AU2001291143A1 - Polishing pad comprising a filled translucent region - Google Patents

Polishing pad comprising a filled translucent region

Info

Publication number
AU2001291143A1
AU2001291143A1 AU2001291143A AU9114301A AU2001291143A1 AU 2001291143 A1 AU2001291143 A1 AU 2001291143A1 AU 2001291143 A AU2001291143 A AU 2001291143A AU 9114301 A AU9114301 A AU 9114301A AU 2001291143 A1 AU2001291143 A1 AU 2001291143A1
Authority
AU
Australia
Prior art keywords
polishing pad
translucent region
filled translucent
filled
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001291143A
Inventor
Kelly J. Newell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials Inc
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of AU2001291143A1 publication Critical patent/AU2001291143A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
AU2001291143A 2000-10-06 2001-09-20 Polishing pad comprising a filled translucent region Abandoned AU2001291143A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23886200P 2000-10-06 2000-10-06
US60238862 2000-10-06
PCT/US2001/029398 WO2002030617A1 (en) 2000-10-06 2001-09-20 Polishing pad comprising a filled translucent region

Publications (1)

Publication Number Publication Date
AU2001291143A1 true AU2001291143A1 (en) 2002-04-22

Family

ID=22899630

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001291143A Abandoned AU2001291143A1 (en) 2000-10-06 2001-09-20 Polishing pad comprising a filled translucent region

Country Status (7)

Country Link
US (1) US6537134B2 (en)
EP (1) EP1324858A1 (en)
JP (1) JP2004511108A (en)
CN (1) CN1468162A (en)
AU (1) AU2001291143A1 (en)
TW (1) TW531467B (en)
WO (1) WO2002030617A1 (en)

Families Citing this family (19)

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Publication number Priority date Publication date Assignee Title
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US6840843B2 (en) * 2001-03-01 2005-01-11 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
US6702866B2 (en) * 2002-01-10 2004-03-09 Speedfam-Ipec Corporation Homogeneous fixed abrasive polishing pad
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7435165B2 (en) * 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US6960120B2 (en) * 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
KR100771738B1 (en) * 2003-04-03 2007-10-30 히다치 가세고교 가부시끼가이샤 Polishing pad, process for producing the same and method of polishing therewith
US7195544B2 (en) * 2004-03-23 2007-03-27 Cabot Microelectronics Corporation CMP porous pad with component-filled pores
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US7764377B2 (en) * 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
TW200720017A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat Water-based polishing pads having improved adhesion properties and methods of manufacture
US20070294090A1 (en) * 2006-06-20 2007-12-20 Xerox Corporation Automated repair analysis using a bundled rule-based system
US9138217B2 (en) 2009-11-11 2015-09-22 Nu Vasive, Inc. Surgical access system and related methods
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US9156125B2 (en) 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US9238294B2 (en) * 2014-06-18 2016-01-19 Nexplanar Corporation Polishing pad having porogens with liquid filler
US10259099B2 (en) * 2016-08-04 2019-04-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapering method for poromeric polishing pad

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US5337015A (en) 1993-06-14 1994-08-09 International Business Machines Corporation In-situ endpoint detection method and apparatus for chemical-mechanical polishing using low amplitude input voltage
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US6010538A (en) * 1996-01-11 2000-01-04 Luxtron Corporation In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link
US6074287A (en) 1996-04-12 2000-06-13 Nikon Corporation Semiconductor wafer polishing apparatus
US5872633A (en) 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
US6022268A (en) 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
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US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US5985679A (en) 1997-06-12 1999-11-16 Lsi Logic Corporation Automated endpoint detection system during chemical-mechanical polishing
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Also Published As

Publication number Publication date
US6537134B2 (en) 2003-03-25
TW531467B (en) 2003-05-11
WO2002030617A1 (en) 2002-04-18
CN1468162A (en) 2004-01-14
EP1324858A1 (en) 2003-07-09
JP2004511108A (en) 2004-04-08
US20020049033A1 (en) 2002-04-25

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