ATE355606T1 - Veränderbarer gasionenclusterstrahl zur glättung von oberflächen - Google Patents

Veränderbarer gasionenclusterstrahl zur glättung von oberflächen

Info

Publication number
ATE355606T1
ATE355606T1 AT00947375T AT00947375T ATE355606T1 AT E355606 T1 ATE355606 T1 AT E355606T1 AT 00947375 T AT00947375 T AT 00947375T AT 00947375 T AT00947375 T AT 00947375T AT E355606 T1 ATE355606 T1 AT E355606T1
Authority
AT
Austria
Prior art keywords
workpiece
gasion
modifiable
minimum
cluster jet
Prior art date
Application number
AT00947375T
Other languages
English (en)
Inventor
David B Fenner
Original Assignee
Epion Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epion Corp filed Critical Epion Corp
Application granted granted Critical
Publication of ATE355606T1 publication Critical patent/ATE355606T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/06Sources
    • H01J2237/08Ion sources
    • H01J2237/0812Ionized cluster beam [ICB] sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/31051Planarisation of the insulating layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321After treatment
    • H01L21/32115Planarisation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Physical Vapour Deposition (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
AT00947375T 1999-07-19 2000-07-14 Veränderbarer gasionenclusterstrahl zur glättung von oberflächen ATE355606T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14452499P 1999-07-19 1999-07-19
US09/412,949 US6375790B1 (en) 1999-07-19 1999-10-05 Adaptive GCIB for smoothing surfaces

Publications (1)

Publication Number Publication Date
ATE355606T1 true ATE355606T1 (de) 2006-03-15

Family

ID=26842080

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00947375T ATE355606T1 (de) 1999-07-19 2000-07-14 Veränderbarer gasionenclusterstrahl zur glättung von oberflächen

Country Status (6)

Country Link
US (2) US6375790B1 (de)
EP (1) EP1200980B8 (de)
JP (1) JP4799787B2 (de)
AT (1) ATE355606T1 (de)
DE (1) DE60033664T2 (de)
WO (1) WO2001006538A1 (de)

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US20070042580A1 (en) * 2000-08-10 2007-02-22 Amir Al-Bayati Ion implanted insulator material with reduced dielectric constant
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US7320734B2 (en) * 2000-08-11 2008-01-22 Applied Materials, Inc. Plasma immersion ion implantation system including a plasma source having low dissociation and low minimum plasma voltage
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US7183177B2 (en) * 2000-08-11 2007-02-27 Applied Materials, Inc. Silicon-on-insulator wafer transfer method using surface activation plasma immersion ion implantation for wafer-to-wafer adhesion enhancement
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Also Published As

Publication number Publication date
EP1200980A1 (de) 2002-05-02
DE60033664D1 (de) 2007-04-12
US6805807B2 (en) 2004-10-19
DE60033664T2 (de) 2008-02-07
JP4799787B2 (ja) 2011-10-26
WO2001006538A1 (en) 2001-01-25
US6375790B1 (en) 2002-04-23
EP1200980B8 (de) 2007-05-23
US20020139772A1 (en) 2002-10-03
EP1200980B1 (de) 2007-02-28
JP2003505867A (ja) 2003-02-12

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