ATE284760T1 - Verfahren zur herstellung von paste - Google Patents

Verfahren zur herstellung von paste

Info

Publication number
ATE284760T1
ATE284760T1 AT99937026T AT99937026T ATE284760T1 AT E284760 T1 ATE284760 T1 AT E284760T1 AT 99937026 T AT99937026 T AT 99937026T AT 99937026 T AT99937026 T AT 99937026T AT E284760 T1 ATE284760 T1 AT E284760T1
Authority
AT
Austria
Prior art keywords
paste
drawn
drawing pattern
lines
nozzle
Prior art date
Application number
AT99937026T
Other languages
English (en)
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18162859&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE284760(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Application granted granted Critical
Publication of ATE284760T1 publication Critical patent/ATE284760T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83194—Lateral distribution of the layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Die Bonding (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Glass Compositions (AREA)
AT99937026T 1998-11-13 1999-08-11 Verfahren zur herstellung von paste ATE284760T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32416798A JP3453075B2 (ja) 1998-11-13 1998-11-13 ペーストの形成方法
PCT/JP1999/004347 WO2000029128A1 (fr) 1998-11-13 1999-08-11 Procede de formation d'une pate

Publications (1)

Publication Number Publication Date
ATE284760T1 true ATE284760T1 (de) 2005-01-15

Family

ID=18162859

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99937026T ATE284760T1 (de) 1998-11-13 1999-08-11 Verfahren zur herstellung von paste

Country Status (10)

Country Link
US (1) US6861095B1 (de)
EP (1) EP1134034B1 (de)
JP (1) JP3453075B2 (de)
KR (1) KR100529687B1 (de)
CN (1) CN1154544C (de)
AT (1) ATE284760T1 (de)
DE (1) DE69922695T2 (de)
MY (1) MY121104A (de)
TW (1) TW568801B (de)
WO (1) WO2000029128A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3738596B2 (ja) * 1999-03-24 2006-01-25 松下電器産業株式会社 ペースト塗布装置およびペースト塗布方法
JP4277428B2 (ja) * 2000-07-18 2009-06-10 パナソニック株式会社 ボンディングペーストの塗布装置および塗布方法
DE10054159A1 (de) * 2000-11-02 2002-05-16 Wacker Siltronic Halbleitermat Verfahren zur Montage von Halbleiterscheiben
EP1306887A1 (de) * 2001-10-29 2003-05-02 Esec Trading S.A. Dispensdüse und Verfahren zum Auftragen von Klebstoff
JP4134888B2 (ja) * 2003-11-14 2008-08-20 松下電器産業株式会社 ペースト塗布装置およびペースト塗布方法
JP3798003B2 (ja) * 2004-02-05 2006-07-19 沖電気工業株式会社 ダイスボンド装置及びダイスボンド方法
US20050260789A1 (en) * 2004-05-21 2005-11-24 Texas Instruments Incorporated Method and system for applying an adhesive substance on an electronic device
JP4524585B2 (ja) * 2004-06-24 2010-08-18 ソニー株式会社 半導体装置および半導体装置の製造方法
TW200939407A (en) * 2008-03-13 2009-09-16 Chipmos Technologies Inc Multi-chip package structure and the method thereof
TWI468229B (zh) * 2008-09-26 2015-01-11 Shibaura Mechatronics Corp Coating apparatus and coating method
US20100233369A1 (en) * 2009-02-16 2010-09-16 Esec Ag Method Of Forming A Paste Pattern
JP2010197820A (ja) * 2009-02-26 2010-09-09 Sumitomo Chemical Co Ltd 偏光板の製造方法
JP4638556B2 (ja) * 2009-03-10 2011-02-23 積水化学工業株式会社 半導体チップ積層体の製造方法
CN102133568B (zh) * 2010-01-27 2014-01-29 比亚迪股份有限公司 一种用于触控面板的点胶方法及点胶图案
CH704254B1 (de) * 2010-12-22 2014-05-15 Esec Ag Verfahren zum Auftragen eines Klebstoffmusters auf ein Substrat mittels einer entlang einer vorbestimmten Bahn bewegbaren Schreibdüse.
JP6152248B2 (ja) * 2012-04-19 2017-06-21 ファスフォードテクノロジ株式会社 ペースト塗布装置及びペースト塗布方法並びにダイボンダ
JP6905444B2 (ja) * 2017-09-29 2021-07-21 シチズンファインデバイス株式会社 画像表示装置の製造方法
JP6577608B2 (ja) * 2018-01-09 2019-09-18 本田技研工業株式会社 樹脂補強金属部品の製造方法
JP7120119B2 (ja) * 2019-03-29 2022-08-17 日本電産株式会社 液剤塗布方法、液剤塗布機および液状ガスケット

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4156398A (en) * 1977-08-10 1979-05-29 Nordson Corporation Apparatus for applying a hot melt adhesive pattern to a moving substrate
JPS5670873A (en) * 1979-11-12 1981-06-13 Sekisui Prefab Homes Ltd Coating method of adhesive agent to plate
GB8316704D0 (en) * 1983-06-20 1983-07-20 Bondina Ltd Interlinings
US4803124A (en) * 1987-01-12 1989-02-07 Alphasem Corporation Bonding semiconductor chips to a mounting surface utilizing adhesive applied in starfish patterns
JPH0640555B2 (ja) * 1987-02-09 1994-05-25 株式会社東芝 ダイボンデイング装置
JPS6481294A (en) * 1987-09-22 1989-03-27 Juki Kk Method and apparatus for forming thick-film circuit
EP0378233B1 (de) * 1989-01-13 1994-12-28 Matsushita Electric Industrial Co., Ltd. Kleberzusammensetzung zur Verwendung beim Montieren von elektronischen Bauteilen und Verfahren zum Montieren von elektronischen Bauteilen auf eine Leiterplatte unter Verwendung des Klebers
JPH04237305A (ja) * 1991-01-22 1992-08-25 Matsushita Electric Ind Co Ltd 厚膜回路描画装置用のｎｃデータ作成方法
JPH0661276A (ja) * 1992-08-06 1994-03-04 Matsushita Electron Corp リードフレーム
US5415693A (en) * 1992-10-01 1995-05-16 Hitachi Techno Engineering Co., Ltd. Paste applicator
JP3074426B2 (ja) * 1993-04-19 2000-08-07 富士写真フイルム株式会社 接着剤の塗布方法
US5932012A (en) * 1995-06-23 1999-08-03 Hitachi Techno Engineering Co., Ltd. Paste applicator having positioning means
US5681757A (en) * 1996-04-29 1997-10-28 Microfab Technologies, Inc. Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process
JP3237544B2 (ja) * 1996-10-11 2001-12-10 富士通株式会社 平面表示パネルの製造方法及び平面表示パネル
JP2925074B2 (ja) * 1996-11-08 1999-07-26 三星電子株式会社 Ｌｏｃ型半導体チップパッケージ及びその製造方法
JP3841190B2 (ja) * 1996-11-08 2006-11-01 ソニー株式会社 液晶素子の製造方法、並びにその製造装置
JPH10221698A (ja) * 1997-02-04 1998-08-21 Seiko Epson Corp ペーストパターン形成装置および液晶パネル製造装置
EP0901155B1 (de) * 1997-09-05 2004-08-18 ESEC Trading SA Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat
US6348234B1 (en) * 1999-03-31 2002-02-19 Matsushita Electric Industrial Co., Ltd. Paste applying method

Also Published As

Publication number Publication date
EP1134034A4 (de) 2002-02-27
KR100529687B1 (ko) 2005-11-17
DE69922695T2 (de) 2005-12-01
EP1134034A1 (de) 2001-09-19
JP3453075B2 (ja) 2003-10-06
US6861095B1 (en) 2005-03-01
CN1154544C (zh) 2004-06-23
TW568801B (en) 2004-01-01
WO2000029128A1 (fr) 2000-05-25
CN1325326A (zh) 2001-12-05
KR20010090837A (ko) 2001-10-19
MY121104A (en) 2005-12-30
JP2000140742A (ja) 2000-05-23
DE69922695D1 (de) 2005-01-20
EP1134034B1 (de) 2004-12-15

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