AU3224201A - Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method - Google Patents

Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method

Info

Publication number
AU3224201A
AU3224201A AU32242/01A AU3224201A AU3224201A AU 3224201 A AU3224201 A AU 3224201A AU 32242/01 A AU32242/01 A AU 32242/01A AU 3224201 A AU3224201 A AU 3224201A AU 3224201 A AU3224201 A AU 3224201A
Authority
AU
Australia
Prior art keywords
solder paste
soldering method
product prepared
jointed product
jointed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU32242/01A
Inventor
Hitoshi Amita
Noriko Murase
Takashi Shoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of AU3224201A publication Critical patent/AU3224201A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU32242/01A 2000-02-08 2001-02-08 Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method Abandoned AU3224201A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000-35661 2000-02-08
JP2000035661 2000-02-08
JP2000-224866 2000-07-26
JP2000224866A JP2002086292A (en) 2000-02-08 2000-07-26 Solder paste
PCT/JP2001/000877 WO2001058639A1 (en) 2000-02-08 2001-02-08 Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method

Publications (1)

Publication Number Publication Date
AU3224201A true AU3224201A (en) 2001-08-20

Family

ID=26585317

Family Applications (1)

Application Number Title Priority Date Filing Date
AU32242/01A Abandoned AU3224201A (en) 2000-02-08 2001-02-08 Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method

Country Status (5)

Country Link
JP (1) JP2002086292A (en)
CN (1) CN1211183C (en)
AU (1) AU3224201A (en)
TW (1) TW503147B (en)
WO (1) WO2001058639A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049429A (en) * 2004-08-02 2006-02-16 Sharp Corp Method for manufacturing solar cell and solar cell module
JP2006181635A (en) * 2004-12-28 2006-07-13 Senju Metal Ind Co Ltd Method for preventing blackening of lead-free solder and solder paste
CN100425385C (en) * 2006-10-27 2008-10-15 烟台德邦科技有限公司 Leadless solder paste and its preparation method
JP5273443B2 (en) * 2008-03-24 2013-08-28 三菱マテリアル株式会社 Method for forming minute solder bump and solder paste
CN101653876B (en) * 2009-08-19 2012-05-02 浙江一远电子材料研究院 Low-silver halogen free soldering paste
TWI500467B (en) * 2010-01-08 2015-09-21 Arakawa Chem Ind Flux composition for lead-free solder, and lead-free solder paste
WO2012081688A1 (en) * 2010-12-17 2012-06-21 荒川化学工業株式会社 Lead-free solder flux and lead-free solder paste
CN102069315B (en) * 2011-02-21 2012-11-21 四川大学 Unleaded halogen-free soldering paste with high wettability
JP5974608B2 (en) * 2011-04-26 2016-08-23 荒川化学工業株式会社 Dip soldering flux
CN102528329B (en) * 2011-12-30 2013-09-18 深圳市上煌实业有限公司 Halogen-free and lead-free solder paste and preparation method
JP5520973B2 (en) * 2012-01-17 2014-06-11 株式会社デンソー Flux for flux cored solder and flux solder
JP6027426B2 (en) * 2012-12-18 2016-11-16 ニホンハンダ株式会社 Solder paste and soldering mounting method
JP6405920B2 (en) * 2014-11-12 2018-10-17 千住金属工業株式会社 Solder paste flux, solder paste and solder joint
JP5816947B1 (en) * 2015-02-05 2015-11-18 株式会社弘輝 Activator for flux, flux and solder
JP6628759B2 (en) * 2017-03-30 2020-01-15 株式会社タムラ製作所 Precoat solder composition and method for manufacturing printed wiring board
JP7011823B2 (en) * 2018-05-14 2022-02-10 株式会社弘輝 Flux and solder materials
JP6536730B1 (en) * 2018-08-10 2019-07-03 千住金属工業株式会社 Flux and solder paste
CN109014655B (en) * 2018-08-15 2020-12-01 佛山市诺普材料科技有限公司 Silver alloy soldering paste with good dispensing performance and preparation method thereof
JP6681567B1 (en) * 2019-05-27 2020-04-15 千住金属工業株式会社 Solder paste and flux
JP6681566B1 (en) * 2019-05-27 2020-04-15 千住金属工業株式会社 Solder paste and flux
CN111299896B (en) * 2020-03-11 2021-07-20 漳州佳联化工有限公司 Soldering paste and preparation method thereof
CN117001208B (en) * 2023-08-23 2024-05-03 绍兴拓邦新能源股份有限公司 Zero-halogen no-clean soldering flux

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH091382A (en) * 1995-06-20 1997-01-07 Harima Chem Inc Solder paste composition
JP3379679B2 (en) * 1996-06-10 2003-02-24 千住金属工業株式会社 Solder paste
JPH106074A (en) * 1996-06-20 1998-01-13 Harima Chem Inc Solder paste composition
JP3335307B2 (en) * 1998-03-19 2002-10-15 株式会社東芝 Solder paste and flux for forming solder joints

Also Published As

Publication number Publication date
CN1211183C (en) 2005-07-20
CN1358123A (en) 2002-07-10
WO2001058639A1 (en) 2001-08-16
TW503147B (en) 2002-09-21
JP2002086292A (en) 2002-03-26
WO2001058639A9 (en) 2002-01-17

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase