ATE458276T1 - Durchsichtige led-anzeigevorrichtung - Google Patents

Durchsichtige led-anzeigevorrichtung

Info

Publication number
ATE458276T1
ATE458276T1 AT05425255T AT05425255T ATE458276T1 AT E458276 T1 ATE458276 T1 AT E458276T1 AT 05425255 T AT05425255 T AT 05425255T AT 05425255 T AT05425255 T AT 05425255T AT E458276 T1 ATE458276 T1 AT E458276T1
Authority
AT
Austria
Prior art keywords
display device
led display
stretches
led sources
conductive paths
Prior art date
Application number
AT05425255T
Other languages
English (en)
Inventor
Piermario Repetto
Sabino Sinesi
Sara Padovani
Stefano Bernard
Denis Bollea
Davide Capello
Alberto Pairetti
Michele Antonipieri
Original Assignee
Fiat Ricerche
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fiat Ricerche filed Critical Fiat Ricerche
Application granted granted Critical
Publication of ATE458276T1 publication Critical patent/ATE458276T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Devices (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
AT05425255T 2005-04-21 2005-04-21 Durchsichtige led-anzeigevorrichtung ATE458276T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05425255A EP1715522B1 (de) 2005-04-21 2005-04-21 Durchsichtige LED-Anzeigevorrichtung

Publications (1)

Publication Number Publication Date
ATE458276T1 true ATE458276T1 (de) 2010-03-15

Family

ID=35058813

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05425255T ATE458276T1 (de) 2005-04-21 2005-04-21 Durchsichtige led-anzeigevorrichtung

Country Status (6)

Country Link
US (1) US7932524B2 (de)
EP (1) EP1715522B1 (de)
JP (2) JP2006301650A (de)
CN (1) CN100514637C (de)
AT (1) ATE458276T1 (de)
DE (1) DE602005019384D1 (de)

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CN106298752A (zh) * 2010-04-15 2017-01-04 西铁城电子株式会社 发光装置
US10158057B2 (en) 2010-10-28 2018-12-18 Corning Incorporated LED lighting devices
TWI457675B (zh) * 2011-08-29 2014-10-21 Au Optronics Corp 畫素結構、液晶顯示面板與透明液晶顯示器
US9202996B2 (en) 2012-11-30 2015-12-01 Corning Incorporated LED lighting devices with quantum dot glass containment plates
KR102096874B1 (ko) * 2012-12-14 2020-04-03 한국전자통신연구원 투명 디스플레이 패널을 이용한 조명 장치 및 조광 제어 방법
CN103107274B (zh) * 2013-02-19 2016-06-08 河北神通光电科技有限公司 一种采用过渡电极实现的led集成封装模块
BR102015027316B1 (pt) 2014-10-31 2021-07-27 Nichia Corporation Dispositivo emissor de luz e sistema de lâmpada frontal de farol de acionamento adaptativo
JP6507729B2 (ja) 2015-03-10 2019-05-08 日本電気硝子株式会社 透明導電膜付ガラス基板及びその製造方法
CN107710424B (zh) * 2015-08-06 2019-07-12 林谊 Led像素点、发光组件、发光面板和显示屏
DE102015215301A1 (de) * 2015-08-11 2017-02-16 Osram Gmbh Leuchtdiodenanordnung und Verfahren zum Herstellen einer Leuchtdiodenanordnung
KR20170131910A (ko) 2016-05-23 2017-12-01 주식회사 루멘스 발광소자 및 이를 포함하는 발광벌브
JP7146748B2 (ja) * 2017-05-15 2022-10-04 ソニーグループ株式会社 照明装置、および表示装置
FR3071033B1 (fr) * 2017-09-12 2021-11-19 Valeo Vision Procede d'obtention d'un dispositif lumineux dont l'aspect eteint est different de l'aspect allume
EP3745386A4 (de) 2018-01-25 2021-10-27 Agc Inc. Durchsichtige anzeigevorrichtung und mit einer durchsichtigen anzeigevorrichtung versehenes verbundglas
DE102018118974A1 (de) * 2018-08-03 2020-02-06 Osram Opto Semiconductors Gmbh Optoelektronische leuchtvorrichtung und verfahren zum steuern einer optoelektronischen leuchtvorrichtung
CN112639936A (zh) * 2018-09-04 2021-04-09 Ａｇｃ株式会社 透明显示装置、带透明显示装置的玻璃板、带透明显示装置的夹层玻璃以及移动体
CN111381372A (zh) * 2018-12-28 2020-07-07 永众科技股份有限公司 穿透式显示设备及增强现实显示器
WO2020196134A1 (ja) * 2019-03-22 2020-10-01 Ａｇｃ株式会社 透明表示装置、透明表示装置付きガラス板、透明表示装置付き合わせガラス、及び移動体
CN114096860B (zh) * 2019-07-16 2024-06-11 Ａｇｃ株式会社 透明传感检测设备、夹层玻璃以及透明传感检测设备的制造方法
WO2024075856A1 (ko) * 2022-10-04 2024-04-11 엘지전자 주식회사 발광 소자를 이용한 투명 디스플레이 장치
CN117038778A (zh) * 2023-08-18 2023-11-10 电子科技大学长三角研究院(衢州) 一种适用于可见光通信的快速、高响应InxGa1-xN光电探测阵列

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Also Published As

Publication number Publication date
EP1715522A1 (de) 2006-10-25
CN100514637C (zh) 2009-07-15
CN1855481A (zh) 2006-11-01
US20060238326A1 (en) 2006-10-26
EP1715522B1 (de) 2010-02-17
US7932524B2 (en) 2011-04-26
DE602005019384D1 (de) 2010-04-01
JP2006301650A (ja) 2006-11-02
JP3169479U (ja) 2011-08-04

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Legal Events

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