AU2002215211A1 - Liquid thermosetting resin composition, printed wiring boards and process for their production - Google Patents

Liquid thermosetting resin composition, printed wiring boards and process for their production

Info

Publication number
AU2002215211A1
AU2002215211A1 AU2002215211A AU1521102A AU2002215211A1 AU 2002215211 A1 AU2002215211 A1 AU 2002215211A1 AU 2002215211 A AU2002215211 A AU 2002215211A AU 1521102 A AU1521102 A AU 1521102A AU 2002215211 A1 AU2002215211 A1 AU 2002215211A1
Authority
AU
Australia
Prior art keywords
production
resin composition
printed wiring
thermosetting resin
wiring boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002215211A
Inventor
Norio Kimura
Rieko Takahashi
Yasukazu Watanabe
Kyoichi Yoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of AU2002215211A1 publication Critical patent/AU2002215211A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
    • C08G59/5086—Triazines; Melamines; Guanamines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249982—With component specified as adhesive or bonding agent
    • Y10T428/249985—Composition of adhesive or bonding component specified

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AU2002215211A 2000-11-29 2001-11-14 Liquid thermosetting resin composition, printed wiring boards and process for their production Abandoned AU2002215211A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000363719 2000-11-29
JP2000-363719 2000-11-29
PCT/JP2001/009955 WO2002044274A1 (en) 2000-11-29 2001-11-14 Liquid thermosetting resin composition, printed wiring boards and process for their production

Publications (1)

Publication Number Publication Date
AU2002215211A1 true AU2002215211A1 (en) 2002-06-11

Family

ID=18834785

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002215211A Abandoned AU2002215211A1 (en) 2000-11-29 2001-11-14 Liquid thermosetting resin composition, printed wiring boards and process for their production

Country Status (8)

Country Link
US (1) US6916873B2 (en)
EP (1) EP1338624B1 (en)
JP (1) JP4298291B2 (en)
KR (1) KR100797061B1 (en)
CN (1) CN1235971C (en)
AU (1) AU2002215211A1 (en)
TW (1) TW507507B (en)
WO (1) WO2002044274A1 (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003046034A (en) * 2001-07-31 2003-02-14 Nec Kagobutsu Device Kk Resin-sealed semiconductor device
JP4365641B2 (en) * 2002-07-10 2009-11-18 日本特殊陶業株式会社 Multilayer wiring board and method for manufacturing multilayer wiring board
US7438969B2 (en) 2002-07-10 2008-10-21 Ngk Spark Plug Co., Ltd. Filling material, multilayer wiring board, and process of producing multilayer wiring board
JP4172257B2 (en) * 2002-11-21 2008-10-29 日立化成工業株式会社 Resin paste composition and semiconductor device using the same.
KR100499004B1 (en) * 2002-12-18 2005-07-01 삼성전기주식회사 A printed circuit board with opto-via holes, and a process for forming them
TWI336220B (en) * 2003-06-20 2011-01-11 Japan Circuit Ind Co Ltd A method of forming a high density printed wiring board for mounting a semiconductor
WO2005056683A1 (en) * 2003-12-15 2005-06-23 Sekisui Chemical Co., Ltd. Thermosetting resin composition, material for substrate and film for substrate
JP2005184630A (en) * 2003-12-22 2005-07-07 Mitsui Chemicals Inc Housing for storing semiconductor chip for image pickup device, and imaging device
JP4841830B2 (en) * 2004-01-08 2011-12-21 日本特殊陶業株式会社 Wiring board manufacturing method
JP3896398B2 (en) * 2004-02-25 2007-03-22 サンノプコ株式会社 Thermosetting resin composition
US7396499B2 (en) * 2004-09-28 2008-07-08 Thomas E Frankel Multiple layered membrane with fluorine containing polymer layer
CN100459825C (en) * 2004-11-10 2009-02-04 华通电脑股份有限公司 Circuit board plug socket material equating method and equipment
JP2006241449A (en) * 2005-02-07 2006-09-14 San Nopco Ltd Thermosetting resin composition
DE102006016964A1 (en) * 2006-04-11 2007-10-18 Conti Temic Microelectronic Gmbh Method for producing an electronic assembly, electronic assembly and carrier body therefor
CN101409982B (en) * 2007-10-09 2010-06-16 南亚电路板股份有限公司 Method for manufacturing circuit board
JP2009239181A (en) * 2008-03-28 2009-10-15 Taiyo Ink Mfg Ltd Resin composition for printed circuit board, dry film, and printed circuit board
JP5238342B2 (en) * 2008-05-07 2013-07-17 太陽ホールディングス株式会社 Thermosetting resin composition for hole filling of printed wiring board and printed wiring board using the same
JP5542360B2 (en) * 2009-03-30 2014-07-09 太陽ホールディングス株式会社 Printed wiring board
JP5507162B2 (en) * 2009-09-01 2014-05-28 京セラケミカル株式会社 Electric double layer capacitor
CN101854778B (en) * 2010-04-30 2011-10-26 深圳崇达多层线路板有限公司 Manufacturing process for plugging conductive holes of circuit board with resin
CN102348337A (en) * 2010-04-30 2012-02-08 深圳崇达多层线路板有限公司 Method for producing circuit board containing stepped blind hole
JP5739631B2 (en) * 2010-09-27 2015-06-24 太陽ホールディングス株式会社 Thermosetting resin filler
CN103533780A (en) * 2012-07-06 2014-01-22 欣兴电子股份有限公司 Method for manufacturing soft-hard composite board
CN103384453B (en) * 2013-07-11 2016-05-11 电子科技大学 The processing method of the reliable hole of a kind of printed circuit internal layer and line
CN103687335A (en) * 2013-12-11 2014-03-26 广州兴森快捷电路科技有限公司 Manufacturing method for circuit board holes being selectively plugged with resin
CN105530768B (en) * 2014-09-28 2019-02-05 深南电路有限公司 A kind of production method and circuit board of circuit board
CN105101643A (en) * 2015-07-17 2015-11-25 昆山旭发电子有限公司 Resin hole-plugging process
TWI557177B (en) 2015-12-16 2016-11-11 財團法人工業技術研究院 Low dielectric constant and solventless resin composition and substrate structure
TWI788471B (en) * 2018-01-16 2023-01-01 日商太陽油墨製造股份有限公司 Thermosetting resin composition, cured product thereof, and printed wiring board
CN117881096B (en) * 2024-03-13 2024-05-24 江苏普诺威电子股份有限公司 Heat dissipation packaging substrate and processing method thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3056637B2 (en) * 1994-05-06 2000-06-26 住友ベークライト株式会社 Epoxy resin composition
US5719225A (en) * 1994-06-13 1998-02-17 Sumitomo Chemical Company, Ltd. Filler-containing resin composition suitable for injection molding and transfer molding
JP3242009B2 (en) * 1995-10-23 2001-12-25 イビデン株式会社 Resin filler
JPH10224034A (en) * 1997-02-06 1998-08-21 Ibiden Co Ltd Resin-filling agent and multilayer printed wiring board
JP3548691B2 (en) * 1998-01-07 2004-07-28 太陽インキ製造株式会社 Liquid thermosetting filling composition and method for filling permanent holes in printed wiring boards using the same
TW399398B (en) * 1998-01-07 2000-07-21 Taiyo Ink Seizo K K Liquid thermosetting filling composition and method for permanently filling holes in printed circuit board by the use thereof
JPH11286535A (en) * 1998-02-03 1999-10-19 Taiyo Ink Mfg Ltd Photosensitive and thermosetting resin composition, and formation of resin insulating pattern using the same
JP3413462B2 (en) * 1998-04-21 2003-06-03 タツタ電線株式会社 Hole filling paste
JP2000273287A (en) * 1999-03-25 2000-10-03 Shin Etsu Chem Co Ltd Under-filling material for flip chip type semiconductor device and flip chip type semiconductor device
JP2000294890A (en) * 1999-04-09 2000-10-20 Ngk Spark Plug Co Ltd Paste for filling through hole, printed wiring board using that and its manufacture

Also Published As

Publication number Publication date
TW507507B (en) 2002-10-21
EP1338624B1 (en) 2013-03-13
US20030129383A1 (en) 2003-07-10
US6916873B2 (en) 2005-07-12
CN1235971C (en) 2006-01-11
EP1338624A1 (en) 2003-08-27
JPWO2002044274A1 (en) 2004-04-02
KR100797061B1 (en) 2008-01-23
EP1338624A4 (en) 2005-08-17
KR20020077398A (en) 2002-10-11
CN1396943A (en) 2003-02-12
JP4298291B2 (en) 2009-07-15
WO2002044274A1 (en) 2002-06-06

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