ATE527688T1 - Halter für eine elektrische komponente und elektrische vorrichtung mit dem halter und der komponente - Google Patents
Halter für eine elektrische komponente und elektrische vorrichtung mit dem halter und der komponenteInfo
- Publication number
- ATE527688T1 ATE527688T1 AT07788995T AT07788995T ATE527688T1 AT E527688 T1 ATE527688 T1 AT E527688T1 AT 07788995 T AT07788995 T AT 07788995T AT 07788995 T AT07788995 T AT 07788995T AT E527688 T1 ATE527688 T1 AT E527688T1
- Authority
- AT
- Austria
- Prior art keywords
- holder
- melting point
- component
- mass
- electrical
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32153—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
- H01L2224/32175—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic
- H01L2224/32188—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic the layer connector connecting to a bonding area protruding from the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/8322—Applying energy for connecting with energy being in the form of electromagnetic radiation
- H01L2224/83224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01061—Promethium [Pm]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Fuses (AREA)
- Thermistors And Varistors (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Discharging, Photosensitive Material Shape In Electrophotography (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0652117A FR2902277B1 (fr) | 2006-06-13 | 2006-06-13 | Support pour composant electrique et dispositif electrique comprenant le support et le composant |
PCT/FR2007/051429 WO2007144539A2 (fr) | 2006-06-13 | 2007-06-12 | Support pour composant electrique et dispositif electrique comprenant le support et le composant |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE527688T1 true ATE527688T1 (de) | 2011-10-15 |
Family
ID=37758731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07788995T ATE527688T1 (de) | 2006-06-13 | 2007-06-12 | Halter für eine elektrische komponente und elektrische vorrichtung mit dem halter und der komponente |
Country Status (8)
Country | Link |
---|---|
US (1) | US8742259B2 (de) |
EP (1) | EP2030230B1 (de) |
JP (1) | JP5495372B2 (de) |
AT (1) | ATE527688T1 (de) |
ES (1) | ES2374992T3 (de) |
FR (1) | FR2902277B1 (de) |
PL (1) | PL2030230T3 (de) |
WO (1) | WO2007144539A2 (de) |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS558922Y2 (de) * | 1976-02-20 | 1980-02-27 | ||
JPS5949699B2 (ja) * | 1979-08-09 | 1984-12-04 | 三菱電機株式会社 | 半導体装置 |
US4339768A (en) * | 1980-01-18 | 1982-07-13 | Amp Incorporated | Transistors and manufacture thereof |
US5287247A (en) * | 1990-09-21 | 1994-02-15 | Lsi Logic Corporation | Computer system module assembly |
JP3549230B2 (ja) * | 1994-01-11 | 2004-08-04 | 松下電器産業株式会社 | 回路構成体とその製造方法 |
US5975420A (en) * | 1995-04-13 | 1999-11-02 | Dai Nippon Printing Co., Ltd. | Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module |
AU7096696A (en) * | 1995-11-28 | 1997-06-19 | Hitachi Limited | Semiconductor device, process for producing the same, and packaged substrate |
US5825625A (en) * | 1996-05-20 | 1998-10-20 | Hewlett-Packard Company | Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink |
JPH1041436A (ja) | 1996-07-24 | 1998-02-13 | Nippon Micron Kk | 半導体パッケージの製造方法 |
US5892417A (en) * | 1996-12-27 | 1999-04-06 | Motorola Inc. | Saw device package and method |
JP3081168B2 (ja) * | 1997-04-30 | 2000-08-28 | イビデン株式会社 | 電子部品搭載用基板 |
US6407461B1 (en) * | 1997-06-27 | 2002-06-18 | International Business Machines Corporation | Injection molded integrated circuit chip assembly |
US6239976B1 (en) * | 1998-11-24 | 2001-05-29 | Comsense Technologies, Ltd. | Reinforced micromodule |
US6295200B1 (en) * | 2000-02-23 | 2001-09-25 | Motorola, Inc. | Carrier assembly and method |
JP2003023223A (ja) | 2001-07-09 | 2003-01-24 | Hitachi Ltd | 回路用金属基板及び半導体装置 |
JP2003133484A (ja) * | 2001-10-30 | 2003-05-09 | Tokai Rika Co Ltd | 半導体装置及びその製造方法 |
US6906268B2 (en) * | 2001-12-14 | 2005-06-14 | Intel Corporation | Heat-shrinkable retainer for PCB double-sided assembly |
US6861750B2 (en) * | 2002-02-01 | 2005-03-01 | Broadcom Corporation | Ball grid array package with multiple interposers |
US6897562B2 (en) * | 2003-04-11 | 2005-05-24 | Motorola Corporation | Electronic component and method of manufacturing same |
FR2862424B1 (fr) * | 2003-11-18 | 2006-10-20 | Valeo Electronique Sys Liaison | Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif |
-
2006
- 2006-06-13 FR FR0652117A patent/FR2902277B1/fr not_active Expired - Fee Related
-
2007
- 2007-06-12 US US12/308,363 patent/US8742259B2/en active Active
- 2007-06-12 ES ES07788995T patent/ES2374992T3/es active Active
- 2007-06-12 WO PCT/FR2007/051429 patent/WO2007144539A2/fr active Application Filing
- 2007-06-12 JP JP2009514861A patent/JP5495372B2/ja active Active
- 2007-06-12 AT AT07788995T patent/ATE527688T1/de not_active IP Right Cessation
- 2007-06-12 EP EP07788995A patent/EP2030230B1/de active Active
- 2007-06-12 PL PL07788995T patent/PL2030230T3/pl unknown
Also Published As
Publication number | Publication date |
---|---|
EP2030230B1 (de) | 2011-10-05 |
PL2030230T3 (pl) | 2012-03-30 |
US20100157561A1 (en) | 2010-06-24 |
US8742259B2 (en) | 2014-06-03 |
FR2902277A1 (fr) | 2007-12-14 |
WO2007144539A2 (fr) | 2007-12-21 |
FR2902277B1 (fr) | 2008-09-05 |
WO2007144539A3 (fr) | 2008-04-10 |
JP2009540590A (ja) | 2009-11-19 |
ES2374992T3 (es) | 2012-02-23 |
EP2030230A2 (de) | 2009-03-04 |
JP5495372B2 (ja) | 2014-05-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |