AT380993B - Vorrichtung zur befestigung von schaltungselementen an einer leiterplatte fuer gedruckte schaltungen - Google Patents

Vorrichtung zur befestigung von schaltungselementen an einer leiterplatte fuer gedruckte schaltungen

Info

Publication number
AT380993B
AT380993B AT0238881A AT238881A AT380993B AT 380993 B AT380993 B AT 380993B AT 0238881 A AT0238881 A AT 0238881A AT 238881 A AT238881 A AT 238881A AT 380993 B AT380993 B AT 380993B
Authority
AT
Austria
Prior art keywords
printed circuits
fastening
circuit board
circuit elements
circuit
Prior art date
Application number
AT0238881A
Other languages
English (en)
Other versions
ATA238881A (de
Original Assignee
Tdk Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7275380A external-priority patent/JPS571240A/ja
Priority claimed from JP7929680U external-priority patent/JPS574275U/ja
Priority claimed from JP16450980U external-priority patent/JPS6311755Y2/ja
Priority claimed from JP1980164510U external-priority patent/JPS6311759Y2/ja
Priority claimed from JP1980164813U external-priority patent/JPS6311757Y2/ja
Application filed by Tdk Electronics Co Ltd filed Critical Tdk Electronics Co Ltd
Publication of ATA238881A publication Critical patent/ATA238881A/de
Application granted granted Critical
Publication of AT380993B publication Critical patent/AT380993B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y10S156/942—Means for delaminating semiconductive product with reorientation means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y10T156/1768—Means simultaneously conveying plural articles from a single source and serially presenting them to an assembly station
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y10T156/1768—Means simultaneously conveying plural articles from a single source and serially presenting them to an assembly station
    • Y10T156/1771—Turret or rotary drum-type conveyor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/5317—Laminated device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53435—Means to assemble or disassemble including assembly pallet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
AT0238881A 1980-06-02 1981-05-27 Vorrichtung zur befestigung von schaltungselementen an einer leiterplatte fuer gedruckte schaltungen AT380993B (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP7275380A JPS571240A (en) 1980-06-02 1980-06-02 Equipping machine of chip type electronic parts
JP7929680U JPS574275U (de) 1980-06-09 1980-06-09
JP16450980U JPS6311755Y2 (de) 1980-11-17 1980-11-17
JP1980164510U JPS6311759Y2 (de) 1980-11-17 1980-11-17
JP1980164813U JPS6311757Y2 (de) 1980-11-19 1980-11-19

Publications (2)

Publication Number Publication Date
ATA238881A ATA238881A (de) 1985-12-15
AT380993B true AT380993B (de) 1986-08-11

Family

ID=27524405

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0238881A AT380993B (de) 1980-06-02 1981-05-27 Vorrichtung zur befestigung von schaltungselementen an einer leiterplatte fuer gedruckte schaltungen

Country Status (10)

Country Link
US (1) US4372802A (de)
AT (1) AT380993B (de)
AU (1) AU541607B2 (de)
CA (1) CA1165462A (de)
CH (1) CH656772A5 (de)
DE (1) DE3121716A1 (de)
FR (1) FR2483701A1 (de)
GB (1) GB2076709B (de)
IT (1) IT1136632B (de)
NL (1) NL8102679A (de)

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JP2773307B2 (ja) * 1989-10-17 1998-07-09 松下電器産業株式会社 電子部品の実装方法
JPH0710493Y2 (ja) * 1991-02-05 1995-03-08 株式会社エンヤシステム ウエーハ貼付板
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US5397423A (en) * 1993-05-28 1995-03-14 Kulicke & Soffa Industries Multi-head die bonding system
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JP3313224B2 (ja) * 1994-01-25 2002-08-12 松下電器産業株式会社 電子部品実装装置
JP2941658B2 (ja) * 1994-07-08 1999-08-25 株式会社三協精機製作所 電子部品表面実装装置
JPH08162797A (ja) * 1994-12-08 1996-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
US5957326A (en) * 1995-03-13 1999-09-28 Ostgaard; John T. Apparatus for retrieving randomly organized articles
JP3132353B2 (ja) * 1995-08-24 2001-02-05 松下電器産業株式会社 チップの搭載装置および搭載方法
US5649356A (en) * 1995-09-22 1997-07-22 Universal Instruments Corporation Method and apparatus for supplying and placing components
JP3387881B2 (ja) * 1999-03-17 2003-03-17 ティーディーケイ株式会社 電子部品挿入ヘッドおよび電子部品挿入装置
US6192576B1 (en) * 1999-06-15 2001-02-27 Advanced Micro Devices, Inc. Mechanism for loading a respective fuzz button into each of a high number of button holes within an IC contactor
US7052225B2 (en) * 2001-12-12 2006-05-30 Intel Corporation Apparatus for handling mass produced work pieces
DE10203601A1 (de) * 2002-01-30 2003-08-14 Siemens Ag Chipentnahmevorrichtung, Chipentnahmesystem, Bestücksystem und Verfahren zum Entnehmen von Chips von einem Wafer
JP4691217B2 (ja) * 2004-09-22 2011-06-01 株式会社 ハリーズ 搬送装置
CN101018722B (zh) * 2004-09-22 2011-09-07 哈里斯股份有限公司 转移装置
DE102015013495B4 (de) * 2015-10-16 2018-04-26 Mühlbauer Gmbh & Co. Kg Empfangseinrichtung für Bauteile und Verfahren zum Entnehmen fehlerhafter Bauteile aus dieser

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JPS55118698A (en) * 1979-03-05 1980-09-11 Matsushita Electric Ind Co Ltd Device for mounting electronic part
FR2457057A1 (fr) * 1979-05-14 1980-12-12 Jaz Sa Dispositif pour le montage de circuits integres sur une plaque de circuit imprime
JPS55165643A (en) * 1979-06-12 1980-12-24 Fujitsu Ltd Device for bonding pellet

Also Published As

Publication number Publication date
CH656772A5 (de) 1986-07-15
IT8122101A0 (it) 1981-06-02
FR2483701B1 (de) 1984-05-04
US4372802A (en) 1983-02-08
NL8102679A (nl) 1982-01-04
ATA238881A (de) 1985-12-15
DE3121716A1 (de) 1982-02-25
AU7125581A (en) 1981-12-10
FR2483701A1 (fr) 1981-12-04
GB2076709A (en) 1981-12-09
IT1136632B (it) 1986-09-03
CA1165462A (en) 1984-04-10
AU541607B2 (en) 1985-01-10
GB2076709B (en) 1983-10-26

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