ATE271577T1 - Wärmehärtbare harze aus maleinimiden und/oder vinylderivaten - Google Patents

Wärmehärtbare harze aus maleinimiden und/oder vinylderivaten

Info

Publication number
ATE271577T1
ATE271577T1 AT95933723T AT95933723T ATE271577T1 AT E271577 T1 ATE271577 T1 AT E271577T1 AT 95933723 T AT95933723 T AT 95933723T AT 95933723 T AT95933723 T AT 95933723T AT E271577 T1 ATE271577 T1 AT E271577T1
Authority
AT
Austria
Prior art keywords
maleimides
heat cured
resins made
cured resins
vinyl derivatives
Prior art date
Application number
AT95933723T
Other languages
English (en)
Inventor
Stephen M Dershem
Dennis B Patterson
Jose A Osuna Jr
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/300,721 external-priority patent/US6034194A/en
Application filed by Henkel Corp filed Critical Henkel Corp
Application granted granted Critical
Publication of ATE271577T1 publication Critical patent/ATE271577T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D207/00—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D207/02—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom
    • C07D207/44—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members
    • C07D207/444—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5
    • C07D207/448—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide
    • C07D207/452—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide with hydrocarbon radicals, substituted by hetero atoms, directly attached to the ring nitrogen atom
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D401/00—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom
    • C07D401/02—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings
    • C07D401/04—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings directly linked by a ring-member-to-ring-member bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/121—Preparatory processes from unsaturated precursors and polyamines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C09J179/085—Unsaturated polyimide precursors
AT95933723T 1994-09-02 1995-08-30 Wärmehärtbare harze aus maleinimiden und/oder vinylderivaten ATE271577T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/300,721 US6034194A (en) 1994-09-02 1994-09-02 Bismaleimide-divinyl adhesive compositions and uses therefor
US08/460,495 US6034195A (en) 1994-09-02 1995-06-02 Thermosetting resin compositions containing maleimide and/or vinyl compounds
PCT/US1995/011116 WO1996007691A2 (en) 1994-09-02 1995-08-30 Thermosetting resin compositions containing maleimide and/or vinyl compounds

Publications (1)

Publication Number Publication Date
ATE271577T1 true ATE271577T1 (de) 2004-08-15

Family

ID=26971936

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95933723T ATE271577T1 (de) 1994-09-02 1995-08-30 Wärmehärtbare harze aus maleinimiden und/oder vinylderivaten

Country Status (8)

Country Link
EP (4) EP1453087B1 (de)
JP (2) JPH10505599A (de)
CN (1) CN1158607A (de)
AT (1) ATE271577T1 (de)
AU (1) AU3626095A (de)
CA (1) CA2198745C (de)
DE (1) DE69533287T2 (de)
WO (1) WO1996007691A2 (de)

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EP1453087B1 (de) * 1994-09-02 2012-02-22 Henkel Corporation Mikro-elektronischer Aufbau
US5717034A (en) * 1996-07-29 1998-02-10 Quantum Materials, Inc. Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
US6121358A (en) * 1997-09-22 2000-09-19 The Dexter Corporation Hydrophobic vinyl monomers, formulations containing same, and uses therefor
US5856425A (en) * 1997-10-10 1999-01-05 Occidental Chemical Corporation Dispensable resin paste
US6350840B1 (en) 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
US6057381A (en) * 1998-07-02 2000-05-02 National Starch And Chemical Investment Holding Corporation Method of making an electronic component using reworkable underfill encapsulants
US6281314B1 (en) 1998-07-02 2001-08-28 National Starch And Chemical Investment Holding Corporation Compositions for use in the fabrication of circuit components and printed wire boards
SG105450A1 (en) 1998-07-02 2004-08-27 Nat Starch Chem Invest Allylated amide compounds and die attach adhesives prepared therefrom
US6063828A (en) * 1998-07-02 2000-05-16 National Starch And Chemical Investment Holding Corporation Underfill encapsulant compositions for use in electronic devices
US6316566B1 (en) 1998-07-02 2001-11-13 National Starch And Chemical Investment Holding Corporation Package encapsulant compositions for use in electronic devices
US6265530B1 (en) * 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
US6468448B1 (en) * 1999-10-22 2002-10-22 Matsushita Electric Industrial Co., Ltd. Conductive composition, conductive adhesive, and their mounting structure
US6521731B2 (en) * 2001-02-07 2003-02-18 Henkel Loctite Corporation Radical polymerizable compositions containing polycyclic olefins
US6806309B2 (en) * 2002-02-28 2004-10-19 Henkel Corporation Adhesive compositions containing organic spacers and methods for use thereof
US8513375B2 (en) 2003-05-05 2013-08-20 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
EP1620495A4 (de) * 2003-05-05 2006-06-14 Advanced Applied Adhesives Imidverknüpfte maleinimid- und polymaleinimidverbindungen
TWI359835B (en) * 2004-03-19 2012-03-11 Sumitomo Bakelite Co Resin composition and semiconductor device produce
US8431655B2 (en) 2007-04-09 2013-04-30 Designer Molecules, Inc. Curatives for epoxy compositions
US8541531B2 (en) 2008-03-21 2013-09-24 Designer Molecules, Inc. Anti-bleed compounds, compositions and methods for use thereof
JP5592081B2 (ja) * 2008-06-13 2014-09-17 ヘンケル コーポレイション 液晶滴下工法用シール剤および液晶表示装置の製造方法
US8637611B2 (en) 2008-08-13 2014-01-28 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
JP5446622B2 (ja) 2009-06-29 2014-03-19 住友電気工業株式会社 Ｉｉｉ族窒化物結晶およびその製造方法
CN101993435B (zh) * 2009-08-21 2013-04-24 华东理工大学 一种含***环和醚键的马来酰亚胺及其树脂的制备方法和用途
US8415812B2 (en) 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
JP5526700B2 (ja) * 2009-10-21 2014-06-18 三菱樹脂株式会社 ポリマレイミド系組成物
EP2584011B1 (de) 2010-06-16 2018-06-20 Konica Minolta Holdings, Inc. Tintenstrahltinte und tintenstrahl-abbildungsverfahren damit
US8686162B2 (en) 2010-08-25 2014-04-01 Designer Molecules Inc, Inc. Maleimide-functional monomers in amorphous form
JP2013083958A (ja) * 2011-09-26 2013-05-09 Nippon Steel & Sumikin Chemical Co Ltd 感光性樹脂組成物、それを用いた硬化物及び半導体素子
JP6303407B2 (ja) * 2012-12-03 2018-04-04 Jnc株式会社 硬化性組成物およびその用途
JP6293554B2 (ja) * 2014-03-31 2018-03-14 株式会社タムラ製作所 異方性導電性ペーストおよびそれを用いたプリント配線基板の製造方法
CN105754318B (zh) * 2014-12-19 2019-02-19 广东生益科技股份有限公司 一种热固性树脂组合物及其应用
KR20180029102A (ko) * 2015-08-08 2018-03-19 디자이너 몰러큘스, 인코퍼레이티드 음이온성 경화성 조성물
CN105111470B (zh) * 2015-08-13 2017-12-01 四川大学 一种可逆共价交联聚硅氧烷弹性体及其制备方法与应用
JP6423117B2 (ja) * 2017-01-17 2018-11-14 ユニチカ株式会社 ビスマレイミドの製造方法
JP7099700B2 (ja) 2017-06-19 2022-07-12 ユニチカ株式会社 ビスマレイミド変性体およびその製造方法
US20210070941A1 (en) * 2017-12-28 2021-03-11 Stratasys Ltd. Additive manufacturing employing solvent-free polyimide-containing formulations
JP2019189595A (ja) * 2018-04-24 2019-10-31 ユニチカ株式会社 ビスマレイミド溶液およびカルボジイミド変性ビスマレイミド
JP6555792B1 (ja) 2018-05-10 2019-08-07 ユニチカ株式会社 マレイミドの製造方法
CN109722209A (zh) * 2018-12-21 2019-05-07 东华大学 一种yasi有机酰亚胺硅胶及其制备方法
CN109722210A (zh) * 2018-12-21 2019-05-07 东华大学 一种tade型含硅胶粘剂及其制备方法
CN109722208A (zh) * 2018-12-21 2019-05-07 东华大学 一种12bdapb型含硅胶粘剂及其制备方法
CN109722211A (zh) * 2018-12-21 2019-05-07 东华大学 一种bdaddm型含硅胶粘剂及其制备方法

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JPS5353648A (en) * 1976-05-05 1978-05-16 Du Pont Preparation method of maleimide and dimaleimide
DE2853992A1 (de) * 1978-12-14 1980-07-03 Basf Ag Selbstverloeschende thermoplastische formmassen und formteile aus diesen
FR2469421A1 (fr) * 1979-11-09 1981-05-22 Rhone Poulenc Ind Procede d'encapsulation de composants electroniques a l'aide d'une matiere moulable a base d'un prepolymere thermodurcissable
WO1987003871A1 (en) * 1985-12-26 1987-07-02 Mitsui Toatsu Chemicals, Incorporated Aromatic bismaleimido compounds and process for their preparation
DE3622088A1 (de) * 1986-07-02 1988-01-07 Basf Ag Flexible bismaleinimide
EP0318162A3 (de) * 1987-11-25 1990-11-07 Texaco Development Corporation Bismaleinimid-Derivate
JP2651687B2 (ja) * 1988-01-22 1997-09-10 コニカ株式会社 湿し水不要平版印刷版材料
JPH01230612A (ja) * 1988-03-11 1989-09-14 Nippon Oil & Fats Co Ltd 新規なビニル系ブロックポリマーおよびその製造法
EP0357110A1 (de) * 1988-08-05 1990-03-07 Akzo N.V. Zwei-Komponenten-Anstrichmasse, härtbar bei Zimmertemperatur durch eine Diels-Alder-Reaktion
JP2718156B2 (ja) * 1989-03-20 1998-02-25 日立化成工業株式会社 耐熱性接着剤組成物
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EP1453087B1 (de) * 1994-09-02 2012-02-22 Henkel Corporation Mikro-elektronischer Aufbau

Also Published As

Publication number Publication date
EP0778857B1 (de) 2004-07-21
CA2198745A1 (en) 1996-03-14
CA2198745C (en) 2009-11-24
JP2008013772A (ja) 2008-01-24
CN1158607A (zh) 1997-09-03
EP1453087B1 (de) 2012-02-22
WO1996007691A2 (en) 1996-03-14
EP1344789A2 (de) 2003-09-17
EP1359144A1 (de) 2003-11-05
EP0778857A2 (de) 1997-06-18
AU3626095A (en) 1996-03-27
JPH10505599A (ja) 1998-06-02
WO1996007691A3 (en) 1996-08-15
EP1453087A1 (de) 2004-09-01
DE69533287T2 (de) 2005-08-25
EP1344789A3 (de) 2004-01-02
DE69533287D1 (de) 2004-08-26

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties