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Priority claimed from US11/009,436external-prioritypatent/US7410824B2/en
Application filed by Stats Chippac LtdfiledCriticalStats Chippac Ltd
Publication of SG144139A1publicationCriticalpatent/SG144139A1/en
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/013—Alloys
H01L2924/014—Solder alloys
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Electric Connection Of Electric Components To Printed Circuits
(AREA)
Abstract
SOLDER-BUMPING STRUCTURES PRODUCED BY A SOLDER BUMPING METHOD A method for solder bumping provides a substrate and forms a film on the substrate. The film has openings therethrough. A stencil is aligned on the film. The stencil has openings therethrough over the openings through the film. Solder paste is printed onto the substrate and into the openings through the stencil and the openings through the film. The solder paste is reflowed to form solder balls therefrom. The stencil and the film are then removed.
SG200804278-0A2004-12-092005-12-08Solder-bumping structures produced by a solder bumping method
SG144139A1
(en)