ATE386257T1 - Integrierte schaltung mit temperaturerkennungsschaltung und verfahren zur kalibrierung der temperaturerkennungsschaltung - Google Patents

Integrierte schaltung mit temperaturerkennungsschaltung und verfahren zur kalibrierung der temperaturerkennungsschaltung

Info

Publication number
ATE386257T1
ATE386257T1 AT05256839T AT05256839T ATE386257T1 AT E386257 T1 ATE386257 T1 AT E386257T1 AT 05256839 T AT05256839 T AT 05256839T AT 05256839 T AT05256839 T AT 05256839T AT E386257 T1 ATE386257 T1 AT E386257T1
Authority
AT
Austria
Prior art keywords
temperature detection
detection circuit
integrated circuit
calibration
input signal
Prior art date
Application number
AT05256839T
Other languages
English (en)
Inventor
Melia F Gordon
Charles Ray Johns
Hiroki Kihara
Iwao Takiguchi
Tetsuji Tamura
Michael Fan Wang
Kazuaki Yazawa
Munehiro Yoshida
Original Assignee
Sony Computer Entertainment Inc
Toshiba Kk
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Computer Entertainment Inc, Toshiba Kk, Ibm filed Critical Sony Computer Entertainment Inc
Application granted granted Critical
Publication of ATE386257T1 publication Critical patent/ATE386257T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K15/00—Testing or calibrating of thermometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31704—Design for test; Design verification
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31908—Tester set-up, e.g. configuring the tester to the device under test [DUT], down loading test patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AT05256839T 2004-11-05 2005-11-04 Integrierte schaltung mit temperaturerkennungsschaltung und verfahren zur kalibrierung der temperaturerkennungsschaltung ATE386257T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/982,019 US7102417B2 (en) 2004-11-05 2004-11-05 Integrated circuit die including a temperature detection circuit, and system and methods for calibrating the temperature detection circuit

Publications (1)

Publication Number Publication Date
ATE386257T1 true ATE386257T1 (de) 2008-03-15

Family

ID=35724322

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05256839T ATE386257T1 (de) 2004-11-05 2005-11-04 Integrierte schaltung mit temperaturerkennungsschaltung und verfahren zur kalibrierung der temperaturerkennungsschaltung

Country Status (6)

Country Link
US (1) US7102417B2 (de)
EP (1) EP1655591B1 (de)
JP (1) JP4279825B2 (de)
CN (1) CN100454542C (de)
AT (1) ATE386257T1 (de)
DE (1) DE602005004720T2 (de)

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US7842044B2 (en) * 2003-12-17 2010-11-30 Depuy Spine, Inc. Instruments and methods for bone anchor engagement and spinal rod reduction
US7826998B1 (en) * 2004-11-19 2010-11-02 Cypress Semiconductor Corporation System and method for measuring the temperature of a device
US20060192597A1 (en) * 2005-02-04 2006-08-31 Johns Charles R Temperature sensing circuits, and temperature detection circuits including same
US7356716B2 (en) * 2005-02-24 2008-04-08 International Business Machines Corporation System and method for automatic calibration of a reference voltage
US20060229839A1 (en) * 2005-03-29 2006-10-12 United Memories, Inc. Colorado Springs Temperature sensing and monitoring technique for integrated circuit devices
US7590473B2 (en) * 2006-02-16 2009-09-15 Intel Corporation Thermal management using an on-die thermal sensor
US7603249B1 (en) * 2006-04-19 2009-10-13 Darryl Walker Semiconductor device having variable parameter selection based on temperature and test method
US7642809B2 (en) * 2007-02-06 2010-01-05 Rapid Bridge Llc Die apparatus having configurable input/output and control method thereof
KR100816150B1 (ko) * 2007-02-14 2008-03-21 주식회사 하이닉스반도체 온도 감지 장치
TWI355484B (en) * 2007-12-14 2012-01-01 Ind Tech Res Inst Apparatus and method for measuring character and c
US8615205B2 (en) 2007-12-18 2013-12-24 Qualcomm Incorporated I-Q mismatch calibration and method
US8075178B2 (en) * 2008-02-11 2011-12-13 Zentrum Mikroelektronic Desden AG Circuit arrangement to adjust and calibrate a MEMS-sensor device for flow measurement of gases or liquids
US8449173B1 (en) * 2008-04-10 2013-05-28 Google Inc. Method and system for thermal testing of computing system components
US8970272B2 (en) 2008-05-15 2015-03-03 Qualcomm Incorporated High-speed low-power latches
US8712357B2 (en) * 2008-11-13 2014-04-29 Qualcomm Incorporated LO generation with deskewed input oscillator signal
US8718574B2 (en) 2008-11-25 2014-05-06 Qualcomm Incorporated Duty cycle adjustment for a local oscillator signal
US8847638B2 (en) 2009-07-02 2014-09-30 Qualcomm Incorporated High speed divide-by-two circuit
US8791740B2 (en) 2009-07-16 2014-07-29 Qualcomm Incorporated Systems and methods for reducing average current consumption in a local oscillator path
CN101995301B (zh) * 2009-08-20 2012-08-01 上海华虹Nec电子有限公司 集成电路温度检测电路及其校准方法
US20110169551A1 (en) * 2010-01-08 2011-07-14 Stanescu Cornel D Temperature sensor and method
KR101132795B1 (ko) * 2010-02-25 2012-04-02 주식회사 하이닉스반도체 온도센서
US8854098B2 (en) 2011-01-21 2014-10-07 Qualcomm Incorporated System for I-Q phase mismatch detection and correction
US8734006B2 (en) 2011-03-02 2014-05-27 International Business Machines Corporation Calibration of an on-die thermal sensor
CN102779555A (zh) * 2011-05-13 2012-11-14 英特格灵芯片(天津)有限公司 用于校准模拟集成电路的方法和装置
US9927266B2 (en) * 2012-02-27 2018-03-27 Nxp Usa, Inc. Multi-chip device with temperature control element for temperature calibration
US9154077B2 (en) 2012-04-12 2015-10-06 Qualcomm Incorporated Compact high frequency divider
WO2014094901A1 (en) 2012-12-21 2014-06-26 Telefonaktiebolaget L M Ericsson (Publ) An electronic load module and a method and a system therefor
CN103698691B (zh) * 2013-12-27 2016-08-17 珠海银隆电器有限公司 电动汽车网桥板自动检测校准方法
US9958339B2 (en) * 2014-02-07 2018-05-01 Boston Scientific Neuromodulation Corporation Temperature sensing circuitry for an implantable medical device
US9939330B2 (en) 2014-03-28 2018-04-10 Darryl G. Walker Semiconductor device having subthreshold operating circuits including a back body bias potential based on temperature range
US20160054378A1 (en) 2014-08-20 2016-02-25 Darryl G. Walker Testing and setting performance parameters in a semiconductor device and method therefor
US9613719B1 (en) 2015-02-17 2017-04-04 Darryl G. Walker Multi-chip non-volatile semiconductor memory package including heater and sensor elements
CN109932630B (zh) * 2017-12-15 2021-08-03 朋程科技股份有限公司 过温度检测电路及其测试方法
CN110954248B (zh) * 2019-12-26 2021-05-07 上海贝岭股份有限公司 具有自动校准功能的温度传感器及校准方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5781075A (en) 1996-11-01 1998-07-14 Motorola, Inc. Temperature sensing apparatus
US6283628B1 (en) 1998-09-11 2001-09-04 Airpax Corporation, Llc Intelligent input/output temperature sensor and calibration method therefor
SE517457C2 (sv) * 2000-08-29 2002-06-11 Ericsson Telefon Ab L M Metod och anordning för bakgrundskalibrering av A/D- omvandlare
JP3721119B2 (ja) * 2001-11-08 2005-11-30 株式会社東芝 温度センサ
JP4101590B2 (ja) * 2002-08-30 2008-06-18 エスアイアイ・ナノテクノロジー株式会社 熱分析装置
US7042301B2 (en) 2002-10-15 2006-05-09 Marvell International Ltd. Crystal oscillator emulator

Also Published As

Publication number Publication date
DE602005004720D1 (de) 2008-03-27
EP1655591A1 (de) 2006-05-10
JP4279825B2 (ja) 2009-06-17
JP2006133228A (ja) 2006-05-25
CN100454542C (zh) 2009-01-21
US20060097757A1 (en) 2006-05-11
DE602005004720T2 (de) 2009-02-12
CN1815737A (zh) 2006-08-09
US7102417B2 (en) 2006-09-05
EP1655591B1 (de) 2008-02-13

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