および電子デバイスの製造方法 |
JP7136648B2 (ja) * | 2018-09-28 | 2022-09-13 | キヤノントッキ株式会社 | 成膜装置、成膜方法、および電子デバイスの製造方法 |
KR102399748B1 (ko) * | 2018-10-01 | 2022-05-19 | 주식회사 테토스 | 입체형 대상물 표면의 금속막 증착 장치 |
JP7220562B2 (ja) * | 2018-12-27 | 2023-02-10 | キヤノントッキ株式会社 | 成膜装置、成膜方法、および電子デバイスの製造方法 |
JP7229014B2 (ja) * | 2018-12-27 | 2023-02-27 | キヤノントッキ株式会社 | 成膜装置、成膜方法、および電子デバイスの製造方法 |
JP7229016B2 (ja) * | 2018-12-27 | 2023-02-27 | キヤノントッキ株式会社 | 成膜装置、成膜方法、および電子デバイスの製造方法 |
JP7242293B2 (ja) * | 2018-12-27 | 2023-03-20 | キヤノントッキ株式会社 | 成膜装置、成膜方法、および電子デバイスの製造方法 |
CN111719122A (zh) * | 2019-03-21 | 2020-09-29 | 广东太微加速器有限公司 | 靶 |
JP2020200520A (ja) * | 2019-06-12 | 2020-12-17 | 株式会社アルバック | 成膜装置、スパッタリングターゲット機構及び成膜方法 |
CN115427605A (zh) | 2019-06-24 | 2022-12-02 | 通快许廷格有限公司 | 调整向等离子体供电的电源的输出功率的方法、等离子体设备以及电源 |
BE1027427B1 (nl) * | 2019-07-14 | 2021-02-08 | Soleras Advanced Coatings Bv | Bewegingssystemen voor sputter coaten van niet-vlakke substraten |
GB2588937B (en) * | 2019-11-15 | 2023-01-04 | Dyson Technology Ltd | Sputter deposition |
CN114075650A (zh) * | 2020-08-18 | 2022-02-22 | 群创光电股份有限公司 | 曲面基板的镀膜装置及其镀膜方法 |
JP7170016B2 (ja) * | 2020-10-06 | 2022-11-11 | キヤノントッキ株式会社 | 成膜装置 |
CN117568771B (zh) * | 2023-12-08 | 2024-07-02 | 成都国泰真空设备有限公司 | 一种磁控溅射镀膜传动装置 |
CN117512545A (zh) * | 2024-01-08 | 2024-02-06 | 中国科学院长春光学精密机械与物理研究所 | 大口径光学膜层沉积方法及镀膜设备 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6488824B1 (en) | 1998-11-06 | 2002-12-03 | Raycom Technologies, Inc. | Sputtering apparatus and process for high rate coatings |
WO2000028104A1 (en) | 1998-11-06 | 2000-05-18 | Scivac | Sputtering apparatus and process for high rate coatings |
JP2003183823A (ja) | 2001-12-17 | 2003-07-03 | Sharp Corp | スパッタ装置 |
WO2006007504A1 (en) * | 2004-07-01 | 2006-01-19 | Cardinal Cg Company | Cylindrical target with oscillating magnet from magnetron sputtering |
TWI312012B (en) | 2005-07-13 | 2009-07-11 | Applied Materials Inc | Improved magnetron sputtering system for large-area substrates having removable anodes |
US7563725B2 (en) | 2007-04-05 | 2009-07-21 | Solyndra, Inc. | Method of depositing materials on a non-planar surface |
EP2159821B1 (de) * | 2008-09-02 | 2020-01-15 | Oerlikon Surface Solutions AG, Pfäffikon | Beschichtungsvorrichtung zum Beschichten eines Substrats, sowie ein Verfahren zum Beschichten eines Substrats |
FR2940321B1 (fr) * | 2008-12-19 | 2011-12-23 | Carewave Shielding Technologies | Machine de depot sous vide,sur un substrat,de materiaux en couches minces,par pulverisation cathodique. |
EP2306489A1 (en) | 2009-10-02 | 2011-04-06 | Applied Materials, Inc. | Method for coating a substrate and coater |
EP2437280A1 (en) | 2010-09-30 | 2012-04-04 | Applied Materials, Inc. | Systems and methods for forming a layer of sputtered material |
EP2640865B1 (en) * | 2010-11-17 | 2020-05-13 | Soleras Advanced Coatings bvba | Soft sputtering magnetron system |
JP5687045B2 (ja) | 2010-12-20 | 2015-03-18 | キヤノンアネルバ株式会社 | スパッタリング装置およびスパッタリング方法 |
JP2014074188A (ja) * | 2010-12-27 | 2014-04-24 | Canon Anelva Corp | スパッタリング装置およびスパッタリング方法 |
JP2013001920A (ja) | 2011-06-14 | 2013-01-07 | Hitachi High-Technologies Corp | スパッタリング装置、スパッタリング装置を用いた成膜装置、およびそれらの成膜方法 |
-
2015
- 2015-07-08 CN CN201580037325.XA patent/CN106488996B/zh active Active
- 2015-07-08 WO PCT/EP2015/065645 patent/WO2016005476A1/en active Application Filing
- 2015-07-08 JP JP2017500328A patent/JP6805124B2/ja active Active
- 2015-07-08 BE BE2015/5433A patent/BE1022358B1/nl active
- 2015-07-08 KR KR1020177003243A patent/KR102124786B1/ko active IP Right Grant
- 2015-07-08 US US15/324,853 patent/US10424468B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017521560A (ja) | 2017-08-03 |
CN106488996A (zh) | 2017-03-08 |
CN106488996B (zh) | 2019-07-23 |
US10424468B2 (en) | 2019-09-24 |
KR20170029561A (ko) | 2017-03-15 |
US20170207071A1 (en) | 2017-07-20 |
JP6805124B2 (ja) | 2020-12-23 |
KR102124786B1 (ko) | 2020-06-22 |
BE1022358B1 (nl) | 2016-03-24 |
WO2016005476A1 (en) | 2016-01-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PD | Change of ownership |
Owner name: SOLERAS ADVANCED COATINGS BV; BE Free format text: DETAILS ASSIGNMENT: CHANGE OF OWNER(S), CESSION Effective date: 20200512 |