ATE373410T1 - Verfahren zum löten von elektronischen bauelementen mit löthöckern auf ein substrat - Google Patents

Verfahren zum löten von elektronischen bauelementen mit löthöckern auf ein substrat

Info

Publication number
ATE373410T1
ATE373410T1 AT05752868T AT05752868T ATE373410T1 AT E373410 T1 ATE373410 T1 AT E373410T1 AT 05752868 T AT05752868 T AT 05752868T AT 05752868 T AT05752868 T AT 05752868T AT E373410 T1 ATE373410 T1 AT E373410T1
Authority
AT
Austria
Prior art keywords
disposing
soldering
substrate
electronic component
solder bump
Prior art date
Application number
AT05752868T
Other languages
English (en)
Inventor
Tadahiko Sakai
Tadashi Maeda
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Application granted granted Critical
Publication of ATE373410T1 publication Critical patent/ATE373410T1/de

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
AT05752868T 2004-06-24 2005-06-21 Verfahren zum löten von elektronischen bauelementen mit löthöckern auf ein substrat ATE373410T1 (de)

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JP2004320233A JP4093223B2 (ja) 2004-06-24 2004-11-04 半田付方法

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JP (1) JP4093223B2 (de)
KR (1) KR100661332B1 (de)
CN (1) CN100479636C (de)
AT (2) ATE373410T1 (de)
DE (2) DE602005002447T2 (de)
MY (1) MY138108A (de)
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JP4750079B2 (ja) * 2007-06-19 2011-08-17 パナソニック株式会社 部品実装装置
KR101711497B1 (ko) * 2010-10-29 2017-03-02 삼성전자주식회사 반도체 칩 실장 장치

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Publication number Priority date Publication date Assignee Title
US5439162A (en) * 1993-06-28 1995-08-08 Motorola, Inc. Direct chip attachment structure and method
KR100268632B1 (ko) * 1996-03-08 2000-10-16 야마구치 다케시 범프형성방법 및 장치
JP3304854B2 (ja) * 1997-11-07 2002-07-22 松下電器産業株式会社 半田バンプ形成方法
JP3381601B2 (ja) * 1998-01-26 2003-03-04 松下電器産業株式会社 バンプ付電子部品の実装方法
JP3565028B2 (ja) 1998-07-16 2004-09-15 松下電器産業株式会社 転写用の金属ペーストおよびバンプ形成方法
JP3565047B2 (ja) * 1998-10-07 2004-09-15 松下電器産業株式会社 半田バンプの形成方法および半田バンプの実装方法
JP2000228575A (ja) * 1999-02-05 2000-08-15 Matsushita Electric Ind Co Ltd フラックスの転写装置および転写方法
US6706975B2 (en) * 2000-07-13 2004-03-16 Ngk Spark Plug Co., Ltd. Paste for filling throughhole and printed wiring board using same
JP2002224884A (ja) * 2001-01-29 2002-08-13 Tdk Corp 半田付け用フラックス及びこれを用いた半田バンプの形成方法
JP4659262B2 (ja) * 2001-05-01 2011-03-30 富士通セミコンダクター株式会社 電子部品の実装方法及びペースト材料
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
JP3597810B2 (ja) 2001-10-10 2004-12-08 富士通株式会社 はんだペーストおよび接続構造

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CN100479636C (zh) 2009-04-15
US7568610B2 (en) 2009-08-04
EP1685751B1 (de) 2007-09-12
EP1705971B1 (de) 2007-10-31
KR100661332B1 (ko) 2006-12-27
CN1771769A (zh) 2006-05-10
MY138108A (en) 2009-04-30
EP1685751A1 (de) 2006-08-02
DE602005003102D1 (de) 2007-12-13
ATE377345T1 (de) 2007-11-15
EP1705971A2 (de) 2006-09-27
TWI297584B (en) 2008-06-01
EP1705971A3 (de) 2006-12-20
DE602005002447D1 (de) 2007-10-25
JP4093223B2 (ja) 2008-06-04
DE602005002447T2 (de) 2008-01-03
KR20060059878A (ko) 2006-06-02
JP2006041461A (ja) 2006-02-09
WO2006001402A1 (en) 2006-01-05
US20050284921A1 (en) 2005-12-29
DE602005003102T2 (de) 2008-02-14
TW200603700A (en) 2006-01-16

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