AU2001292257A1 - Alloy for solder and solder joint - Google Patents
Alloy for solder and solder jointInfo
- Publication number
- AU2001292257A1 AU2001292257A1 AU2001292257A AU9225701A AU2001292257A1 AU 2001292257 A1 AU2001292257 A1 AU 2001292257A1 AU 2001292257 A AU2001292257 A AU 2001292257A AU 9225701 A AU9225701 A AU 9225701A AU 2001292257 A1 AU2001292257 A1 AU 2001292257A1
- Authority
- AU
- Australia
- Prior art keywords
- solder
- alloy
- joint
- solder joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coating With Molten Metal (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-324546 | 2000-10-24 | ||
JP2000324546 | 2000-10-24 | ||
PCT/JP2001/008399 WO2002034969A1 (en) | 2000-10-24 | 2001-09-26 | Alloy for solder and solder joint |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001292257A1 true AU2001292257A1 (en) | 2002-05-06 |
Family
ID=18802060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001292257A Abandoned AU2001292257A1 (en) | 2000-10-24 | 2001-09-26 | Alloy for solder and solder joint |
Country Status (9)
Country | Link |
---|---|
US (1) | US6361626B1 (en) |
EP (1) | EP1332831B1 (en) |
JP (1) | JP3357045B2 (en) |
KR (3) | KR20020032280A (en) |
CN (1) | CN1188241C (en) |
AU (1) | AU2001292257A1 (en) |
DE (1) | DE60110450T2 (en) |
TW (1) | TW503145B (en) |
WO (1) | WO2002034969A1 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1307076A4 (en) * | 2000-07-12 | 2005-01-12 | Rohm Co Ltd | Structure for interconnecting conductors and connecting method |
JP2003234433A (en) * | 2001-10-01 | 2003-08-22 | Matsushita Electric Ind Co Ltd | Semiconductor device, its mounting method, mounting block and its manufacturing method |
JP2003243597A (en) * | 2002-02-20 | 2003-08-29 | Nec Electronics Corp | Electronic component and manufacturing method therefor |
DE10237495A1 (en) * | 2002-04-22 | 2003-11-13 | Siemens Ag | Solder material used in the production of electrical/electronic components using Flip-Chip technology contains aluminum |
JP2004082134A (en) * | 2002-08-23 | 2004-03-18 | Nippon Metal Ind Co Ltd | Tin-zinc based lead-free solder alloy and its mixture |
JP3578453B2 (en) | 2002-08-23 | 2004-10-20 | 日本金属工業株式会社 | Tin-zinc lead-free solder alloy |
JP4770733B2 (en) | 2004-04-21 | 2011-09-14 | 日本電気株式会社 | Solder and mounted products using it |
DE102005042075B3 (en) * | 2005-08-31 | 2007-01-04 | BAM Bundesanstalt für Materialforschung und -prüfung | Sample analysis method for preparing a flat sample body makes the sample body available for subsequent analysis/measurement of its cross-sectional surface |
WO2007029329A1 (en) * | 2005-09-09 | 2007-03-15 | Fujitsu Limited | Solder alloy, and making use of the solder alloy, electronic substrate and process for producing the same |
JP5160201B2 (en) * | 2007-11-20 | 2013-03-13 | 株式会社豊田中央研究所 | Solder material and manufacturing method thereof, joined body and manufacturing method thereof, power semiconductor module and manufacturing method thereof |
CN102152022A (en) * | 2011-04-18 | 2011-08-17 | 宁波喜汉锡焊料有限公司 | Corrosion-resistant Sn-Zn-based lead-free solder with high oxidation resistance |
US10046417B2 (en) | 2011-08-17 | 2018-08-14 | Honeywell International Inc. | Lead-free solder compositions |
JP5387808B1 (en) * | 2012-04-18 | 2014-01-15 | 千住金属工業株式会社 | Solder alloy |
CN102814595B (en) * | 2012-05-05 | 2015-04-08 | 大连理工大学 | Sn-Zn based near-eutectic lead-free solder alloy for aluminum-bronze soft soldering |
MY181753A (en) | 2013-05-03 | 2021-01-06 | Honeywell Int Inc | Lead frame construct for lead-free solder connections |
CN103273175B (en) * | 2013-06-07 | 2015-12-02 | 哈电集团(秦皇岛)重型装备有限公司 | Adapter is without bismuth stainless flux-cored wire gas shielded welding progress |
CN103706962B (en) * | 2013-12-30 | 2015-12-30 | 大连理工大学 | A kind of Sn-Zn-Ni lead-free solder alloy for aluminum bronze solder |
KR101640691B1 (en) * | 2014-12-31 | 2016-07-19 | 세종대학교산학협력단 | Sn based alloy having improved mechanical property |
JP6473463B2 (en) * | 2016-06-24 | 2019-02-20 | 朝日インテック株式会社 | Guide wire |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51138561A (en) | 1975-05-27 | 1976-11-30 | Asahi Glass Co Ltd | Soldering method of oxidized metal surface |
JPS5711793A (en) * | 1980-06-26 | 1982-01-21 | Dainichi Nippon Cables Ltd | Solder for aluminium |
JPS5942197A (en) * | 1982-08-31 | 1984-03-08 | Matsushita Electric Works Ltd | Solder |
US5445004A (en) * | 1993-11-24 | 1995-08-29 | Breda Danieli Extrusion | Extrusion method with gas evacuation, and extrusion press |
KR0151999B1 (en) * | 1995-06-30 | 1998-11-16 | 이형도 | Lead free solder |
JPH09206983A (en) * | 1996-02-02 | 1997-08-12 | Sony Corp | Soldering material |
US5851482A (en) * | 1996-03-22 | 1998-12-22 | Korea Institute Of Machinery & Metals | Tin-bismuth based lead-free solder for copper and copper alloys |
JP3306007B2 (en) * | 1998-06-30 | 2002-07-24 | 株式会社東芝 | Solder material |
JP4138965B2 (en) * | 1998-10-01 | 2008-08-27 | 三井金属鉱業株式会社 | Lead-free solder powder and manufacturing method thereof |
JP2000326088A (en) * | 1999-03-16 | 2000-11-28 | Nippon Sheet Glass Co Ltd | Lead-free solder |
JP2001150179A (en) * | 1999-11-26 | 2001-06-05 | Nippon Handa Kk | Cream solder and adhesion method using the same |
-
2001
- 2001-04-23 US US09/839,371 patent/US6361626B1/en not_active Expired - Lifetime
- 2001-05-02 KR KR1020010023631A patent/KR20020032280A/en not_active Application Discontinuation
- 2001-09-26 CN CNB018032680A patent/CN1188241C/en not_active Expired - Lifetime
- 2001-09-26 AU AU2001292257A patent/AU2001292257A1/en not_active Abandoned
- 2001-09-26 WO PCT/JP2001/008399 patent/WO2002034969A1/en active IP Right Grant
- 2001-09-26 EP EP01972512A patent/EP1332831B1/en not_active Expired - Lifetime
- 2001-09-26 KR KR1020027007822A patent/KR100726854B1/en active IP Right Grant
- 2001-09-26 DE DE60110450T patent/DE60110450T2/en not_active Expired - Lifetime
- 2001-09-26 KR KR1020067027254A patent/KR100760348B1/en active IP Right Grant
- 2001-09-26 JP JP2002537933A patent/JP3357045B2/en not_active Expired - Lifetime
- 2001-09-27 TW TW090123952A patent/TW503145B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20020062975A (en) | 2002-07-31 |
DE60110450T2 (en) | 2005-08-25 |
JPWO2002034969A1 (en) | 2004-03-04 |
KR20070010204A (en) | 2007-01-22 |
CN1394155A (en) | 2003-01-29 |
TW503145B (en) | 2002-09-21 |
EP1332831A4 (en) | 2004-07-28 |
US6361626B1 (en) | 2002-03-26 |
CN1188241C (en) | 2005-02-09 |
JP3357045B2 (en) | 2002-12-16 |
EP1332831A1 (en) | 2003-08-06 |
DE60110450D1 (en) | 2005-06-02 |
KR20020032280A (en) | 2002-05-03 |
WO2002034969A1 (en) | 2002-05-02 |
KR100760348B1 (en) | 2007-09-20 |
EP1332831B1 (en) | 2005-04-27 |
KR100726854B1 (en) | 2007-06-12 |
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