AT517639A5 - Vorrichtung und Verfahren zum Bonden - Google Patents

Vorrichtung und Verfahren zum Bonden

Info

Publication number
AT517639A5
AT517639A5 ATA9382/2013A AT93822013A AT517639A5 AT 517639 A5 AT517639 A5 AT 517639A5 AT 93822013 A AT93822013 A AT 93822013A AT 517639 A5 AT517639 A5 AT 517639A5
Authority
AT
Austria
Prior art keywords
substrate
bonding
bonding layer
admission
relates
Prior art date
Application number
ATA9382/2013A
Other languages
English (en)
Inventor
Burggraf Jürgen
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Priority to ATGM8036/2019U priority Critical patent/AT16646U1/de
Publication of AT517639A5 publication Critical patent/AT517639A5/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1028—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina by bending, drawing or stretch forming sheet to assume shape of configured lamina while in contact therewith

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)

Abstract

Die vorliegende Erfindung betrifft eine Vorrichtung zum Bonden eines zweiten Substrats (5) auf ein erstes Substrat (2) mit folgenden Merkmalen: - einer Aufnahmeeinrichtung (l) zur Aufnahme des mit einer Bondschicht (3) beschichteten ersten Substrats (2) und des auf der Bondschicht (3) aufgenommenen zweiten Substrats (5), - einer Beaufschlagungseinrichtung zur Beaufschlagung des zweiten Substrats (5) an einer zur Bondschicht (3) abgewandten Beaufschlagungsseite (So) des zweiten Substrats (5) mit einer Bondkraft ausgehend von einer innerhalb einer Randzone R der Beaufschlagungsseite (So) liegenden AusgangszoneAbis zur Beaufschlagung der ganzen Beaufschlagungsseite (5o). Weiterhin betrifft die vorliegende Erfindung ein korrespondierendes Verfahren.
ATA9382/2013A 2012-11-21 2013-11-05 Vorrichtung und Verfahren zum Bonden AT517639A5 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ATGM8036/2019U AT16646U1 (de) 2012-11-21 2013-11-05 Vorrichtung und Verfahren zum Bonden

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012111246.0A DE102012111246A1 (de) 2012-11-21 2012-11-21 Vorrichtung und Verfahren zum Bonden
PCT/EP2013/072995 WO2014079677A1 (de) 2012-11-21 2013-11-05 Vorrichtung und verfahren zum bonden

Publications (1)

Publication Number Publication Date
AT517639A5 true AT517639A5 (de) 2017-03-15

Family

ID=49518965

Family Applications (2)

Application Number Title Priority Date Filing Date
ATA9382/2013A AT517639A5 (de) 2012-11-21 2013-11-05 Vorrichtung und Verfahren zum Bonden
ATGM8036/2019U AT16646U1 (de) 2012-11-21 2013-11-05 Vorrichtung und Verfahren zum Bonden

Family Applications After (1)

Application Number Title Priority Date Filing Date
ATGM8036/2019U AT16646U1 (de) 2012-11-21 2013-11-05 Vorrichtung und Verfahren zum Bonden

Country Status (8)

Country Link
US (1) US10943810B2 (de)
JP (1) JP6053946B2 (de)
KR (1) KR102211333B1 (de)
CN (1) CN104781921B (de)
AT (2) AT517639A5 (de)
DE (1) DE102012111246A1 (de)
TW (1) TWI636512B (de)
WO (1) WO2014079677A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118098938A (zh) 2016-03-22 2024-05-28 Ev 集团 E·索尔纳有限责任公司 用于衬底的接合的装置和方法
US10872874B2 (en) * 2018-02-26 2020-12-22 Taiwan Semiconductor Manufacturing Company, Ltd. Bonding apparatus and method of bonding substrates
US10770421B2 (en) * 2018-12-29 2020-09-08 Micron Technology, Inc. Bond chucks having individually-controllable regions, and associated systems and methods
TWI802956B (zh) * 2021-08-11 2023-05-21 日商雅馬哈智能機器控股股份有限公司 部材間接合裝置以及接合部材製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0256150A1 (de) * 1986-08-13 1988-02-24 Kabushiki Kaisha Toshiba Apparat zum Zusammenfügen von Halbleiterscheiben
EP0899778A2 (de) * 1997-08-27 1999-03-03 Canon Kabushiki Kaisha Vorrichtung und Verfahren zur Zusammenpressung von zwei Substraten
US20080279659A1 (en) * 2007-05-07 2008-11-13 Lintec Corporation Transferring device and transferring method
US20120103533A1 (en) * 2010-10-29 2012-05-03 Tokyo Electron Limited Bonding apparatus and bonding method
US20120186741A1 (en) * 2011-01-26 2012-07-26 Aptina Imaging Corporation Apparatus for wafer-to-wafer bonding

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2945089B2 (ja) * 1990-07-05 1999-09-06 古河電気工業株式会社 ウエハへのテープ貼付装置
JPH0582493A (ja) * 1991-03-11 1993-04-02 Hitachi Ltd ウエハ接着装置およびその装置を用いたウエハの接着方法
JP2910334B2 (ja) * 1991-07-22 1999-06-23 富士電機株式会社 接合方法
JP2678161B2 (ja) * 1991-10-30 1997-11-17 九州電子金属 株式会社 半導体ウエーハの真空貼着装置
JPH09320913A (ja) * 1996-05-30 1997-12-12 Nec Kansai Ltd ウェーハ貼り付け方法及びその装置
SG71182A1 (en) * 1997-12-26 2000-03-21 Canon Kk Substrate processing apparatus substrate support apparatus substrate processing method and substrate manufacturing method
JP4051125B2 (ja) * 1998-03-25 2008-02-20 不二越機械工業株式会社 ウェーハの接着装置
JP4614626B2 (ja) * 2003-02-05 2011-01-19 東京エレクトロン株式会社 薄肉半導体チップの製造方法
JP5281739B2 (ja) * 2006-07-18 2013-09-04 新光電気工業株式会社 陽極接合装置
JP4841412B2 (ja) 2006-12-06 2011-12-21 日東電工株式会社 基板貼合せ装置
DE102006058493B4 (de) * 2006-12-12 2012-03-22 Erich Thallner Verfahren und Vorrichtung zum Bonden von Wafern
JP2008182016A (ja) 2007-01-24 2008-08-07 Tokyo Electron Ltd 貼り合わせ装置、貼り合わせ方法
KR20100043478A (ko) * 2008-10-20 2010-04-29 삼성전기주식회사 정전 척 및 이를 구비한 기판 접합 장치
DE102008044200B4 (de) * 2008-11-28 2012-08-23 Thin Materials Ag Bonding-Verfahren
DE102009018977A1 (de) 2009-04-25 2010-11-04 Ev Group Gmbh Vorrichtung zur Ausrichtung und Vorfixierung eines Wafers
EP2706562A3 (de) 2009-09-01 2014-09-03 EV Group GmbH Vorrichtung und Verfahren zum Ablösen eines Halbleiterwafers von einem Trägersubstrat mittels Kippens eines Filmrahmens

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0256150A1 (de) * 1986-08-13 1988-02-24 Kabushiki Kaisha Toshiba Apparat zum Zusammenfügen von Halbleiterscheiben
EP0899778A2 (de) * 1997-08-27 1999-03-03 Canon Kabushiki Kaisha Vorrichtung und Verfahren zur Zusammenpressung von zwei Substraten
US20080279659A1 (en) * 2007-05-07 2008-11-13 Lintec Corporation Transferring device and transferring method
US20120103533A1 (en) * 2010-10-29 2012-05-03 Tokyo Electron Limited Bonding apparatus and bonding method
US20120186741A1 (en) * 2011-01-26 2012-07-26 Aptina Imaging Corporation Apparatus for wafer-to-wafer bonding

Also Published As

Publication number Publication date
TW201438116A (zh) 2014-10-01
KR102211333B1 (ko) 2021-02-03
JP6053946B2 (ja) 2016-12-27
KR20150088248A (ko) 2015-07-31
AT16646U1 (de) 2020-04-15
JP2016504760A (ja) 2016-02-12
DE102012111246A1 (de) 2014-05-22
US20150279715A1 (en) 2015-10-01
US10943810B2 (en) 2021-03-09
WO2014079677A1 (de) 2014-05-30
CN104781921A (zh) 2015-07-15
TWI636512B (zh) 2018-09-21
CN104781921B (zh) 2017-11-28

Similar Documents

Publication Publication Date Title
SG11201901050SA (en) Method and device for aligning substrates
AT506622A3 (de) Vorrichtung und verfahren zum aufbringen und/oder ablösen eines wafers auf einen/von einem träger
IL232700B (en) Inspection method and facility, and lithography facility accordingly
WO2014170435A8 (en) Methods and pharmaceutical compositions for inhibiting lymphocyte proliferation in a subject in need thereof
AT517639A5 (de) Vorrichtung und Verfahren zum Bonden
EP2106903A8 (de) Verfahren zum Aufstreuen abriebhemmender Werkstoffe und Vorrichtung hierzu
AT519840A5 (de) Vorrichtung und Verfahren zum Lösen eines ersten Substrats
MY165130A (en) Surface defect inspecting device and method for hot-dip coated steel sheets
WO2015101461A3 (en) Method and apparatus for design of a metrology target
GB2504022A (en) Surface preparation
EP2408012A3 (de) Solarzelle, Solarzellenherstellungsverfahren und Prüfverfahren
EA201791640A1 (ru) Продукт на основе волокна
IN2014DN09953A (de)
EP2612746A3 (de) Vorrichtung zur schichtweisen Herstellung von dreidimensionalen Objekten mittels rotierendem Auftrag
EP2922003A3 (de) Extrationsverfahren, empfehlungsverfahren, informationsverarbeitungsvorrichtung und verfahren zur entscheidungsunterstützung bei strassenreparaturverfahren
EP2642326A3 (de) Automatische Kalibrierung eines Mikroskop-Scanningsystems
EP2727849A3 (de) Vorrichtung und Verfahren zum Ausstatten von Behältern mit Klebeetiketten
EP3333712A3 (de) Simultane mehrplattformprüfung
AT516292A3 (de) Verfahren zum Beschichten eines Substrats mit einem Lack sowie Vorrichtung zum Planarisieren einer Lackschicht
UY35950A (es) Un método y un aparato para separar una fracción de partícula de lignocelulosa y una fracción de partícula de lignina, una composición de partícula de lignina, una composición de partícula de lignocelulosa y su uso
AT520565A5 (de) Vorrichtung und Verfahren zum Beschichten eines Substrats
AT518738A5 (de) Verfahren zum Bonden von Substraten
AT525618A5 (de) Verfahren zum Beschichten und Bonden von Substraten
BR112018072171A2 (pt) Processo para preparar uma composição x, composição x,processo para produzir um revestimento em um substrato, e, substrato
EP2607728A3 (de) Verfahren zum Herstellen eines Linearschienensystems und Kombinationsprodukt eines Linearschienensystems

Legal Events

Date Code Title Description
UW Change of intellectual property right

Effective date: 20240615