WO2008099594A1 - 多層セラミック基板とその製造方法 - Google Patents
多層セラミック基板とその製造方法 Download PDFInfo
- Publication number
- WO2008099594A1 WO2008099594A1 PCT/JP2008/000198 JP2008000198W WO2008099594A1 WO 2008099594 A1 WO2008099594 A1 WO 2008099594A1 JP 2008000198 W JP2008000198 W JP 2008000198W WO 2008099594 A1 WO2008099594 A1 WO 2008099594A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ceramic substrate
- multilayer ceramic
- external electrode
- producing
- same
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 title abstract 2
- 239000002241 glass-ceramic Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 230000003628 erosive effect Effects 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 229910052809 inorganic oxide Inorganic materials 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 238000007665 sagging Methods 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3411—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
- C03C2217/44—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the composition of the continuous phase
- C03C2217/45—Inorganic continuous phases
- C03C2217/452—Glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
- C03C2217/46—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase
- C03C2217/47—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase consisting of a specific material
- C03C2217/475—Inorganic materials
- C03C2217/479—Metals
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/365—Coating different sides of a glass substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
ガラスセラミック(2a)と、その表面上に形成された外部電極(4)とを備えた多層セラミック基板(5)において、外部電極はAg、Au、Pt及びPdのうちの少なくとも一種を主成分とする導電性材料と、Bi、Cu、Ge、Mn、Ti、Zn元素のうち少なくとも一種の元素を含有し、かつ外部電極の表面に無機酸化物粒子(6)が設けられている。耐湿試験後もしくはめっき後の接着強度を確保し、かつ、めっきダレ、半田食われを抑制する。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/523,813 US20100089624A1 (en) | 2007-02-16 | 2008-02-12 | Multilayer ceramic substrate and process for producing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-036081 | 2007-02-16 | ||
JP2007036081A JP2008204980A (ja) | 2007-02-16 | 2007-02-16 | 多層セラミック基板とその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008099594A1 true WO2008099594A1 (ja) | 2008-08-21 |
Family
ID=39689842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/000198 WO2008099594A1 (ja) | 2007-02-16 | 2008-02-12 | 多層セラミック基板とその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20100089624A1 (ja) |
JP (1) | JP2008204980A (ja) |
WO (1) | WO2008099594A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103601501A (zh) * | 2013-10-29 | 2014-02-26 | 中国电子科技集团公司第五十五研究所 | 一种采用混合导体结构的低温共烧陶瓷的方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8882983B2 (en) * | 2008-06-10 | 2014-11-11 | The Research Foundation For The State University Of New York | Embedded thin films |
WO2011083843A1 (ja) * | 2010-01-08 | 2011-07-14 | 株式会社村田製作所 | サーミスタ及びその製造方法 |
JP6151784B2 (ja) * | 2013-07-29 | 2017-06-21 | 京セラ株式会社 | 配線基板、リード付き配線基板および電子装置 |
US11099082B2 (en) * | 2015-10-28 | 2021-08-24 | Kyocera Corporation | Sensor substrate and detection module |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02105594A (ja) * | 1988-10-14 | 1990-04-18 | Asahi Glass Co Ltd | 導体ペースト及び多層のセラミックス基板 |
JPH04329691A (ja) * | 1991-05-01 | 1992-11-18 | Tdk Corp | 導体ぺーストおよび配線基板 |
JP2002016361A (ja) * | 2000-06-26 | 2002-01-18 | Sumitomo Metal Electronics Devices Inc | ガラスセラミック回路基板の製造方法 |
JP2003046239A (ja) * | 2001-07-27 | 2003-02-14 | Kyocera Corp | 多層配線基板およびその製造方法 |
JP2003204168A (ja) * | 2001-10-29 | 2003-07-18 | Matsushita Electric Ind Co Ltd | 多層セラミック基板およびその製造方法 |
JP2005159038A (ja) * | 2003-11-26 | 2005-06-16 | Kyocera Corp | 低温焼成セラミック基板の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4517156A (en) * | 1980-05-20 | 1985-05-14 | The Foundation: The Research Institute Of Electric And Magnetic Alloys | Electrical resistant alloys having a small temperature dependence of electric resistance over a wide temperature range and a method of producing the same |
US6413620B1 (en) * | 1999-06-30 | 2002-07-02 | Kyocera Corporation | Ceramic wiring substrate and method of producing the same |
US6762369B2 (en) * | 2001-10-29 | 2004-07-13 | Matsushita Electric Industrial Co., Ltd. | Multilayer ceramic substrate and method for manufacturing the same |
-
2007
- 2007-02-16 JP JP2007036081A patent/JP2008204980A/ja active Pending
-
2008
- 2008-02-12 WO PCT/JP2008/000198 patent/WO2008099594A1/ja active Application Filing
- 2008-02-12 US US12/523,813 patent/US20100089624A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02105594A (ja) * | 1988-10-14 | 1990-04-18 | Asahi Glass Co Ltd | 導体ペースト及び多層のセラミックス基板 |
JPH04329691A (ja) * | 1991-05-01 | 1992-11-18 | Tdk Corp | 導体ぺーストおよび配線基板 |
JP2002016361A (ja) * | 2000-06-26 | 2002-01-18 | Sumitomo Metal Electronics Devices Inc | ガラスセラミック回路基板の製造方法 |
JP2003046239A (ja) * | 2001-07-27 | 2003-02-14 | Kyocera Corp | 多層配線基板およびその製造方法 |
JP2003204168A (ja) * | 2001-10-29 | 2003-07-18 | Matsushita Electric Ind Co Ltd | 多層セラミック基板およびその製造方法 |
JP2005159038A (ja) * | 2003-11-26 | 2005-06-16 | Kyocera Corp | 低温焼成セラミック基板の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103601501A (zh) * | 2013-10-29 | 2014-02-26 | 中国电子科技集团公司第五十五研究所 | 一种采用混合导体结构的低温共烧陶瓷的方法 |
Also Published As
Publication number | Publication date |
---|---|
US20100089624A1 (en) | 2010-04-15 |
JP2008204980A (ja) | 2008-09-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2008099594A1 (ja) | 多層セラミック基板とその製造方法 | |
TW200701275A (en) | Ceramic electronic component and manufacturing method thereof | |
MY167229A (en) | Metal Material for Electronic Component and Method for Manufacturing the Same | |
WO2009021233A3 (en) | Pcb droplet actuator fabrication | |
WO2006001882A3 (en) | Lead-free and cadmium-free conductive copper thick film pastes | |
TW201129995A (en) | Conductive paste compound for external electrode, multilayer ceramic capacitor including the same, and manufacturing method thereof | |
KR101670980B1 (ko) | 적층 세라믹 전자부품 | |
CN100511507C (zh) | 陶瓷电子零件及其制造方法 | |
TWI663144B (zh) | 在陶瓷基材上做導電鍍金屬層的方法 | |
WO2006131912A3 (en) | Microelectrode, applications thereof and method of manufacturing | |
CN102483978A (zh) | 热敏电阻及其制造方法 | |
WO2008123259A1 (ja) | 可動接点部品用銀被覆材およびその製造方法 | |
WO2008069832A3 (en) | Creating reliable via contacts for interconnect applications | |
EP2270872A3 (en) | Paste for solar cell electrode, solar cell electrode manufacturing method, and solar cell | |
TW201346960A (zh) | 電子零件及電子零件與接合對象物之接合結構體之形成方法 | |
CN103380467B (zh) | 电子元器件的安装结构 | |
TWI319776B (en) | Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate | |
EP2453635A3 (en) | Portable terminal and method for manufacturing the same | |
WO2010040016A3 (en) | Nickel-gold plateable thick film silver paste, and plating process for low temperature co fired ceramic devices and ltcc devices made therefrom | |
WO2007098050A3 (en) | Anti-biocontaminant products and processes for making the same | |
WO2009005041A1 (ja) | 耐フレッティング性コネクタおよびその製造方法 | |
CN108473379A (zh) | 结合有金属或金属杂化箔的厚膜糊居间的陶瓷 | |
EP1871826A4 (en) | SURFACE GRAFT MATERIAL AND MANUFACTURING METHOD THEREOF, ELECTRICALLY CONDUCTIVE MATERIAL, METHOD FOR MANUFACTURING THE SAME, AND MATERIAL WITH ELECTRICALLY CONDUCTIVE PATTERN | |
JP2021176202A (ja) | セラミック基板及び電子部品内蔵モジュール | |
CN103380492B (zh) | 电子元器件的安装结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08710352 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12523813 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08710352 Country of ref document: EP Kind code of ref document: A1 |