AU1665299A - Nanostructures - Google Patents
NanostructuresInfo
- Publication number
- AU1665299A AU1665299A AU16652/99A AU1665299A AU1665299A AU 1665299 A AU1665299 A AU 1665299A AU 16652/99 A AU16652/99 A AU 16652/99A AU 1665299 A AU1665299 A AU 1665299A AU 1665299 A AU1665299 A AU 1665299A
- Authority
- AU
- Australia
- Prior art keywords
- relates
- structures
- substrates
- substrate
- structured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
Abstract
The invention relates to nanometric structuring and decorating of substrates. The invention especially relates to surface decorated substrates on which ordered nanometric surface structures are deposited, said structures being comprised of metal and/or metal oxide clusters and/or semiconductor clusters. The invention also relates to a method for producing and applying said surface decorated structures in order to epoxidize C3-C8-alkenes or to oxidize CO to CO2, and relates to surface structured substrates, especially Pt, Au, GaAs, InyGaAs, AlxGaAs, Si, SiO2, Ge, SixNy, SixGaAs, InP, InPSi, GaInAsP, glass, graphite, diamond, mica, SrTiO3 or the doped modifications thereof, which are nanometrically structured over macroscopic areas. In addition, the invention relates to a method for the production of said surface structured substrates. The invention is based on the film formation of core shell polymer systems whose core areas are selectively modified or charged with corresponding metal compounds in a solution and construct the structures which are orderly arranged in the thin films. These films which are deposited on the substrate surfaces are selectively etched in such a way that the organic polymer components are completely removed and, as a result, the substrate is decorated in an orderly arrangement by the inorganic residues. The structured films can further serve as masks which make it possible to selectively etch the substrate and to transfer such a structure, said structure given by the film, to the substrate.
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19747815 | 1997-10-29 | ||
DE19747816 | 1997-10-29 | ||
DE19747815A DE19747815A1 (en) | 1997-10-29 | 1997-10-29 | Production of surface-structured substrates used in the manufacture of electronic components |
DE19747816A DE19747816A1 (en) | 1997-10-29 | 1997-10-29 | Production of surface-structured substrates used in the manufacture of electronic components |
DE19843411A DE19843411A1 (en) | 1998-09-19 | 1998-09-19 | Production of surface decorated substrates |
DE19843411 | 1998-09-19 | ||
PCT/EP1998/006874 WO1999021652A2 (en) | 1997-10-29 | 1998-10-29 | Nanostructures |
Publications (1)
Publication Number | Publication Date |
---|---|
AU1665299A true AU1665299A (en) | 1999-05-17 |
Family
ID=27217872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU16652/99A Abandoned AU1665299A (en) | 1997-10-29 | 1998-10-29 | Nanostructures |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1027157B1 (en) |
JP (1) | JP2004500226A (en) |
AT (1) | ATE246542T1 (en) |
AU (1) | AU1665299A (en) |
CA (1) | CA2308302A1 (en) |
DE (1) | DE59809228D1 (en) |
WO (1) | WO1999021652A2 (en) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19952018C1 (en) * | 1999-10-28 | 2001-08-23 | Martin Moeller | Process for the production of substrates decorated in the nanometer range |
AU2001241186A1 (en) * | 2000-03-16 | 2001-09-24 | Matsushita Electric Industrial Co., Ltd. | Method for precisely machining microstructure |
JP4378513B2 (en) * | 2003-05-29 | 2009-12-09 | 独立行政法人理化学研究所 | Metal nanoparticles with support, metal nanoparticle continuum and methods for producing them |
US9107452B2 (en) | 2003-06-13 | 2015-08-18 | Philip Morris Usa Inc. | Catalyst to reduce carbon monoxide in the mainstream smoke of a cigarette |
US7152609B2 (en) | 2003-06-13 | 2006-12-26 | Philip Morris Usa Inc. | Catalyst to reduce carbon monoxide and nitric oxide from the mainstream smoke of a cigarette |
US7243658B2 (en) | 2003-06-13 | 2007-07-17 | Philip Morris Usa Inc. | Nanoscale composite catalyst to reduce carbon monoxide in the mainstream smoke of a cigarette |
US7677254B2 (en) | 2003-10-27 | 2010-03-16 | Philip Morris Usa Inc. | Reduction of carbon monoxide and nitric oxide in smoking articles using iron oxynitride |
US7712471B2 (en) | 2003-10-27 | 2010-05-11 | Philip Morris Usa Inc. | Methods for forming transition metal oxide clusters and smoking articles comprising transition metal oxide clusters |
DE102004043908A1 (en) | 2004-09-10 | 2006-03-30 | GRÄTER, Stefan | Surface-structured polymeric substrates and their preparation |
EP1760527B1 (en) * | 2005-09-05 | 2012-06-06 | DWI an der RWTH Aachen e.V. | Photochemical method for manufacturing nanometrically surface-decorated substrates |
WO2007122998A1 (en) * | 2006-04-19 | 2007-11-01 | Japan Science And Technology Agency | Substrate with microfine metallic lumps arranged on surface |
US7582586B2 (en) * | 2006-08-24 | 2009-09-01 | Toyota Motor Corporation | Supported catalysts with controlled metal cluster size |
DE102007014538A1 (en) * | 2007-03-27 | 2008-10-02 | Carl Zeiss Ag | Method for producing an anti-reflection surface on an optical element and optical elements with an anti-reflection surface |
DE102007017032B4 (en) * | 2007-04-11 | 2011-09-22 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Method for the production of surface size or distance variations in patterns of nanostructures on surfaces |
GB0708695D0 (en) * | 2007-05-04 | 2007-06-13 | Univ Nottingham | Fabrication of nanoparticles |
JP5445991B2 (en) * | 2007-08-09 | 2014-03-19 | 独立行政法人物質・材料研究機構 | Nano-flaked metal composite material, method for producing the same, and surface-enhanced Raman scattering active substrate |
DE102008002193A1 (en) | 2007-08-29 | 2009-03-05 | Carl Zeiss Smt Ag | Optical element i.e. plane-convex lens, for use in projection exposure system for immersion lithography, has water-repellent surface formed in element body, where surface is formed by micro structuring uncoated regions of element body |
JP2009138014A (en) * | 2007-12-03 | 2009-06-25 | Toyota Central R&D Labs Inc | Method for producing nano structure material |
US9637380B2 (en) | 2008-03-31 | 2017-05-02 | Pacific Biosciences Of California, Inc. | Nanoscale apertures having islands of functionality |
JP5396063B2 (en) * | 2008-10-27 | 2014-01-22 | 独立行政法人物質・材料研究機構 | Functional metal composite substrate and manufacturing method thereof |
DE102008058400A1 (en) * | 2008-11-21 | 2010-05-27 | Istituto Italiano Di Tecnologia | Nanowires on substrate surfaces, process for their preparation and their use |
JP5620154B2 (en) * | 2009-10-15 | 2014-11-05 | 公益財団法人神奈川科学技術アカデミー | Hollow micro object and method for producing the same |
DE102009053406A1 (en) | 2009-11-16 | 2011-05-19 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Method for the spatially resolved enlargement of nanoparticles on a substrate surface |
DE102009060223A1 (en) | 2009-12-23 | 2011-06-30 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V., 80539 | Cone-shaped nanostructures on substrate surfaces, in particular optical elements, methods for their production and their use |
WO2011115165A1 (en) * | 2010-03-18 | 2011-09-22 | 株式会社豊田中央研究所 | Nanoheterostructure and method for producing same |
DE102010023490A1 (en) | 2010-06-11 | 2011-12-15 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Three-dimensional metal-covered nanostructures on substrate surfaces, methods for their production and their use |
WO2013007354A1 (en) | 2011-07-08 | 2013-01-17 | Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E.V. | A method for preventing or reducing the production of biofilms formed by microorganisms using nanostructured surfaces |
JP2014529354A (en) * | 2011-07-27 | 2014-11-06 | マックス−プランク−ゲゼルシャフト ツール フェルデルング デア ヴィッセンシャフテン エー. ファオ.Max−Planck−Gesellschaft Zur Foerderung Derwissenschaften E.V. | Substrate surface composed of refractory metal alloy nanoparticles, its preparation method, and its use as a catalyst in particular |
WO2013170866A1 (en) | 2012-05-15 | 2013-11-21 | Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E.V. | Highly ordered arrays of micelles or nanoparticles on a substrate surface and methods for producing the same |
WO2013181007A1 (en) | 2012-05-29 | 2013-12-05 | Corning Incorporated | Method for texturing a glass surface |
JP5943280B2 (en) * | 2012-06-12 | 2016-07-05 | 公立大学法人首都大学東京 | Gold cluster catalyst and method for producing the same |
JP6363482B2 (en) * | 2014-11-28 | 2018-07-25 | トヨタ自動車株式会社 | Exhaust gas purification catalyst and method for producing the same |
EP3130559A1 (en) | 2015-08-14 | 2017-02-15 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | Fabrication of nanostructured substrated comprising a plurality of nanostructure gradients on a single substrate |
EP3415617A1 (en) | 2017-06-16 | 2018-12-19 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | A method and a device for increasing ex vivo expansion of t cells by using adhesive nanostructured surfaces and costimulatory signals |
JP7365069B2 (en) * | 2018-08-16 | 2023-10-19 | ノースウェスタン ユニバーシティ | Multi-element heterostructure nanoparticles and their production method |
EP3867193A4 (en) * | 2018-10-18 | 2022-12-28 | Georgia Tech Research Corporation | Chemical etching methods for fabricating nanostructures |
CN110756821B (en) * | 2019-09-24 | 2020-12-01 | 厦门大学 | Synthetic method for loading nanogold on silicon layer |
DE102022203401A1 (en) | 2022-04-06 | 2023-10-12 | Robert Bosch Gesellschaft mit beschränkter Haftung | Method for cleaning at least one upper side of a substrate |
-
1998
- 1998-10-29 AT AT98961111T patent/ATE246542T1/en active
- 1998-10-29 CA CA002308302A patent/CA2308302A1/en not_active Abandoned
- 1998-10-29 DE DE59809228T patent/DE59809228D1/en not_active Expired - Lifetime
- 1998-10-29 AU AU16652/99A patent/AU1665299A/en not_active Abandoned
- 1998-10-29 JP JP2000517799A patent/JP2004500226A/en active Pending
- 1998-10-29 EP EP98961111A patent/EP1027157B1/en not_active Expired - Lifetime
- 1998-10-29 WO PCT/EP1998/006874 patent/WO1999021652A2/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP1027157A2 (en) | 2000-08-16 |
JP2004500226A (en) | 2004-01-08 |
ATE246542T1 (en) | 2003-08-15 |
CA2308302A1 (en) | 1999-05-06 |
WO1999021652A3 (en) | 1999-07-15 |
WO1999021652A2 (en) | 1999-05-06 |
DE59809228D1 (en) | 2003-09-11 |
EP1027157B1 (en) | 2003-08-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |