AU2003211797A1 - Photosensitive resin composition, process for forming photosensitive elements or resist patterns with the same, and process for production of printed wiring boards - Google Patents
Photosensitive resin composition, process for forming photosensitive elements or resist patterns with the same, and process for production of printed wiring boardsInfo
- Publication number
- AU2003211797A1 AU2003211797A1 AU2003211797A AU2003211797A AU2003211797A1 AU 2003211797 A1 AU2003211797 A1 AU 2003211797A1 AU 2003211797 A AU2003211797 A AU 2003211797A AU 2003211797 A AU2003211797 A AU 2003211797A AU 2003211797 A1 AU2003211797 A1 AU 2003211797A1
- Authority
- AU
- Australia
- Prior art keywords
- production
- resin composition
- printed wiring
- same
- wiring boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002054451 | 2002-02-28 | ||
| JP2002-054451 | 2002-02-28 | ||
| PCT/JP2003/002255 WO2003073168A1 (en) | 2002-02-28 | 2003-02-27 | Photosensitive resin composition, process for forming photosensitive elements or resist patterns with the same, and process for production of printed wiring boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003211797A1 true AU2003211797A1 (en) | 2003-09-09 |
Family
ID=27764398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003211797A Abandoned AU2003211797A1 (en) | 2002-02-28 | 2003-02-27 | Photosensitive resin composition, process for forming photosensitive elements or resist patterns with the same, and process for production of printed wiring boards |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP3855998B2 (en) |
| KR (1) | KR100630322B1 (en) |
| CN (1) | CN100576074C (en) |
| AU (1) | AU2003211797A1 (en) |
| TW (1) | TW200303452A (en) |
| WO (1) | WO2003073168A1 (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4485288B2 (en) * | 2003-09-26 | 2010-06-16 | 三菱化学株式会社 | Blue-violet laser photosensitive composition |
| JP4599974B2 (en) * | 2004-10-04 | 2010-12-15 | 日立化成工業株式会社 | Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method |
| CN100434948C (en) * | 2004-11-16 | 2008-11-19 | 奇美实业股份有限公司 | Photosensitive resin composition for colour filter |
| CN103885292B (en) | 2005-10-25 | 2017-09-22 | 日立化成株式会社 | Photosensitive polymer combination, the photosensitive element using it, the manufacture method of the forming method of Resist patterns and printed circuit board (PCB) |
| TW200745749A (en) * | 2006-02-21 | 2007-12-16 | Hitachi Chemical Co Ltd | Photosensitive resin composition, method for forming resist pattern, method for manufacturing printed wiring board, and method for producing substrate for plasma display panel |
| WO2007114014A1 (en) | 2006-03-31 | 2007-10-11 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, and method for producing printed wiring board |
| WO2007123062A1 (en) | 2006-04-18 | 2007-11-01 | Hitachi Chemical Company, Ltd. | Photosensitive element, method for formation of resist pattern, and method for production of print circuit board |
| JP5196738B2 (en) * | 2006-05-26 | 2013-05-15 | 富士フイルム株式会社 | Colored curable composition for color filter, color filter, and production method thereof |
| WO2008032674A1 (en) * | 2006-09-13 | 2008-03-20 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board |
| US7615332B2 (en) * | 2007-02-06 | 2009-11-10 | Canon Kabushiki Kaisha | Photosensitive compound, photosensitive composition, resist pattern forming method, and device production process |
| MY152732A (en) * | 2008-04-28 | 2014-11-28 | Hitachi Chemical Co Ltd | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board |
| CN101957559A (en) * | 2010-08-30 | 2011-01-26 | 上海交通大学 | Optical reversible nanoimprint photoresist as well as preparation method and application method thereof |
| WO2013084283A1 (en) | 2011-12-05 | 2013-06-13 | 日立化成株式会社 | Method for forming protective film for touch panel electrodes, photosensitive resin composition, and photosensitive element |
| WO2013084282A1 (en) | 2011-12-05 | 2013-06-13 | 日立化成株式会社 | Method for forming resin cured film pattern, photosensitive resin composition, and photosensitive element |
| CN108205240B (en) * | 2018-02-01 | 2021-05-07 | 浙江福斯特新材料研究院有限公司 | Photosensitive resin composition with high photosensitivity and excellent hole masking performance and application thereof |
| CN112650024B (en) * | 2020-12-17 | 2023-08-01 | 江苏艾森半导体材料股份有限公司 | High-film-thickness negative photoresist applied to chip packaging technology |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001174992A (en) * | 1999-04-28 | 2001-06-29 | Hitachi Chem Co Ltd | Photosensitive resin composition, photosensitive element using same, method for producing resist pattern and method for producing printed wiring board |
| JP4389132B2 (en) * | 1999-09-24 | 2009-12-24 | 日立化成工業株式会社 | Photosensitive element, method for producing resist pattern using the same, and method for producing printed wiring board |
| JP3437133B2 (en) * | 1999-12-15 | 2003-08-18 | 日立化成工業株式会社 | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board |
| JP4051594B2 (en) * | 2000-03-09 | 2008-02-27 | 日立化成工業株式会社 | Photosensitive resin composition, photosensitive element using the same, resist pattern manufacturing method, and printed wiring board manufacturing method |
-
2003
- 2003-02-27 JP JP2003571797A patent/JP3855998B2/en not_active Expired - Lifetime
- 2003-02-27 AU AU2003211797A patent/AU2003211797A1/en not_active Abandoned
- 2003-02-27 WO PCT/JP2003/002255 patent/WO2003073168A1/en active Application Filing
- 2003-02-27 TW TW092104596A patent/TW200303452A/en not_active IP Right Cessation
- 2003-02-27 CN CN03804647A patent/CN100576074C/en not_active Expired - Fee Related
- 2003-02-27 KR KR1020047011635A patent/KR100630322B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI320513B (en) | 2010-02-11 |
| CN1639641A (en) | 2005-07-13 |
| JP3855998B2 (en) | 2006-12-13 |
| WO2003073168A1 (en) | 2003-09-04 |
| CN100576074C (en) | 2009-12-30 |
| JPWO2003073168A1 (en) | 2005-06-23 |
| KR20040086310A (en) | 2004-10-08 |
| TW200303452A (en) | 2003-09-01 |
| KR100630322B1 (en) | 2006-09-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |