AU2400497A - Apparatus and method for improved deposition of conformal liner films and plugs in high aspect ratio contacts - Google Patents

Apparatus and method for improved deposition of conformal liner films and plugs in high aspect ratio contacts

Info

Publication number
AU2400497A
AU2400497A AU24004/97A AU2400497A AU2400497A AU 2400497 A AU2400497 A AU 2400497A AU 24004/97 A AU24004/97 A AU 24004/97A AU 2400497 A AU2400497 A AU 2400497A AU 2400497 A AU2400497 A AU 2400497A
Authority
AU
Australia
Prior art keywords
plugs
aspect ratio
high aspect
improved deposition
conformal liner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU24004/97A
Other languages
English (en)
Inventor
Jeffrey M. Bulson
Bruce Gittleman
Corey A. Weiss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Materials Research Corp
Original Assignee
Sony Corp
Materials Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp, Materials Research Corp filed Critical Sony Corp
Publication of AU2400497A publication Critical patent/AU2400497A/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/2855Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by physical means, e.g. sputtering, evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/046Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841Barrier, adhesion or liner layers
    • H01L21/76843Barrier, adhesion or liner layers formed in openings in a dielectric

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
AU24004/97A 1996-04-26 1997-04-15 Apparatus and method for improved deposition of conformal liner films and plugs in high aspect ratio contacts Abandoned AU2400497A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US63829096A 1996-04-26 1996-04-26
US08638290 1996-04-26
PCT/IB1997/000522 WO1997041598A1 (en) 1996-04-26 1997-04-15 Apparatus and method for improved deposition of conformal liner films and plugs in high aspect ratio contacts

Publications (1)

Publication Number Publication Date
AU2400497A true AU2400497A (en) 1997-11-19

Family

ID=24559418

Family Applications (1)

Application Number Title Priority Date Filing Date
AU24004/97A Abandoned AU2400497A (en) 1996-04-26 1997-04-15 Apparatus and method for improved deposition of conformal liner films and plugs in high aspect ratio contacts

Country Status (7)

Country Link
EP (1) EP0843890A1 (ja)
JP (1) JPH11509049A (ja)
KR (1) KR19990028451A (ja)
AU (1) AU2400497A (ja)
CA (1) CA2225446A1 (ja)
TW (1) TW417223B (ja)
WO (1) WO1997041598A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002007198A2 (en) * 2000-07-18 2002-01-24 Applied Materials, Inc. Deposition of low stress tantalum films
JP2005082873A (ja) * 2003-09-10 2005-03-31 Applied Materials Inc 膜形成方法
KR101603798B1 (ko) * 2007-10-26 2016-03-15 에바텍 어드벤스드 테크놀로지스 아크티엔게젤샤프트 관통 실리콘 비아 금속화에 대한 고전력 마그네트론 스퍼터링의 적용
US20100096253A1 (en) * 2008-10-22 2010-04-22 Applied Materials, Inc Pvd cu seed overhang re-sputtering with enhanced cu ionization

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4925542A (en) * 1988-12-08 1990-05-15 Trw Inc. Plasma plating apparatus and method
EP0735577A3 (en) * 1994-12-14 1997-04-02 Applied Materials Inc Deposit process and apparatus

Also Published As

Publication number Publication date
WO1997041598A1 (en) 1997-11-06
CA2225446A1 (en) 1997-11-06
KR19990028451A (ko) 1999-04-15
JPH11509049A (ja) 1999-08-03
TW417223B (en) 2001-01-01
EP0843890A1 (en) 1998-05-27

Similar Documents

Publication Publication Date Title
AU6360098A (en) Apparatus and method for plasma preparation
AU6580796A (en) Apparatus and method for TV broadcast copy protection
AU1261195A (en) Method and apparatus for producing thin films
AU4228197A (en) Method and apparatus for initialization of cryptographic terminal
AU3227597A (en) Method and apparatus for managing client-server communications
AU4405697A (en) Method and apparatus for synchronization of time stamping
AU4001395A (en) Conformal titanium-based films and method for their preparation
AU3876197A (en) Method and apparatus for synchronizing private radio systems
AU4603097A (en) Method and apparatus for mitigating intermodulation effects in multiple-signal transmission systems
AU8218098A (en) Method and apparatus for growing thin films
AU9106398A (en) Keypads: improved apparatus and method of making
AU7040996A (en) Key identifier method and apparatus
AU1425997A (en) Method and apparatus for making insignias
SG74621A1 (en) Composition and process for forming electrically insulating thin films
AU1469197A (en) Method and apparatus for locating partial discharge in electrical transformers
AU1669397A (en) Image-forming apparatus and method of manufacturing same
AU6878598A (en) Nanoporous dielectric films with graded density and process for making such films
SG70074A1 (en) Composition and process for forming electrically insulating thin films
AU7591898A (en) Apparatus and method for sputter depositing dielectric films on a substrate
AU2400497A (en) Apparatus and method for improved deposition of conformal liner films and plugs in high aspect ratio contacts
AU1962897A (en) Shrink films and method for making films having maximum heat shrink
AU2993997A (en) New method of forming fine circuit lines
AU6071296A (en) Method and apparatus for forming solid phase plugs in pipelines
EP0723148A3 (en) Continuity tester and method
AU2244395A (en) Apparatus and method for retention of thin foils during forming