ATE529489T1 - Polierzusammensetzung und polierverfahren - Google Patents
Polierzusammensetzung und polierverfahrenInfo
- Publication number
- ATE529489T1 ATE529489T1 AT05822456T AT05822456T ATE529489T1 AT E529489 T1 ATE529489 T1 AT E529489T1 AT 05822456 T AT05822456 T AT 05822456T AT 05822456 T AT05822456 T AT 05822456T AT E529489 T1 ATE529489 T1 AT E529489T1
- Authority
- AT
- Austria
- Prior art keywords
- polishing
- polishing composition
- chemical
- mechanical polishing
- present
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 5
- 238000000034 method Methods 0.000 title 1
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910001413 alkali metal ion Inorganic materials 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 abstract 1
- 230000003628 erosive effect Effects 0.000 abstract 1
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 229940098779 methanesulfonic acid Drugs 0.000 abstract 1
- 239000007800 oxidant agent Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004372101 | 2004-12-22 | ||
PCT/JP2005/024190 WO2006068328A1 (en) | 2004-12-22 | 2005-12-22 | Polishing composition and polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE529489T1 true ATE529489T1 (de) | 2011-11-15 |
Family
ID=38325749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05822456T ATE529489T1 (de) | 2004-12-22 | 2005-12-22 | Polierzusammensetzung und polierverfahren |
Country Status (5)
Country | Link |
---|---|
US (1) | US7901474B2 (de) |
EP (1) | EP1828333B1 (de) |
JP (1) | JP2006203188A (de) |
AT (1) | ATE529489T1 (de) |
WO (1) | WO2006068328A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8592314B2 (en) | 2005-01-24 | 2013-11-26 | Showa Denko K.K. | Polishing composition and polishing method |
JP2008053371A (ja) * | 2006-08-23 | 2008-03-06 | Fujifilm Corp | 半導体デバイスの研磨方法 |
CN101143996A (zh) * | 2006-09-15 | 2008-03-19 | 安集微电子(上海)有限公司 | 用于抛光多晶硅的化学机械抛光液 |
TWI408216B (zh) * | 2007-03-07 | 2013-09-11 | Anji Microelectronics Co Ltd | Application of Polishing Solution in Adjusting Polysilicon / Silica Selectivity Ratio |
US8047899B2 (en) * | 2007-07-26 | 2011-11-01 | Macronix International Co., Ltd. | Pad and method for chemical mechanical polishing |
JP5877940B2 (ja) * | 2010-04-08 | 2016-03-08 | 株式会社フジミインコーポレーテッド | 銅及びシリコンが表面に露出したウェーハの研磨方法 |
TWI605112B (zh) * | 2011-02-21 | 2017-11-11 | Fujimi Inc | 研磨用組成物 |
JP5833435B2 (ja) * | 2011-12-28 | 2015-12-16 | 花王株式会社 | シリコンウエハ用研磨液組成物 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5391258A (en) | 1993-05-26 | 1995-02-21 | Rodel, Inc. | Compositions and methods for polishing |
JP3397501B2 (ja) | 1994-07-12 | 2003-04-14 | 株式会社東芝 | 研磨剤および研磨方法 |
US5920500A (en) | 1996-08-23 | 1999-07-06 | Motorola, Inc. | Magnetic random access memory having stacked memory cells and fabrication method therefor |
JP4092021B2 (ja) | 1998-10-02 | 2008-05-28 | 花王株式会社 | 研磨液組成物 |
JP2000252244A (ja) * | 1998-12-28 | 2000-09-14 | Hitachi Chem Co Ltd | 金属用研磨液及びそれを用いた研磨方法 |
JP4657408B2 (ja) * | 1999-10-13 | 2011-03-23 | 株式会社トクヤマ | 金属膜用研磨剤 |
JP2001115146A (ja) | 1999-10-18 | 2001-04-24 | Tokuyama Corp | バリア膜用研磨剤 |
JP4231950B2 (ja) * | 1999-10-18 | 2009-03-04 | 株式会社トクヤマ | 金属膜用研磨剤 |
JP3450247B2 (ja) * | 1999-12-28 | 2003-09-22 | Necエレクトロニクス株式会社 | 金属配線形成方法 |
JP3736249B2 (ja) | 2000-01-12 | 2006-01-18 | Jsr株式会社 | 半導体装置の製造に用いる化学機械研磨用水系分散体 |
TW572980B (en) * | 2000-01-12 | 2004-01-21 | Jsr Corp | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process |
US6569215B2 (en) * | 2000-04-17 | 2003-05-27 | Showa Denko Kabushiki Kaisha | Composition for polishing magnetic disk substrate |
JP2002170790A (ja) * | 2000-11-30 | 2002-06-14 | Showa Denko Kk | 半導体基板研磨用組成物、半導体配線基板およびその製造方法 |
JP2002249762A (ja) * | 2001-02-27 | 2002-09-06 | Sanyo Chem Ind Ltd | 研磨材用添加剤 |
SG144688A1 (en) * | 2001-07-23 | 2008-08-28 | Fujimi Inc | Polishing composition and polishing method employing it |
JP2002176015A (ja) * | 2001-10-15 | 2002-06-21 | Hitachi Chem Co Ltd | 金属用研磨液及び研磨方法 |
US7097541B2 (en) * | 2002-01-22 | 2006-08-29 | Cabot Microelectronics Corporation | CMP method for noble metals |
JP2004128475A (ja) * | 2002-08-02 | 2004-04-22 | Jsr Corp | 化学機械研磨用水系分散体および半導体装置の製造方法 |
JP4202157B2 (ja) * | 2003-02-28 | 2008-12-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
US8592314B2 (en) * | 2005-01-24 | 2013-11-26 | Showa Denko K.K. | Polishing composition and polishing method |
-
2005
- 2005-12-22 EP EP05822456A patent/EP1828333B1/de not_active Not-in-force
- 2005-12-22 US US11/793,347 patent/US7901474B2/en not_active Expired - Fee Related
- 2005-12-22 AT AT05822456T patent/ATE529489T1/de not_active IP Right Cessation
- 2005-12-22 JP JP2005370599A patent/JP2006203188A/ja active Pending
- 2005-12-22 WO PCT/JP2005/024190 patent/WO2006068328A1/en active Search and Examination
Also Published As
Publication number | Publication date |
---|---|
US20080138990A1 (en) | 2008-06-12 |
WO2006068328A1 (en) | 2006-06-29 |
EP1828333B1 (de) | 2011-10-19 |
JP2006203188A (ja) | 2006-08-03 |
US7901474B2 (en) | 2011-03-08 |
EP1828333A1 (de) | 2007-09-05 |
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Legal Events
Date | Code | Title | Description |
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RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |