AU2003270208A1 - Dark layers - Google Patents
Dark layersInfo
- Publication number
- AU2003270208A1 AU2003270208A1 AU2003270208A AU2003270208A AU2003270208A1 AU 2003270208 A1 AU2003270208 A1 AU 2003270208A1 AU 2003270208 A AU2003270208 A AU 2003270208A AU 2003270208 A AU2003270208 A AU 2003270208A AU 2003270208 A1 AU2003270208 A1 AU 2003270208A1
- Authority
- AU
- Australia
- Prior art keywords
- dark layers
- dark
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10243139.6 | 2002-09-17 | ||
DE2002143139 DE10243139A1 (en) | 2002-09-17 | 2002-09-17 | Alloy for decorative or functional purposes e.g. as a coating material for buttons and sliding clasp fasteners and absorbing layers in solar cells contains tin, copper, bismuth and oxidic oxygen |
PCT/EP2003/010302 WO2004027120A1 (en) | 2002-09-17 | 2003-09-16 | Dark layers |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003270208A1 true AU2003270208A1 (en) | 2004-04-08 |
Family
ID=31896111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003270208A Abandoned AU2003270208A1 (en) | 2002-09-17 | 2003-09-16 | Dark layers |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2003270208A1 (en) |
DE (1) | DE10243139A1 (en) |
WO (1) | WO2004027120A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7867625B2 (en) | 2002-06-13 | 2011-01-11 | Nihon New Chrome Co., Ltd. | Copper-tin-oxygen alloy plating |
BR0312136B1 (en) * | 2002-06-13 | 2012-09-04 | ornamental article. | |
EP1961840B1 (en) * | 2007-02-14 | 2009-12-30 | Umicore Galvanotechnik GmbH | Copper-tin electrolyte and method for depositing bronze layers |
DE102008032398A1 (en) * | 2008-07-10 | 2010-01-14 | Umicore Galvanotechnik Gmbh | Improved copper-tin electrolyte and process for depositing bronze layers |
AT514427B1 (en) * | 2013-07-05 | 2015-01-15 | W Garhöfer Ges M B H Ing | Electrolyte bath and thus available objects or articles |
DE102013021502A1 (en) * | 2013-12-19 | 2015-06-25 | Schlenk Metallfolien Gmbh & Co. Kg | Electrically conductive fluids based on metal diphosphonate complexes |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2678876A (en) * | 1950-12-26 | 1954-05-18 | Rca Corp | Conditioning of metal surfaces |
DE1190199B (en) * | 1957-09-27 | 1965-04-01 | Siemens Ag | Use of an alloy based on silver and / or copper as a material for electrical contacts |
US2989448A (en) * | 1959-04-08 | 1961-06-20 | Daniel R France | Brass, copper-tin, and copper plating bath brightener |
AR208421A1 (en) * | 1975-07-16 | 1976-12-27 | Alcan Res & Dev | ELECTROLYTICALLY ANODIZED AND COLORED ALUMINUM ARTICLE AND A METHOD TO PRODUCE THE SAME |
US4022671A (en) * | 1976-04-20 | 1977-05-10 | Alcan Research And Development Limited | Electrolytic coloring of anodized aluminum |
US4789094A (en) * | 1986-03-06 | 1988-12-06 | Institut Electrosvarki Imeni E.O. Patona | Device for alignment of cylindrical workpieces for magnetic-discharge welding |
JPH0637711B2 (en) * | 1989-06-22 | 1994-05-18 | 新日本製鐵株式会社 | Method for producing black surface-treated steel sheet |
DE4227023C1 (en) * | 1992-08-14 | 1993-09-09 | Julius & August Erbsloeh Gmbh & Co, 5620 Velbert, De | Colouring anodised coatings on aluminium@ objects - using 1st soln. contg. organic colouring agent and 2nd soln. contg. metal salt in which electrolytic treatment is carried out |
US5330712A (en) * | 1993-04-22 | 1994-07-19 | Federalloy, Inc. | Copper-bismuth alloys |
US5368814A (en) * | 1993-06-16 | 1994-11-29 | International Business Machines, Inc. | Lead free, tin-bismuth solder alloys |
AUPM529494A0 (en) * | 1994-04-26 | 1994-05-19 | Copper Refineries Pty Ltd | Artificial patina |
JPH0827590A (en) * | 1994-07-13 | 1996-01-30 | Okuno Chem Ind Co Ltd | Bright copper-tin alloy plating bath |
WO1997020970A1 (en) * | 1995-08-23 | 1997-06-12 | Citizen Watch Co., Ltd. | Ornamental member |
JP3481020B2 (en) * | 1995-09-07 | 2003-12-22 | ディップソール株式会社 | Sn-Bi alloy plating bath |
US6419766B1 (en) * | 1996-04-02 | 2002-07-16 | Tabuchi Corp. | Cutting-free bronze alloys |
JP3433291B2 (en) * | 1999-09-27 | 2003-08-04 | 石原薬品株式会社 | Tin-copper-containing alloy plating bath, tin-copper-containing alloy plating method, and article formed with tin-copper-containing alloy plating film |
JP2001172791A (en) * | 1999-12-16 | 2001-06-26 | Ishihara Chem Co Ltd | Tin-copper base alloy plating bath and electronic part with tin-copper base alloy film formed by the plating bath |
DE60227159D1 (en) * | 2001-03-06 | 2008-07-31 | Kiyohito Ishida | ELEMENT WITH SEPARATION STRUCTURE AND METHOD FOR THE PRODUCTION THEREOF |
-
2002
- 2002-09-17 DE DE2002143139 patent/DE10243139A1/en not_active Ceased
-
2003
- 2003-09-16 AU AU2003270208A patent/AU2003270208A1/en not_active Abandoned
- 2003-09-16 WO PCT/EP2003/010302 patent/WO2004027120A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
DE10243139A1 (en) | 2004-03-25 |
WO2004027120A1 (en) | 2004-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |