ATE431968T1 - Verfahren zur einkapselung von einem photovoltaischen modul mittels eines einkapselungsmaterials - Google Patents

Verfahren zur einkapselung von einem photovoltaischen modul mittels eines einkapselungsmaterials

Info

Publication number
ATE431968T1
ATE431968T1 AT00105318T AT00105318T ATE431968T1 AT E431968 T1 ATE431968 T1 AT E431968T1 AT 00105318 T AT00105318 T AT 00105318T AT 00105318 T AT00105318 T AT 00105318T AT E431968 T1 ATE431968 T1 AT E431968T1
Authority
AT
Austria
Prior art keywords
encapsulating
photovoltaic module
heated
diaphragm
encapsulating materials
Prior art date
Application number
AT00105318T
Other languages
English (en)
Inventor
Takayuki Suzuki
Hideo Yamagishi
Masataka Kondo
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP16078699A external-priority patent/JP4347454B2/ja
Priority claimed from JP11160787A external-priority patent/JP2000349313A/ja
Priority claimed from JP11229829A external-priority patent/JP2001053306A/ja
Priority claimed from JP11229828A external-priority patent/JP2001053325A/ja
Application filed by Kaneka Corp filed Critical Kaneka Corp
Application granted granted Critical
Publication of ATE431968T1 publication Critical patent/ATE431968T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/048Encapsulation of modules
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1089Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092All laminae planar and face to face
    • Y10T156/1093All laminae planar and face to face with covering of discrete laminae with additional lamina
    • Y10T156/1095Opposed laminae are running length webs
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1089Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092All laminae planar and face to face
    • Y10T156/1097Lamina is running length web

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Photovoltaic Devices (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
AT00105318T 1999-06-08 2000-03-16 Verfahren zur einkapselung von einem photovoltaischen modul mittels eines einkapselungsmaterials ATE431968T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP16078699A JP4347454B2 (ja) 1999-06-08 1999-06-08 太陽電池モジュールの封止方法
JP11160787A JP2000349313A (ja) 1999-06-08 1999-06-08 太陽電池モジュールの封止部材及び封止方法
JP11229829A JP2001053306A (ja) 1999-08-16 1999-08-16 太陽電池モジュール、およびこの太陽電池モジュールの製造方法
JP11229828A JP2001053325A (ja) 1999-08-16 1999-08-16 太陽電池モジュール、およびこの太陽電池モジュールの製造方法

Publications (1)

Publication Number Publication Date
ATE431968T1 true ATE431968T1 (de) 2009-06-15

Family

ID=27473698

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00105318T ATE431968T1 (de) 1999-06-08 2000-03-16 Verfahren zur einkapselung von einem photovoltaischen modul mittels eines einkapselungsmaterials

Country Status (6)

Country Link
US (1) US6380025B1 (de)
EP (1) EP1059675B1 (de)
AT (1) ATE431968T1 (de)
AU (1) AU770820B2 (de)
DE (1) DE60042226D1 (de)
ES (1) ES2326587T3 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4401649B2 (ja) * 2002-12-13 2010-01-20 キヤノン株式会社 太陽電池モジュールの製造方法
TW200642103A (en) * 2005-03-31 2006-12-01 Sanyo Electric Co Solar battery module
JP2007067203A (ja) * 2005-08-31 2007-03-15 Sanyo Electric Co Ltd 太陽電池モジュールおよび太陽電池モジュールの製造方法
JP2008047765A (ja) 2006-08-18 2008-02-28 Npc Inc ラミネート装置
JP2008126407A (ja) 2006-11-16 2008-06-05 Npc Inc ラミネート装置
KR100971658B1 (ko) * 2008-01-03 2010-07-22 엘지전자 주식회사 실리콘 태양전지의 텍스처링 방법
WO2010126699A2 (en) 2009-04-29 2010-11-04 Hunter Douglas Industries B.V. Architectural panels with organic photovoltaic interlayers and methods of forming the same
TWI404218B (zh) * 2009-08-14 2013-08-01 Nexpower Technology Corp A thin film solar cell module capable of improving contact between front and rear electrodes, and a method of manufacturing the same
JP2011060811A (ja) * 2009-09-07 2011-03-24 Sanyo Electric Co Ltd 太陽電池モジュール及びその製造方法
KR101420031B1 (ko) * 2010-02-15 2014-07-16 데쿠세리아루즈 가부시키가이샤 박막형 태양 전지 모듈의 제조 방법
EP2481558B1 (de) * 2011-01-31 2016-06-22 AIRBUS HELICOPTERS DEUTSCHLAND GmbH Verfahren zur herstellung einer vorimprägnierten vorform
JP5838321B2 (ja) * 2011-05-27 2016-01-06 パナソニックIpマネジメント株式会社 太陽電池モジュールの製造方法
WO2013005742A1 (ja) * 2011-07-04 2013-01-10 日清紡ホールディングス株式会社 ダイアフラムシート、ダイアフラムシートを用いた太陽電池モジュール製造方法、太陽電池モジュール製造用のラミネート装置を用いたラミネート方法
CN104269368A (zh) * 2014-08-29 2015-01-07 沈阳拓荆科技有限公司 一种利用前端模块为晶圆加热的装置及方法
CN111081817A (zh) * 2019-12-26 2020-04-28 吕晨康 一种太阳能电池板组件层压敷设装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5854682A (ja) * 1981-09-29 1983-03-31 Nec Corp 太陽電池素子用積層接着装置
US5098498A (en) * 1989-10-10 1992-03-24 Manville Corporation Apparatus and method for encapsulating contoured articles
JP2693032B2 (ja) * 1990-10-16 1997-12-17 キヤノン株式会社 半導体層の形成方法及びこれを用いる太陽電池の製造方法
US5273608A (en) * 1990-11-29 1993-12-28 United Solar Systems Corporation Method of encapsulating a photovoltaic device
US5593532A (en) * 1993-06-11 1997-01-14 Isovolta Osterreichische Isolierstoffwerke Aktiengesellschaft Process for manufacturing photovoltaic modules
CN1112734C (zh) * 1993-09-30 2003-06-25 佳能株式会社 具有三层结构表面覆盖材料的太阳能电池组件
JP2915327B2 (ja) * 1995-07-19 1999-07-05 キヤノン株式会社 太陽電池モジュール及びその製造方法
US5733382A (en) * 1995-12-18 1998-03-31 Hanoka; Jack I. Solar cell modules and method of making same
US6093757A (en) * 1995-12-19 2000-07-25 Midwest Research Institute Composition and method for encapsulating photovoltaic devices
JP3825843B2 (ja) * 1996-09-12 2006-09-27 キヤノン株式会社 太陽電池モジュール
JP3759257B2 (ja) * 1996-09-20 2006-03-22 株式会社エヌ・ピー・シー ラミネート方法

Also Published As

Publication number Publication date
AU2237700A (en) 2000-12-14
US6380025B1 (en) 2002-04-30
AU770820B2 (en) 2004-03-04
DE60042226D1 (de) 2009-07-02
EP1059675B1 (de) 2009-05-20
ES2326587T3 (es) 2009-10-15
EP1059675A2 (de) 2000-12-13
EP1059675A3 (de) 2004-09-22

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