AT517639A5 - Vorrichtung und Verfahren zum Bonden - Google Patents
Vorrichtung und Verfahren zum BondenInfo
- Publication number
- AT517639A5 AT517639A5 ATA9382/2013A AT93822013A AT517639A5 AT 517639 A5 AT517639 A5 AT 517639A5 AT 93822013 A AT93822013 A AT 93822013A AT 517639 A5 AT517639 A5 AT 517639A5
- Authority
- AT
- Austria
- Prior art keywords
- substrate
- bonding
- bonding layer
- admission
- relates
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 7
- 230000002093 peripheral effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1028—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina by bending, drawing or stretch forming sheet to assume shape of configured lamina while in contact therewith
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
Abstract
Die vorliegende Erfindung betrifft eine Vorrichtung zum Bonden eines zweiten Substrats (5) auf ein erstes Substrat (2) mit folgenden Merkmalen: - einer Aufnahmeeinrichtung (l) zur Aufnahme des mit einer Bondschicht (3) beschichteten ersten Substrats (2) und des auf der Bondschicht (3) aufgenommenen zweiten Substrats (5), - einer Beaufschlagungseinrichtung zur Beaufschlagung des zweiten Substrats (5) an einer zur Bondschicht (3) abgewandten Beaufschlagungsseite (So) des zweiten Substrats (5) mit einer Bondkraft ausgehend von einer innerhalb einer Randzone R der Beaufschlagungsseite (So) liegenden AusgangszoneAbis zur Beaufschlagung der ganzen Beaufschlagungsseite (5o). Weiterhin betrifft die vorliegende Erfindung ein korrespondierendes Verfahren.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ATGM8036/2019U AT16646U1 (de) | 2012-11-21 | 2013-11-05 | Vorrichtung und Verfahren zum Bonden |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012111246.0A DE102012111246A1 (de) | 2012-11-21 | 2012-11-21 | Vorrichtung und Verfahren zum Bonden |
PCT/EP2013/072995 WO2014079677A1 (de) | 2012-11-21 | 2013-11-05 | Vorrichtung und verfahren zum bonden |
Publications (1)
Publication Number | Publication Date |
---|---|
AT517639A5 true AT517639A5 (de) | 2017-03-15 |
Family
ID=49518965
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ATA9382/2013A AT517639A5 (de) | 2012-11-21 | 2013-11-05 | Vorrichtung und Verfahren zum Bonden |
ATGM8036/2019U AT16646U1 (de) | 2012-11-21 | 2013-11-05 | Vorrichtung und Verfahren zum Bonden |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ATGM8036/2019U AT16646U1 (de) | 2012-11-21 | 2013-11-05 | Vorrichtung und Verfahren zum Bonden |
Country Status (8)
Country | Link |
---|---|
US (1) | US10943810B2 (de) |
JP (1) | JP6053946B2 (de) |
KR (1) | KR102211333B1 (de) |
CN (1) | CN104781921B (de) |
AT (2) | AT517639A5 (de) |
DE (1) | DE102012111246A1 (de) |
TW (1) | TWI636512B (de) |
WO (1) | WO2014079677A1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118098938A (zh) | 2016-03-22 | 2024-05-28 | Ev 集团 E·索尔纳有限责任公司 | 用于衬底的接合的装置和方法 |
US10872874B2 (en) * | 2018-02-26 | 2020-12-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bonding apparatus and method of bonding substrates |
US10770421B2 (en) * | 2018-12-29 | 2020-09-08 | Micron Technology, Inc. | Bond chucks having individually-controllable regions, and associated systems and methods |
TWI802956B (zh) * | 2021-08-11 | 2023-05-21 | 日商雅馬哈智能機器控股股份有限公司 | 部材間接合裝置以及接合部材製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0256150A1 (de) * | 1986-08-13 | 1988-02-24 | Kabushiki Kaisha Toshiba | Apparat zum Zusammenfügen von Halbleiterscheiben |
EP0899778A2 (de) * | 1997-08-27 | 1999-03-03 | Canon Kabushiki Kaisha | Vorrichtung und Verfahren zur Zusammenpressung von zwei Substraten |
US20080279659A1 (en) * | 2007-05-07 | 2008-11-13 | Lintec Corporation | Transferring device and transferring method |
US20120103533A1 (en) * | 2010-10-29 | 2012-05-03 | Tokyo Electron Limited | Bonding apparatus and bonding method |
US20120186741A1 (en) * | 2011-01-26 | 2012-07-26 | Aptina Imaging Corporation | Apparatus for wafer-to-wafer bonding |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2945089B2 (ja) * | 1990-07-05 | 1999-09-06 | 古河電気工業株式会社 | ウエハへのテープ貼付装置 |
JPH0582493A (ja) * | 1991-03-11 | 1993-04-02 | Hitachi Ltd | ウエハ接着装置およびその装置を用いたウエハの接着方法 |
JP2910334B2 (ja) * | 1991-07-22 | 1999-06-23 | 富士電機株式会社 | 接合方法 |
JP2678161B2 (ja) * | 1991-10-30 | 1997-11-17 | 九州電子金属 株式会社 | 半導体ウエーハの真空貼着装置 |
JPH09320913A (ja) * | 1996-05-30 | 1997-12-12 | Nec Kansai Ltd | ウェーハ貼り付け方法及びその装置 |
SG71182A1 (en) * | 1997-12-26 | 2000-03-21 | Canon Kk | Substrate processing apparatus substrate support apparatus substrate processing method and substrate manufacturing method |
JP4051125B2 (ja) * | 1998-03-25 | 2008-02-20 | 不二越機械工業株式会社 | ウェーハの接着装置 |
JP4614626B2 (ja) * | 2003-02-05 | 2011-01-19 | 東京エレクトロン株式会社 | 薄肉半導体チップの製造方法 |
JP5281739B2 (ja) * | 2006-07-18 | 2013-09-04 | 新光電気工業株式会社 | 陽極接合装置 |
JP4841412B2 (ja) | 2006-12-06 | 2011-12-21 | 日東電工株式会社 | 基板貼合せ装置 |
DE102006058493B4 (de) * | 2006-12-12 | 2012-03-22 | Erich Thallner | Verfahren und Vorrichtung zum Bonden von Wafern |
JP2008182016A (ja) | 2007-01-24 | 2008-08-07 | Tokyo Electron Ltd | 貼り合わせ装置、貼り合わせ方法 |
KR20100043478A (ko) * | 2008-10-20 | 2010-04-29 | 삼성전기주식회사 | 정전 척 및 이를 구비한 기판 접합 장치 |
DE102008044200B4 (de) * | 2008-11-28 | 2012-08-23 | Thin Materials Ag | Bonding-Verfahren |
DE102009018977A1 (de) | 2009-04-25 | 2010-11-04 | Ev Group Gmbh | Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers |
EP2706562A3 (de) | 2009-09-01 | 2014-09-03 | EV Group GmbH | Vorrichtung und Verfahren zum Ablösen eines Halbleiterwafers von einem Trägersubstrat mittels Kippens eines Filmrahmens |
-
2012
- 2012-11-21 DE DE102012111246.0A patent/DE102012111246A1/de active Pending
-
2013
- 2013-11-05 JP JP2015543367A patent/JP6053946B2/ja active Active
- 2013-11-05 US US14/443,792 patent/US10943810B2/en active Active
- 2013-11-05 AT ATA9382/2013A patent/AT517639A5/de active IP Right Grant
- 2013-11-05 AT ATGM8036/2019U patent/AT16646U1/de not_active IP Right Cessation
- 2013-11-05 KR KR1020157012186A patent/KR102211333B1/ko active IP Right Grant
- 2013-11-05 CN CN201380060936.7A patent/CN104781921B/zh active Active
- 2013-11-05 WO PCT/EP2013/072995 patent/WO2014079677A1/de active Application Filing
- 2013-11-21 TW TW102142504A patent/TWI636512B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0256150A1 (de) * | 1986-08-13 | 1988-02-24 | Kabushiki Kaisha Toshiba | Apparat zum Zusammenfügen von Halbleiterscheiben |
EP0899778A2 (de) * | 1997-08-27 | 1999-03-03 | Canon Kabushiki Kaisha | Vorrichtung und Verfahren zur Zusammenpressung von zwei Substraten |
US20080279659A1 (en) * | 2007-05-07 | 2008-11-13 | Lintec Corporation | Transferring device and transferring method |
US20120103533A1 (en) * | 2010-10-29 | 2012-05-03 | Tokyo Electron Limited | Bonding apparatus and bonding method |
US20120186741A1 (en) * | 2011-01-26 | 2012-07-26 | Aptina Imaging Corporation | Apparatus for wafer-to-wafer bonding |
Also Published As
Publication number | Publication date |
---|---|
TW201438116A (zh) | 2014-10-01 |
KR102211333B1 (ko) | 2021-02-03 |
JP6053946B2 (ja) | 2016-12-27 |
KR20150088248A (ko) | 2015-07-31 |
AT16646U1 (de) | 2020-04-15 |
JP2016504760A (ja) | 2016-02-12 |
DE102012111246A1 (de) | 2014-05-22 |
US20150279715A1 (en) | 2015-10-01 |
US10943810B2 (en) | 2021-03-09 |
WO2014079677A1 (de) | 2014-05-30 |
CN104781921A (zh) | 2015-07-15 |
TWI636512B (zh) | 2018-09-21 |
CN104781921B (zh) | 2017-11-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UW | Change of intellectual property right |
Effective date: 20240615 |