ATE434024T1 - Metallische tinte und substrat für eine anzeige und deren fertigungsmethode - Google Patents

Metallische tinte und substrat für eine anzeige und deren fertigungsmethode

Info

Publication number
ATE434024T1
ATE434024T1 AT05101515T AT05101515T ATE434024T1 AT E434024 T1 ATE434024 T1 AT E434024T1 AT 05101515 T AT05101515 T AT 05101515T AT 05101515 T AT05101515 T AT 05101515T AT E434024 T1 ATE434024 T1 AT E434024T1
Authority
AT
Austria
Prior art keywords
ink jet
conductive lines
ink
metal
substrate
Prior art date
Application number
AT05101515T
Other languages
English (en)
Inventor
Andreas Dr Klyszcz
Marcus Schaedig
Werner Dr Humbs
Original Assignee
Samsung Sdi Germany Gmbh
Samsung Sdi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Sdi Germany Gmbh, Samsung Sdi Co Ltd filed Critical Samsung Sdi Germany Gmbh
Application granted granted Critical
Publication of ATE434024T1 publication Critical patent/ATE434024T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Chemically Coating (AREA)
AT05101515T 2005-02-28 2005-02-28 Metallische tinte und substrat für eine anzeige und deren fertigungsmethode ATE434024T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05101515A EP1696006B1 (de) 2005-02-28 2005-02-28 Metallische Tinte und Substrat für eine Anzeige und deren Fertigungsmethode

Publications (1)

Publication Number Publication Date
ATE434024T1 true ATE434024T1 (de) 2009-07-15

Family

ID=34938839

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05101515T ATE434024T1 (de) 2005-02-28 2005-02-28 Metallische tinte und substrat für eine anzeige und deren fertigungsmethode

Country Status (5)

Country Link
EP (1) EP1696006B1 (de)
KR (1) KR100968429B1 (de)
CN (1) CN1869134A (de)
AT (1) ATE434024T1 (de)
DE (1) DE602005014933D1 (de)

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KR100768341B1 (ko) * 2005-11-09 2007-10-17 주식회사 나노신소재 금속성 잉크, 그리고 이를 이용한 전극형성방법 및 기판
US20080070146A1 (en) 2006-09-15 2008-03-20 Cabot Corporation Hydrophobic-treated metal oxide
US8435474B2 (en) 2006-09-15 2013-05-07 Cabot Corporation Surface-treated metal oxide particles
US8202502B2 (en) * 2006-09-15 2012-06-19 Cabot Corporation Method of preparing hydrophobic silica
US8455165B2 (en) 2006-09-15 2013-06-04 Cabot Corporation Cyclic-treated metal oxide
KR100850771B1 (ko) 2007-02-21 2008-08-06 연세대학교 산학협력단 나노금속잉크 제조방법
KR100935168B1 (ko) * 2007-09-21 2010-01-06 삼성전기주식회사 비수계 전도성 나노잉크 조성물
US20090191356A1 (en) * 2008-01-28 2009-07-30 Hee Hyun Lee Method for forming a thin layer of particulate on a substrate
KR100979515B1 (ko) * 2008-04-03 2010-09-02 (주) 파루 롤투롤 인쇄방식을 이용한 ｒｆ 인쇄 정류기
DE102008045148A1 (de) * 2008-09-01 2010-03-04 Allgemeine Gold- Und Silberscheideanstalt Aktiengesellschaft Silberkatalysator zur Formaldehyd-Herstellung
CN104672991B (zh) * 2013-11-26 2017-07-04 比亚迪股份有限公司 一种铜导电墨水的制备方法
US10280506B2 (en) 2014-03-18 2019-05-07 3D-Oxides Deposition process based on stencil mask and application to the fabrication of tags supporting multi-functional traceable codes
CN107113982B (zh) * 2014-12-25 2020-04-10 住友电气工业株式会社 印刷配线板用基板、制作印刷配线板用基板的方法、印刷配线板、制作印刷配线板的方法以及树脂基材
KR102407539B1 (ko) * 2015-08-26 2022-06-13 엘지디스플레이 주식회사 하드코팅층, 이의 제조 방법 및 이를 포함하는 표시장치
CN114763441A (zh) * 2021-05-27 2022-07-19 上海博耳精细化学有限公司 一种消杂散光油墨及其应用

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US4415624A (en) * 1981-07-06 1983-11-15 Rca Corporation Air-fireable thick film inks
JPS59170167A (ja) * 1983-03-16 1984-09-26 Daito Kasei Kogyo Kk 筆記具用金銀インキ
US4518833A (en) * 1983-07-18 1985-05-21 Gates Data Products, Inc. Conductive elastomeric ink composition
US4722853A (en) * 1985-08-12 1988-02-02 Raychem Corporation Method of printing a polymer thick film ink
US4670351A (en) * 1986-02-12 1987-06-02 General Electric Company Flexible printed circuits, prepared by augmentation replacement process
JP2624097B2 (ja) * 1992-09-17 1997-06-25 信越化学工業株式会社 耐油脂性導電インク組成物及び接点部材
US5514451A (en) * 1995-01-27 1996-05-07 David Sarnoff Research Center, Inc. Conductive via fill inks for ceramic multilayer circuit boards on support substrates
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CA2445877C (en) 2001-04-30 2006-12-19 Postech Foundation Colloid solution of metal nanoparticles, metal-polymer nanocomposites and methods for preparation thereof
JP2003133691A (ja) 2001-10-22 2003-05-09 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体
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JP4042497B2 (ja) * 2002-04-15 2008-02-06 セイコーエプソン株式会社 導電膜パターンの形成方法、配線基板、電子デバイス、電子機器、並びに非接触型カード媒体
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JP2004055298A (ja) * 2002-07-18 2004-02-19 Catalysts & Chem Ind Co Ltd 透明導電性被膜形成用塗布液、および透明導電性被膜付基材、表示装置
JP4264927B2 (ja) 2002-08-26 2009-05-20 株式会社日立プラズマパテントライセンシング 薄型表示装置用基板の製造方法
JP2004207659A (ja) 2002-12-26 2004-07-22 Sumitomo Rubber Ind Ltd 回路の製造方法および該回路を備えた回路板
TWI265762B (en) * 2003-01-14 2006-11-01 Sharp Kk Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof
US7211205B2 (en) * 2003-01-29 2007-05-01 Parelec, Inc. High conductivity inks with improved adhesion

Also Published As

Publication number Publication date
CN1869134A (zh) 2006-11-29
EP1696006B1 (de) 2009-06-17
EP1696006A1 (de) 2006-08-30
DE602005014933D1 (de) 2009-07-30
KR100968429B1 (ko) 2010-07-07
KR20060095427A (ko) 2006-08-31

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