ATE531474T1 - System zum einsatz von scannern in einem hochgeschwindigkeits-x/y-bohrsystem - Google Patents

System zum einsatz von scannern in einem hochgeschwindigkeits-x/y-bohrsystem

Info

Publication number
ATE531474T1
ATE531474T1 AT07872717T AT07872717T ATE531474T1 AT E531474 T1 ATE531474 T1 AT E531474T1 AT 07872717 T AT07872717 T AT 07872717T AT 07872717 T AT07872717 T AT 07872717T AT E531474 T1 ATE531474 T1 AT E531474T1
Authority
AT
Austria
Prior art keywords
laser output
laser
target location
axis
scanning unit
Prior art date
Application number
AT07872717T
Other languages
English (en)
Inventor
Adam Pinard
Kurt Pelsue
Felix Stukalin
Original Assignee
Gsi Group Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gsi Group Corp filed Critical Gsi Group Corp
Application granted granted Critical
Publication of ATE531474T1 publication Critical patent/ATE531474T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60—Preliminary treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
AT07872717T 2006-08-22 2007-07-26 System zum einsatz von scannern in einem hochgeschwindigkeits-x/y-bohrsystem ATE531474T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US83921106P 2006-08-22 2006-08-22
PCT/US2007/074391 WO2008091380A2 (en) 2006-08-22 2007-07-26 System and method for employing a resonant scanner in an x-y high speed drilling system

Publications (1)

Publication Number Publication Date
ATE531474T1 true ATE531474T1 (de) 2011-11-15

Family

ID=39645017

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07872717T ATE531474T1 (de) 2006-08-22 2007-07-26 System zum einsatz von scannern in einem hochgeschwindigkeits-x/y-bohrsystem

Country Status (8)

Country Link
US (1) US7817319B2 (de)
EP (1) EP2076354B1 (de)
JP (1) JP5654234B2 (de)
KR (1) KR101511199B1 (de)
CN (1) CN101541470B (de)
AT (1) ATE531474T1 (de)
TW (1) TW200821075A (de)
WO (1) WO2008091380A2 (de)

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TWI686255B (zh) * 2017-11-01 2020-03-01 台灣愛司帝科技股份有限公司 薄型半導體晶圓的切割裝置及其切割方法
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Also Published As

Publication number Publication date
JP5654234B2 (ja) 2015-01-14
WO2008091380A3 (en) 2008-10-16
CN101541470B (zh) 2012-06-20
EP2076354A2 (de) 2009-07-08
KR101511199B1 (ko) 2015-04-10
US7817319B2 (en) 2010-10-19
CN101541470A (zh) 2009-09-23
KR20090045342A (ko) 2009-05-07
JP2010501354A (ja) 2010-01-21
EP2076354B1 (de) 2011-11-02
WO2008091380A2 (en) 2008-07-31
TW200821075A (en) 2008-05-16
US20080049285A1 (en) 2008-02-28

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